LVAD System Review.

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Presentation transcript:

LVAD System Review

System Overview Smiha Sayal

System Overview Left Ventricular Assist Device (LVAD) Mechanical device that helps pump blood from the heart to the rest of the body. Implanted in patients with heart diseases or poor heart function.

System Goal Miniaturize the existing LVAD system to achieve portability while retaining its safety and reliability.

Original System “Black box” architecture used during development Large, not portable Runs on AC power

P10021’s System Has both internal / external components Equivalent to our “Option 2” Unfinished implementation

Customer Needs Safe Robust Affordable Easy to wear and use Interactive with user Controllable by skilled technician Comparable performance Compatible with existing pump

Other LVAD Technologies CorAide (NASA)

Other LVAD Technologies

All electronics external Concepts: Option 1 All electronics external

Concepts: Option 2 ADC internal only

Pump and motor control internal Concepts: Option 3 Pump and motor control internal

All electronics and battery internal Concepts: Option 4 All electronics and battery internal

All electronics and battery internal Concepts: Option 5 All electronics and battery internal

Concept Generation

Concept Generation Highlights Option 1 Smallest internal volume Feasible within timeline Easiest to maintain Minimum 20 wires Option 2 Relatively small internal volume Slightly higher risk of internal failure Minimum 10 wires Option 3 Large internal volume Difficult to design Electronics failure is fatal Minimum 3 wires Option 4 Best Option 350 273 200 153 Option 5 Relatively small internal volume Slightly higher risk of internal failure Minimum 249

Enclosure Design Nicole Varble and Jason Walzer

External Enclosure Needs Risks The external package should be lightweight/ robust/ water resistant The devices should be competitive with current devices The device should fit into a small pouch and be comfortable for user and be comfortable for the user The external package should resist minor splashing The device should survive a fall from the hip Risks Housing for the electronics is too heavy/large/uncomfortable Water can enter the external package and harm the electronics The housing fails before the electronic components in drop tests The electronic components can not survive multiple drop tests

Concept Generation- Materials/Manufacturing Process Concept Generation- Material and Manufacturing Processes   Manufacturing Processes Rapid Prototyping (ABS Plastic) Stereolithography Injection Molded Machine Metal or Polymer Selection Criteria Weight Rating Notes Score Cost 9 4 36 1 $30k for mold 2 18 Feasibility within timeline 10 5 50 long lead time 40 3 30 Strength 6 37 MPa 24 58 MPa 35-70 MPa ~580 MPa Material Interaction with water 8 resin based 16 20 Ease of Manufacturing 15 20 wires 10 wires 3 wires Net Score 133 110 78 103 Rank Continue?  yes No no weight 1- low importance 10- high importance rating 1- does not meet cirteria 5- meets cirteria

Rapid Prototyping Capable of building thin geometries Machinable Material can be drilled and tapped (carefully) Accepts CAD drawings Complex geometries can be created easily Ideal for proposed ergonomic shape Builds with support layer Models can be built with working/moving hinges without having to worry about pins Capable of building thin geometries ABSplus Industrial thermoplastic Lightweight - Specific gravity of 1.04 Porous Does not address water resistant need http://www.dimensionprinting.com/

ABS Plastic Mechanical Property Test Method Imperial Metric Tensile Strength ASTM D638 5,300 psi 37 MPa Tensile Modulus 330,000 psi 2,320 MPa Tensile Elongation 3% Heat Deflection ASTM D648 204°F 96°C Glass Transition DMA (SSYS) 226°F 108°C Specific Gravity ASTM D792 1.04 Coefficient of Thermal Expansion ASTM E831 4.90E-5 in/in/F Important Notes Relatively high tensile strength Glass Transition well above body temperature Specific Gravity indicates lightweight material

Feasibility- Water Ingress Test Need: The external package should resist minor splashing Specification: Water Ingress Tests Once model is constructed, (user interface, connectors sealed, lid in place) exclude internal electronics and perform test Monitor flow rate (length of time and volume) of water Asses the quality to which water is prevented from entering case by examining water soluble paper Risk: Water can enter the external package and harm the electronics Preventative measures: Spray on Rubber Coating or adhesive O-rings around each screw well and around the lid Loctite at connectors Preliminary Tests without protective coating show no traceable water ingress Loctite Spray on Rubberized Coating

