Brain-Implantable Computing Platforms for Emerging Neuroscience Applications Ken Mai Electrical and Computer Engineering Carnegie Mellon University.

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Presentation transcript:

Brain-Implantable Computing Platforms for Emerging Neuroscience Applications Ken Mai Electrical and Computer Engineering Carnegie Mellon University

 >50M Americans suffer from brain/CNS disorders  Annual cost of >$400B Brain and CNS Disorder Impact Source: Society for Neuroscience

Current Bio-Implantable Devices

 Wired communications and power delivery  Prone to breakage, source of infection  External computation resources  Minimal computation at implant = lots of communication  Custom hardware implementation  High NRE costs, long design/verification time  Behind leading edge IC design technology  Sub-optimal power/performance/efficiency/cost  Requires periodic replacement / servicing  Significant user impact (e.g., annual major surgery) Current Bio-Implantable Devices

Brain-Implantable Computing Platform  Wireless power delivery (mW range)  Wireless communication  Significant computation resources within implant  Cubic millimeter form-factor  Platform technology

Brain-Implantable Computing Platform Solution technologies  Algorithm / software / hardware co-design  3D chip integration  Modular architecture  Trans-threshold ckts  Sloppy computation  Inductive power delivery

 Distributed therapeutic electrical brain stimulation  Brain-controlled functional electrical stimulation Emerging Neuroscience Applications

Progress So Far …

Carnegie Mellon  G. Fedder  J. Hoe  X. Li  K. Mai  J. Paramesh  Y. Rabin The Team University of Pittsburgh  A. Cheng  T. Cui  A. Schwartz  R. Sclabassi  M. Sun  D. Weber  D. Whiting

Workshop on Biomedicine in Computing: Systems, Architectures, and Circuits Austin, TX -- June 21, 2009 Held in conjunction with ISCA Extended abstracts due April 10, ISCA Workshop

 Support wide range of neuroscience applications  Highly energy efficient operation  Wireless delivery of mWatt-level power  Minimal thermal effect on surrounding tissues  Efficient wireless communication to external devices and to a distributed system of BICPs  Cubic millimeter form-factor  Biocompatible packaging  Secure, reliable operation over multiple years Our Goals

 Architectures for bio-implantation  Architectures for interfacing to biological systems  Custom computing machines for the bioscience  Biologically inspired architectures  Computers constructed from biological building blocks  Workload characterization for biomedical applications  Design for bio-compatibility, reliability, and security Workshop Topics