P09321 Updates. T EST M ATERIALS O RDERED Sheet metal FPGA ROM Chips SOIC to DIP Adapter.

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Presentation transcript:

P09321 Updates

T EST M ATERIALS O RDERED Sheet metal FPGA ROM Chips SOIC to DIP Adapter

S ENSORS W E ’ RE LOOKING AT OPB700: Reflective Object Sensor OPB100: Emitter & Sensor GP2D120: Op to electric Device

P ARTIALLY E XPLODED VIEW

C OLLAPSED C ROSS S ECTION

H OUSING S HEET M ETAL L AYOUT

A SSEMBLY ORDER Main housing Inner mounting rails for PCB Install PCB and nitinol latch assembly Mount Top Mount Empty return door Mount Extension/ Ramp Mount legs

I SSUES Ramp / Extension clearance Outside leg hinges 180 max Empty return lock Empty return clearance Mounting location for sensors Mounting locations for ball & spring latches Edge deflection on 3’ drop

M ECHANICAL BOM Sheet Aluminum – 6061 Alloy, 3/32” thick, 6.8 sq. ft Hinge – 45in Pop Rivets - 1/8” dia Pins/clips – (x2) Machine Screws- (x8) Retroreflective Tape Spring Hinge Lock/key Assembly Circuit Board Material- 7.75”x11” (x2) Nitinol Latch Assy- (x33) Ball/spring latch- (x3) Rubber bushings- (x4)