Feasibility- Robustness Testing Need: The device should survive a fall from the hip Specification: Drop Test Drop external housing 3 times from 1.5 m, device should remain fully intact Specify and build internal electrical components Identify the “most vulnerable” electrical component(s) which may be susceptible to breaking upon a drop Mimic those components using comparable (but inexpensive and replaceable) electrical components, solder on point to point soldering board Goal Show the housing will not fail Show electronics package will not fail, when subjected to multiple drop tests Risks The housing fails before the electronic components in drop tests (proved unlikely with prototype enclosure) The electronic components can not survive multiple drop tests Preventative Measures Eliminate snap hinges from housing (tested and failed) Test the housing first Design a compact electronics package

Feasibility- Heat Dissipation of Internal Components 130°C is absolute maximum for chip junction temperature in order to function properly Goal- comfort for the user Assumed steady state, heat only dissipated through 3 external surfaces Maximum heat dissipation ~25W Actual heat dissipation ~5W t, k Q Tin Tout h

Prototype Enclosure Survived drop test Water resistant Plastic is machinable Drilled, tapped, milled Helicoils should be used to tap holes Constant opening and screwing and unscrewing of lid will result in stripped threads Approximate wall thickness (6mm) Distance between center of holes and wall needs to be increased Some cracking occued Latches are not feasible

User Interface + - From Pump To Battery BATTERY MENU To Battery OK Speed Battery Life Fault Indication BATTERY OK ERROR MENU From Pump To Battery To Battery To/From Computer Components: Indication of battery life (3x LED) Indication of Fault (LED and Buzzer) Indication of levitation (LED) Display Increase/Decrease Speed (2x Button) Menu (Button) Connectors: 26- pin LEMO connector USB connector Battery Terminals (x2) OK: Indication of levitation ERROR: No Levitation, connection errors

User Interface- Components LED Backlit display with waterproof bezel and o-ring G/R/Y LEDs with O-ring and waterproof bezel Waterproof buttons with O-ring

User Interface- Connectors Current Model: Part # EGG 2K 326 CLL Proposed: Part # EEG 2K 326 CLV Pin Layout

User Interface- IP Codes Ingress Protection First Number Protection against Solid Objects - No protection (Sometimes X) 1 - Protected against solid objects up to 50mm³ 2 - Protected against solid objects up to 12mm³ 3 - Protected against solid objects up to 2.5mm³ 4 - Protected against solid objects up to 1mm³ 5 - Protected against dust, limited ingress (no harmful deposit) 6 - Totally protected against dust Second Number Protection against liquids - Protection against vertically falling drops of water (e.g. condensation) - Protection against direct sprays of water up to 15 degrees from vertical - Protection against direct sprays of water up to 60 degrees from vertical - Protection against water sprayed from all directions - limited ingress permitted - Protected against low pressure jets of water from all directions - limited ingress permitted - Protected against low pressure jets of water, limited ingress permitted (e.g. ship deck) 7 - Protected against the effect of immersion between 15cm and 1m 8 - Protected against long periods of immersion under pressure Display IP 67 Buttons LEDs USB IP 68 Connector

Enclosure Design

Enclosure Design

Enclosure Design

Embedded Control System Andrew Hoag and Zack Shivers

Control System Requirements Customer Needs Selecting suitable embedded control system Designing port of control logic to embedded system architecture Customer Needs Device is compatible with current LVAD Device is portable/small Allows debug access

Impeller Levitation Impeller must be levitating or “floating” Electromagnets control force exerted on impeller Keeps impeller stabilized in the center Position error measured by Hall Effect sensors

Levitation Algorithm Algorithm complexity influences microcontroller choice Electronics choices affect volume / weight Proportional – Integral – Derivative (PID) Very common, low complexity control scheme http://en.wikipedia.org/wiki/PID_controller

Embedded System Selection Requirements: Can handle PID calculations Has at least 8x 12-bit ADC for sensors at 2000 samples/sec Multiple PWM outputs to motor controller(s) Same control logic as current LVAD system Reprogrammable

Embedded System Selection Custom Embedded dsPIC Microcontroller Blocks for Simulink Small Inexpensive (<$10 a piece) TI MSP430 Inexpensive (<$8 a piece) Small, low power COTS Embedded National Instruments Embedded Uses LabVIEW Manufacturer of current test and data acquisition system in “Big Black Box” Large to very large Very expensive (>$2000)

Control Logic/Software Closed-loop feedback control using PID – currently modeled in Simulink for use with the in “Big Black Box” Additional microcontroller-specific software will be required to configure and use A/D, interrupts, timers.

Life Critical System Not at subsystem level detail yet. Life-critical operations would run on main microcontroller. User-interface operations run on separate microcontroller. Possible LRU (Least Replaceable Unit) scheme

Separation of Main/UI Microcontroller Concept Selection

Technician/Field Software Debug Interface USB USB is everywhere. Requires custom PC-side software. Requires processor support. Serial (RS-232) Many computers don’t have serial ports anymore. Can use $15 COTS USB to Serial adapter. Can use COTS terminal tools.

