© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 1/ Future Circular Colliders Conference © Robert Baumann 3/27/2015 Slide 1/ Future Circular Colliders Conference TI Information – Selective Disclosure Radiation Effects in Electronics (R2E): Challenges for the Future Dr. Robert Baumann (TI/IEEE Fellow) Chief Technologist Aerospace & Defense (MHRS Group) High Performance Analog Products Texas Instruments, Dallas, Texas, USA

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 2/ Future Circular Colliders Conference Why we care: Accelerator Up-Time ~250 h Downtime ~400 h Downtime LS1 – LS2 Aiming for <0.5 dumps / fb -1 ~12 dumps / fb -1 ~3 dumps / fb -1 HL-LHC: < 0.1 dumps / fb -1 Relocation & Shielding Equipment Upgrades from M. Brugger et al., “R2E Project - Next Steps R2E”, Feb 11, 2014 (CERN)

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 3/ Future Circular Colliders Conference Manufacturer Component Grades COTS (you get what you get & it WILL change) COTS+ - Lot control (eliminate lot-to-lot variation) EP (Enhanced Performance/Plastic) – extended temp range, qualification, tracking, rev control., change notice Military – Ceramic package, QMLQ, similar to EP Space – Military + QMLQ/QMLV, possibly RHA Grounds-up – define what you need (ASIC or Prod. Dev.) Use of lowest cost components (COTS) is almost NEVER the lowest cost system solution

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 4/ Future Circular Colliders Conference Manifestations of Radiation Transient Charge Generation Charge Transport and Trapping Nuclear Reactions Structural (Lattice) Damage DoseEffects Single Event Effects Dose Rate Effects stochasticchronic

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 5/ Future Circular Colliders Conference James R. Schwank et al., “Radiation Effects in MOS Oxides”, IEEE Trans. Nucl. Sci., 55(4), Aug. 2008, pp Total Ionizing Dose

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 6/ Future Circular Colliders Conference TID Effects on MOS & Bipolar James R. Schwank et al., “Radiation Effects in MOS Oxides”, IEEE Trans. Nucl. Sci., 55(4), Aug. 2008, pp M. Shaneyfelt, P. Dodd, B. Draper, R. Flores, “Challenges in hardening technologies using shallow-trench isolation”, IEEE Nucl. Sci, 45 (6), p1, Dec. 1998, pp From N N+ P- I B ~ R surface

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 7/ Future Circular Colliders Conference Total Ionizing Dose - Challenges TID [Gy.y -1 ] Linac 4 beam line CPS tunnel walls LHC Machine electronics PSB beam line CPS beam line SPS beam line Protected Shielded Tunnel SPS tunnel walls SPACE COTS/MIL Plan for replacement Adapted from M. Brugger et al., “R2E Project - Next Steps R2E”, Feb 11, 2014 (CERN) Assuming 10 year lifetime

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 8/ Future Circular Colliders Conference Neutron/Proton Dose Primary effect: reduction of minority carrier lifetime. MOSFETs are majority carrier devices = not very sensitive to ND. Advanced BJT technologies are less sensitive to minority lifetime reduction (very small base region = small  ). vacancy Interstitial

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 9/ Future Circular Colliders Conference MOSFETS N/P Dose Challenges 1MeV neutron equivalent [cm -2.y -1 ] Linac 4 beam line CPS tunnel walls LHC Machine electronics PSB beam line CPS beam line SPS beam line Protected Shielded Tunnel SPS tunnel walls BIPOLAR Adapted from M. Brugger et al., “R2E Project - Next Steps R2E”, Feb 11, 2014 (CERN) New tech? or need replacement Assuming 10 year lifetime

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 10/ Future Circular Colliders Conference Most Common SEE Ion Track +V n+ diffusion p- epi Recombination Diffusion Collection Potential Contour Deformation Electron-Hole Pairs Electron collection Drift Collection Reverse-biased N+/P junction V Ion Track Parasitic bipolar action Single Event Latch UpSingle Event Transient/SE Upset

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 11/ Future Circular Colliders Conference SEE Challenges HEH [cm -2.y -1 ] Linac 4 beam line CPS tunnel walls LHC Machine electronics PSB beam line CPS beam line SPS beam line Protected Shielded Tunnel SPS tunnel walls GroundAirEarth Orbit 1 MFIT (AVG ~ 1 fail/0.114 yrs) Generic 28nm product w 64Mbits SRAM No ECCECC (SECDED) Expect to need system-level mitigation/ resiliency 1 kFIT (AVG ~ 1 fail/114 yrs) ECC (SECDED) Adapted from M. Brugger et al., “R2E Project - Next Steps R2E”, Feb 11, 2014 (CERN)

© Robert Baumann 3/27/2015 TI Information – Selective Disclosure Slide 12/ Future Circular Colliders Conference RHA - Summary Technology Scaling has reduced rad sensitivity BUT a wide number of rad environments cannot be serviced by COTS alone. Making the correct choices is HARD & mistakes are expensive! Invest in radiation characterization and modeling (Tools) & build and maintain radiation expertise and experience (People). COTS+, MIL, EP, Space parts can help meet many system reqs. BUT component solutions are not sufficient at higher fluences. Disparate R&D group requests should be organized and combined when possible = better pricing through volume!