1/23/2011 Team members: Duc Tran Tuan Ngo Giang Nguyen Peter Elabd Thien Nguyen The Duong Advisor:Dr. Mark Weislogel Capstone 2011 Mobile Environment Chamber -Product Design Specifications

Overview Introduction Project Plan Product Design Specification House of Quality Risk Conclusion

Introduction Current Chamber: Lack of mobility Non-uniform temp distribution Expensiveness

Heating and Cooling System Chamber PC Controller Actuator Solid State Drives Facility Set T

Facility

Project Plan

Product Design Specification CriteriaPriority Performance1 Environment1 Safety1 Cost1 Mobility1 Timelines1 Ergonomics2 Testing2 Quantity2 Maintenance2 Materials2 Quality and Reliability3 Regulatory3 Documentation (processes)3 Company constraints and procedures3 LegendHigh priorityMedium priorityLow priority

Product Design Specification Mechanical Aspect Mobility 19- inch rack form factor Density: 75 lb./sq. ft. or less Capacity: 4-12 Devices Under Test (DUT) Performance Temperature range: -5 o C to 105 o C with ± 2 o C accuracy Temperature uniformity: ±4 o C throughout the chamber Temperature transient:10 o C /minute Airflow: 0.5 to 5 m/s across DUTs

Product Design Specifications Input Power Voltage : VAC Frequency: 50 Hz / 60 Hz Real time communication with PC: read/write current set-point temp and actual temp Over-limit protection: An alarm activates when thermal over-limit condition detected or EMO is pushed Features Electrical Aspect

Product Design Specifications Others Cost 150 – 450 USD/DUT slot Safety Comply with Semiconductor Equipment and Materials International (SEMI)

House of Quality

Risk Management Team Communication and Alignment Supplier Issues and Availability of Parts Project Exceed Budget

Conclusion All criteria are well defined The team is ready for the next phase!!! An agreement between design team and customers is specified

Q&A

Back up Intel requirements + SEMI links