Technician/Field Software Debug Interface Example of using COTS tool – Windows HyperTerminal (free/part of Windows)

Technician/Field Software Debug Interface Concept Selection

Microcontroller Search Parameters A/D 0-5V 8x12-bit @5ksps (kilo-samples/sec) This equates to 40ksps minimum for A/D PWM General I/O for UI controls At least 10x digital At least 5x analog UART (for Serial connection)

Microcontroller Packaging L/TQFP – Low-profile/Thin Quad Flat Pack Small surface-mount (PCB mount) chip package. Is solderable (by skilled solderer) Body thickness up to 1.0mm, sizes range from 5x5mm to 20x20mm

Microcontroller 2 families of Microcontrollers dsPIC from Microchip MSP430 from Texas Instruments

Microchip dsPIC dsPIC30F5011 (16-bit architecture) Max CPU speed 30 MIPS (Million Instructions/sec) 2.5-5.5V operating voltage 66KB Flash, 4KB RAM, 1KB EEPROM 16x12-bit ADC @ 200ksps -40 to 85C operating temp 64-lead TQFP – body 10x10mm, overall 12x12mm Cost [1-25 units] = $7.21

TI MSP430 MSP430F5435A (16-bit architecture) Max CPU speed 25 MIPS (Million Instructions/sec) 2.2-3.6V operating voltage 192KB Flash, 16KB RAM 16x12-bit ADC @ 200ksps 3 Timer modules (with total of 15 timer channels) -40 to 85C operating temp 80-lead LQFP – body 10x10mm, overall 12x12mm

Microcontroller Concept Selection

Active Magnetic Bearings System Ampliers Juan Jackson

AMB Control Center The control center is a closed loop system Stabilization of system is achieved by the feedback control Power Amplifiers convert the input PWM signals to satisfy system requirements Four Degrees of freedom, FrontX, FrontY, RearX, RearY, which pushes rotor DAC Microcontroller PWM Control Signal 4 H-Bridge or 2 Full Bridge Power Amplifiers Active Magnetic Bearing System Impeller FrontX FrontY RearX RearY Hall Effect Sensors (Senses Position)

Amplifier Selection 2 types to select from Linear PWM Output input Higher power to load PWM The generated current switches between output high and low Capable of higher power than the linear amplifier Better performance at higher frequencies

Amplifier Selection Linear Amplifier PWM Amplifier Selection Criteria   Linear Amplifier PWM Amplifier Selection Criteria Weight Rating Notes Score Cost 5 3 15 25 Feasibility within timeline 10 50 Fits Customer Requests 2 20 Ease of Design 6 4 24 Net Score 109 149 1-Low importance 10-High importance 1-Does not meet criteria 5-Meets criteria

AMB Amplifier Selection 11021   AMB Amplifier Selection LMD1800 TLE6209R DRV8412 Selection Criteria Weight Specification Notes Rating Score Continuous Current Output (A) 10 3 Operation with current system verified 5 50 6 Switching Frequency (kHz) 100 2000 500 Rdson (mΩ) 330 2 20 150 80 Operating Supply Voltage (V) 12 to 55 up to 45 Temperature (°C) -40°C ~ 125°C -40°C ~ 150°C -40°C ~ 85°C Package Type 8 Through hole 16 Surface mount 40 Net Score 236 290 Rank 1 Designer Choice 3RD 2ND 1st Customer Choice 55

Amplifier Selection Proof of concept Texas Instrument Application Diagram for Full Bridge Mode Operation

Amplifier Selection Proof of concept Motor Control - DC Brushless BLDC motors are more efficient, run faster and quieter, and require electronics to control the rotating field. BLDC motors are also cheaper to manufacture and easy to maintain Recommended:MSP430F5438 Also consider: Stellaris 5000 /8000 Series C2000 - Fixed Point / Piccolo, Delfino MSP430 - F2xx /5xx 25MHz ADS7953 - 1ch, 12 bit ADC BQ2000T - Battery Charge Management SN65HVD233  - 3.3V CAN Transceiver TPS40305 - DC/DC Controllers DRV8412 - PWM Power Driver TPS54620 - Step- Down Regulators Texas Instruments Microcontroller for Motor Control Applications : Component recommendation "MCU4Analog." Texas Instruments. Texas Instruments, n.d. Web. 4 Nov 2010. <http://focus.ti.com/mcu/docs/mcuorphan.tsp?contentId=73295&DCMP=MCU_other&HQS=Other+OT

Amplifier Selection Proof of concept Testing Hardware

Questions / Comments Help us improve our design!