Terrence E. Zavecz Weir TR Temporal and Sequential Data Analysis and Performance Matching Interfaces of Thermal, Probe and CD Uniformity data Data Loading speed increase 5x to 8x Improved wafer modeling Improved intra-site data interpolation Wafer-Contour plot speed improvement 12x to 20x Improvements with Release 2.0

Yield Enhancement thru Modeling TEA Systems Product Features Weir TR Sequence & Weir TR Matching oRequires Weir TR version 2.0 or later. oProduct has two interfaces  Weir TR; Sequence Analysis Weir TR; Sequence Analysis  Time dependent analysis of Temperature or any metrology variable  Derives critical phase elements of the cycle  Weir TR: Matching Weir TR: Matching  Two dataset/system matching of  Thermal-to-Thermal  Thermal-to-Metrology  Metrology-to-Metrology  Can use Weir TR Temporal Analysis calculated variables  Example:  Cumulative-Energy vs feature size  Match any metrology, probe or sequence data Weir TR Range response by sensor over time Weir TR: Matching Temperature-to-BCD Feature

Yield Enhancement thru Modeling TEA Systems Weir TR Time Response Analysis Data sources Accept sequenced or time based data from any metrology source Clean-Track, Develop & In-line Data Scanner log and metrology Metrology & Probe Data CD-SEM and Scatter Wafer & Substrate Sensor Weir PW Process Derived Analyses & Variables

Yield Enhancement thru Modeling TEA Systems Weir TR Temporal Analysis Product Features  Weir TR; Temporal Analysis  Time or Sequence dependent analysis of Temperature or any metrology variable  Automated time-phase deconvolution of constant and rise/fall segments  Energy or (Time* Temperature) calculation with temperature threshold  Local velocity or rate-calculations of rate of local change with time  Automated whole-substrate or individual sensor response  Critical cycle-point analysis  Substrate contour mapping/vectoring  Matrix display  Single time-slice  Animation of contour response  Variables used and derived include temperature, rate-of-change, acceleration-of- change, Energy, Cumulative Energy Sensor change-rate vs Temperature

Yield Enhancement thru Modeling TEA Systems Thermal response ranges Displays variation at each sensor relative to average temperature of wafer

Yield Enhancement thru Modeling TEA Systems Average times for each phase Data is saved in Weir Data Workbook

Yield Enhancement thru Modeling TEA Systems Automated Phase Deconvolution Statistics show four thresholds which are plotted as yellow- filled squares. Range of data across time is plotted by blue circles Max Temp Min Temp Phase change Range

Yield Enhancement thru Modeling TEA Systems Critical phase evaluation by sensor point Customize the sampling or graphic to zoom-in on time/sequence critical segments

Yield Enhancement thru Modeling TEA Systems Cumulative Energy Integrated energy at each sensor shown  and the phase in which it occurred Graphics are provided by:  Sensor/phase  Rise time/sensor & phase  Substrate Response as a function of Radius Integrated energy at each sensor shown  and the phase in which it occurred Graphics are provided by:  Sensor/phase  Rise time/sensor & phase  Substrate Response as a function of Radius Graphics selection interface tabs

Yield Enhancement thru Modeling TEA Systems Temperature Mean, Rise, Phase Length, Start Value

Yield Enhancement thru Modeling TEA Systems Local Rate Change Variation Local Rate Change plotted at 8 times over critical final rise Notice initial rise on left side of wafer at 2295 seconds with a slope range from to dec/sec rise

Yield Enhancement thru Modeling TEA Systems Vector/Contour mapping of user selected time-slices Three vector plots of accumulated energy

Yield Enhancement thru Modeling TEA Systems Local Acceleration, Temperature & Rate-of-Change Data taken at 2370 seconds

Yield Enhancement thru Modeling TEA Systems Localized Rise/Fall Plot vs Variable Details process-critical response to any variable such as temperature Raw Temp vs Time Cycle Mouse-zoomed response at critical settling point

Yield Enhancement thru Modeling TEA Systems Threshold Analysis data Data from the “RiseTimesPhase” worksheet for 16 sensors Transition points are marked on the thermal curve as black squares with a yellow center (previous slide) Data stored on Weir TR Spreadsheet in data workbook Temperature variation

Yield Enhancement thru Modeling TEA Systems Separate window display of Thermal variation Matrix view Animation also provided

Yield Enhancement thru Modeling TEA Systems Weir TR Matching Product Features  Weir TR; Matching  Match any two Temporal/Metrology/Log sources  Match Bake, Temperature,Cumulative Energy, Process etc uniformity  Infinitely-Variable Rotation and Notch Alignment Controls  Features Includes:  Automated data culling  Histograms, contour, vector, XY, etc plots.  Individual time-slice or integrated analysis  Model across-wafer variation  User-customized graphics  Easy plot/copy into reports/html interfaces  Reports and data stored in standardized workbook format Across-Wafer Modeled Bottom CD Variation Across two Bake Plates (Scatter data)

