Micromachining of Silicon and Its Applications in MEMS and Intelligent Sensors Mustafa G. Guvench, Ph.D. University of Southern Maine.

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Presentation transcript:

Micromachining of Silicon and Its Applications in MEMS and Intelligent Sensors Mustafa G. Guvench, Ph.D. University of Southern Maine

What is MICRO-MACHINING?

 What can Micromachined Parts/Systems do for us? Be a Conduit to Microscopic Domain: 1. Sensing (Information) 2. Information Processing 3. Communication 4. Manipulation (Actuation and Control)

Why / Why not SILICON? Semiconductor: Active Devices + Sensors (Photo-Magneto-Strain Sensing) Insulator:SiO 2, Si 3 N 4, Glass Thin Film Conductor:Aluminum, Gold, Silicides PhotoLithography:Planar control (+ & -)

Mechanical Material SILICON? Stiff => Thinning is required for appreciable strain

Micromachining of SILICON? MICROMACHINING of SILICON => (a) BULK (substrate) (b) SURFACE (films) Additive Processes: Chemical and Physical Deposition (Thin Layers only) (Single/Poly) Removal Processes:Chemical and Physical Etching (Wet/Dry/Plasma/Inert/Reactive) (Bulk/Film) (Anisotropic/Isotropic) (Bulk/Film) (Anisotropic/Isotropic)

BULK MICROMACHINING (Etchants: Isotropic/Anisotropic)

BULK MICROMACHINING (Isotropic/Anisotropic)

BULK MICROMACHINING (Cavity/Cantilever Anisotropic)

BULK MICROMACHINED (Silicon Capillary for Insulin Infuser)

BULK MICROMACHINED (Silicon Mask for Cylindrical Micromotion Sensor)

BULK MICROMACHINED (Series Connected Photovoltaic Converter Battery)

MOTION? HANDLING? ASSEMBLY?COUPLING? =>

Micro Electro Mechanical Sytems

M (CMOS-IC Technology) + E (CMOS-IC Technology) + M (Silicon and Sacrificial Layers) + O (Aluminum) + S (IC Packaging Technology)

Three-Layer Poly-Silicon Surface Micromachining Process (to build Mechanical Parts on CMOS IC) Final cross sectional view with 7 layers

Three-Layer Poly-Silicon Surface Micromachining Process

Surface Micromachined

Micromachining of Projection Camera

M (CMOS-IC Technology) + E (CMOS-IC Technology) + M (Silicon and Sacrificial Layers) + O (Aluminum) + S (IC Packaging Technology) M.G.Guvench

Surface Micromachined Silicon Sensors M.G.Guvench

M.G.Guvench

Electrostatic Field Sensors M.G.Guvench

M.G.Guvench

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Mass (Absorption/Deposition) Sensor M.G.Guvench

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Electrostatic Field Sensors M.G.Guvench

Flow Skin Friction Sensors M.G.Guvench

M.G.Guvench

CMOS Analog Chip Design (Operational Amplifier) M.G.Guvench

MicroFab Laboratory

Programmable Diffusion/Oxidation System’s Controller in The MicroFab Laboratory

Double-Diffused P + NN + Junction PhotoDiode Made Being Tested in The MicroFabrication Lab.

MicroFab Laboratory

Surface Micromachined Silicon Sensors M.G.Guvench

3-Poly Surface Micromachining Processed Sensors Cross Section

MEMS Switch

MEMS Micromotor

A Mass (Absorption/Deposition) Sensor M.G.Guvench