Encryption Transaction with 3DES Team W2 Yervant Dermenjian (W21) Taewan Kim (W22) Evan Mengstab(W23) Xiaochun Zhu(W24) Objective: To implement a secure credit card transaction using 3DES encryption using Kerberos-style authentication. Current Stage: Basic Component Simulation 02/25/2004 Current Stage: Basic Component Simulation 02/25/2004 Design Manager: Rebecca Miller
Current Status Design Proposal (100% done) Architecture Proposal (100% done) Size Estimate and Floor Plan (100% done) Full-chip Transistor-level Schematic (100% done) Component Layout (100% done) Basic components Basic components To be done Program of control signals for architecture modification Program of control signals for architecture modification Layout of larger blocks Layout of larger blocks Component Simulation Component Simulation Top-Level layout routing Top-Level layout routing Barrel shifter spice simulation Barrel shifter spice simulation
Updated 48’b XOR Rise Time Old: 3.169n New: 840p
Updated 48’b XOR Fall Time Old: 1.401n New: 282p
Updated 48’b XOR Prop Time Old: p New: 253.7p
Permutation Rise Time Old: 1.367n New: 276.6p
Permutation Fall Time Old: p New: 182.8p
Permutation Propagation Time Old: 1.03p New: 419p
Project Goals Implement fully functioning 3DES Chip. Implement fully functioning 3DES Chip. 300Mhz speed. CPU speeds in current ATMS range from Mhz. 300Mhz speed. CPU speeds in current ATMS range from Mhz. Dense design for small area in existing machines. Dense design for small area in existing machines.
Critical Path Estimate Mux: p TextBox: 911.5p Mux: p EXP: 419p XOR: 253.7p SBOX: p P: 419p XOR: 253.7p Total: 3.386n SPEED 295.3Mhz Old SPEED 168Mhz
Design Decisions Permutation Optimization
Updated Architecture KeyReg 56’b Register 32’b 32’b input IP -1 wiring PC-2 Wiring 56->48 IP wiring Text 64’b Register Expand 32->48 wiring S-Box 512 x 4’b P 32->32 wiring PC (wiring) 32’b Latch 2:1 mux Sub_rnd txt_in ready key_in “R” “L” R L wr_en OUT ready 32 2:1 mux :1mux 32’b Latch 2:1 mux Sub_rnd Enc_ShiftL Dec_ShiftR 2:1 mux Sh_d Sh_e e/d Enc_ShiftL Dec_ShiftR Sh_d Sh_e
Floorplan Floorplan 32’b Latch PC1 Right Barrel Shifter 56’b Mux 56’b Key Reg PC2 IP Mux IP-1 32’b Text Register (L) 32’b Text Register (R) 32’b Mux 32’b XOR Expand 48’b XOR P SBOX 32’b Mux All large functional blocks use Metal 1 and Metal 2. M1 M2 M3 M4 Input Mux Output Program Control clock 416μm 360μm Left Barrel Shifter 56’b
Floorplan Floorplan Input Latch Initial Permutation Barrel Shifting Key Register Barrel Shifting Initial Permutation Final Permutation Key Register XOR Expand Permutation P Permutation S BOX ROM and Decoders Program Control Transistors: Area: 415.9μm x μm
Metal1 Metal1
Metal2 Metal2
Metal3 Metal3
Poly Poly
Transistors Transistors
Problems and Issues XOR Rise/Fall times have significant difference Performance not impacted by W/L Ratio Performance not impacted by W/L Ratio Increasing size reduces resistance Increasing size reduces resistance Offset by an increase in diffusion capacitance Offset by an increase in diffusion capacitance Buffer control signals to traverse chip
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