Yield Enhancement thru Modeling TEA Systems Weir TR Time Response Analysis Data sources Any metrology, sequenced or log based data Clean-Track, Develop & In-line Data Scanner log and metrology Metrology & Probe Data CD-SEM and Scatter Wafer & Substrate Sensor Weir PW Process Derived Analyses & Variables Weir TR Temporal Analysis Variables

Yield Enhancement thru Modeling TEA Systems Basic Operation of Weir TR Matching Wafers from two separate bake plates shown Provides a basic visual & statistical match comparison Covariance matching over time/space Compare static or sequential data  For example; Bottom CD to Temperature or Cumulative Energy on the substrate

Yield Enhancement thru Modeling TEA Systems Variable Culling BCD based culling removed 309 data points to properly display wafer-graphic shown on left Easily removed Intra-Field variation and improves accuracy Original BCD data distribution Command used to generate histogram And then apply the wafer model

Yield Enhancement thru Modeling TEA Systems Individual graphics Comparison of BCD variation for wafers generated on two separate hot- plate Post Exposure Bakes

Yield Enhancement thru Modeling TEA Systems Variation by X-location on wafer Vector Contour Radial XY Horizontal XY Vertical VS Time/sequence Data here not modeled, this is raw data

Yield Enhancement thru Modeling TEA Systems Modeled wafer variation BCD Modeled variation due to slow across-wafer changes Data from two bake plates

Yield Enhancement thru Modeling TEA Systems BCD wafer fit to temperature Response as a function of X position on the wafer On-Wafer Temperature at sec vs final Wafer-Modeled BCD 2 nd order line fitted to each dataset using mouse interface

Yield Enhancement thru Modeling TEA Systems Weir TR calculated Cumulative Energy and BCD Variation Contour grid (left) can be turned on/off

Yield Enhancement thru Modeling TEA Systems Thermal-Time Cycle & BCD Information

Yield Enhancement thru Modeling TEA Systems Thermal Energy & wafer-modeled BCD Problem  OnWafer probe and CD- SEM oriented wafer differently Left=Thermal vector plot Right= Scatter-tool Contour

Yield Enhancement thru Modeling TEA Systems Thermal rotated by –135 degrees Data Rotation interface allowed thermal data to be rotated by –135 degrees to provide improved alignment

Yield Enhancement thru Modeling TEA Systems PEB and feature- BCD as contour plots Weir TR calculated Accumulated Energy from PEB cycle matched to BCD variation Performed after rotation

Yield Enhancement thru Modeling TEA Systems Radial Variation

Yield Enhancement thru Modeling TEA Systems Horizontal Variation: Temperature vs BCD modeled

Yield Enhancement thru Modeling TEA Systems Modeled Comparison of Temperature & Top CD (TCD) Analysis used the BCD variable to remove “poor” metrology  Any variable such as MSE, TCD, BARC, SWA etc can be used to cull data

Yield Enhancement thru Modeling TEA Systems Thermal and Feature Distributions 30 sec BARCSWA2 (Side Wall Angle) Bottom Feature Size (BCD)Top Feature Size (TCD)SWA1 (Side Wall Angle)

Terrence E. Zavecz Weir TR: Matching Thermal Response Comparison of two hot plates Comparison of two separate PEB bake plates

Yield Enhancement thru Modeling TEA Systems Time sequence for two bake plates

Yield Enhancement thru Modeling TEA Systems Timed Response of Temperature

Yield Enhancement thru Modeling TEA Systems Temperature response at curve peak

Yield Enhancement thru Modeling TEA Systems Temperature at Sec

Yield Enhancement thru Modeling TEA Systems Horizontal variation across plate Hot-plate comparison for two PEB sequences Temperature variation at seconds Fitted curves up to 4 th order can be mouse-added to plots

Yield Enhancement thru Modeling TEA Systems Total cumulative end of cycle

Yield Enhancement thru Modeling TEA Systems Summary Two very-unique companion products are offered  Weir TR – Time/Sequence Response Analysis software  Weir TR – Matching for any sequence, probe or metrology data Weir TR: Time Response  Goes beyond thermal sensor software provided by OnWafer & SensArray  Automated  Sequence Phase extraction  Process-Energy Injection calculation  Localized Rise/Fall calculation & plotting  Individual phase and sensor analysis  Vector, histogram and XY plots of any time/sequence slide  Matrix, Animation and visualization plots Weir TR: Matching  Matching software for Critical Features and metrology elements  Similar to historic overlay matching methods  Includes ability to match time/sequenced data  Such as Post-Exposure Bake, scanner logs, OnWafer & SensArray data  Match  Time-to-time  Time-to-Feature distribution  Feature-to-Feature  Automated  Data culling  Wafer Model  Data Rotational Alignment