VERTEX 2002 Experience with Parallel Optical Link for the CDF Silicon Detector S. Hou for the DOIM group Academia Sinica, Taiwan.

Slides:



Advertisements
Similar presentations
Differential Amplifiers and Integrated Circuit (IC) Amplifiers
Advertisements

SAAB SPACE 1 The M2 ASIC A mixed analogue/digital ASIC for acquisition and control in data handling systems Olle Martinsson AMICSA, October 2-3, 2006.
20/Oct./2000 CF IEEE NSS 2000 at Lyon,France 1 An MWPC Readout Chip for High Rate Environment Introduction ASIC Structure & Fabrication ASIC Evaluation.
[ 1 ] LVDS links Servizio Elettronico Laboratori Frascati INFN - Laboratori Nazionali di Frascati G. Felici LVDS links.
Semiconductor Optical Sources
IEEE10/NSS R. Kass N A. Adair, W. Fernando, K.K. Gan, H.P. Kagan, R.D. Kass, H. Merritt, J. Moore, A. Nagarkar, S. Smith, M. Strang The Ohio State.
Richard Kass IEEE NSS 11/14/ Richard Kass Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector K.E. Arms, K.K. Gan, M.
TileCal Electronics A Status Report J. Pilcher 17-Sept-1998.
Fiber-Optic Communications
EE 230: Optical Fiber Communication Lecture 10 From the movie Warriors of the Net Light Sources and Transmitters.
July 10, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
Fiber-Optic Communications James N. Downing. Chapter 5 Optical Sources and Transmitters.
Ionization Profile Monitor Front End (IFE) System Presenter: Kwame Bowie PPD/EED Phone: (630)
Fiber-Optic Communications
05/11/06Sasha Pronko, Silicon Workshop II, UCSB1 PORTCARDs & DOIMs Sasha Pronko Fermilab.
Sensors for CDF RunIIb silicon upgrade LayerR min (cm)1 MeV eq-n cm * * * * * *10.
Fiber Optic Light Sources
Fiber Optic Receiver A fiber optic receiver is an electro-optic device that accepts optical signals from an optical fiber and converts them into electrical.
20-24 September 2010, TWEPP, Aachen, Germany D. 1 Datao Gong On behalf of the ATLAS Liquid Argon Calorimeter Group Department of Physics,
Fundamental of Fiber Optics. Optical Fiber Total Internal Reflection.
VCSEL Failures in ATLAS T. Flick, University of Wuppertal TWEPP 2010 Aachen,
LECC03, 9/30/2003 Richard Kass/OSU 1 Richard Kass Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector K.E. Arms, K.K. Gan, M.
IEEE06/San Diego R. Kass N Bandwidth of Micro Twisted-Pair Cables and Spliced SIMM/GRIN Fibers and Radiation Hardness of PIN/VCSEL Arrays W. Fernando,
DC-DC Buck Converter in Inner Detector Environment
A Serializer ASIC for High Speed Data Transmission in Cryogenic and HiRel Environment Tiankuan Liu On behalf of the ATLAS Liquid Argon Calorimeter Group.
SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.
DPF 2013 R. Kass 1 P. Buchholz, M. Ziolkowski Universität Siegen OUTLINE Lessons learned… IBL/nSQP opto-board overview assembly experience radiation hardness.
Development of Readout ASIC for FPCCD Vertex Detector 01 October 2009 Kennosuke.Itagaki Tohoku University.
R. KassIEEE05/Puerto Rico N Radiation-Hard Optical Link for the ATLAS Pixel Detector Richard Kass The Ohio State University W. Fernando, K.K. Gan,
R. KassIEEE04/Rome 1 Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector Richard Kass The Ohio State University K.E. Arms, K.K.
Feb 20, 2009 CALICE meeting, Daegu, Korea QRL in Magnetic Field 1 QRLed Driver in Magnetic Field Jaroslav Zalesak Institute of Physics of the ASCR, Prague.
Status of the PiN diodes irradiation tests B. Abi( OSU), R. Boyd (OU), P. Skubic (OU), F. Rizatdinova (OSU), K.K. Gan (Ohio State U.)
DOIM Parallel Optical Link s: TX/RX S. Hou, R.S. Lu 19-Dec-2003, Lake Geneva.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
© 2013 The McGraw-Hill Companies, Inc. All rights reserved. McGraw-Hill 3-1 Electronics Principles & Applications Eighth Edition Chapter 3 Diodes Charles.
Gigabit Ethernet – IEEE 802.3z The Choice of a New Generation ECE 4006c G2- Gigabit Ethernet Intel/Agilent TX Javier Alvarez, gte006r Astou Thiongane,
IEEE08/NSS R. Kass N Radiation-Hard/High-Speed Data Transmission Using Optical Links W. Fernando, K.K. Gan, A. Law, H.P. Kagan, R.D. Kass, J. Moore,
Pierpaolo Valerio.  CLICpix is a hybrid pixel detector to be used as the CLIC vertex detector  Main features: ◦ small pixel pitch (25 μm), ◦ Simultaneous.
U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.
Chapter 4 Logic Families.
K.C.RAVINDRAN,GRAPES-3 EXPERIMENT,OOTY 1 Development of fast electronics for the GRAPES-3 experiment at Ooty K.C. RAVINDRAN On Behalf of GRAPES-3 Collaboration.
S.Hou, Academia Sinica Taiwan. 2Outline Optical links for ATLAS Laser-driver  fiber  PIN-driver LHC modules in service Rad-hard requirement for LHC/SLHC.
CMS Upgrade Workshop – Nov 20, H C A L Upgrade Workshop CMS HCAL Working Group FE Electronics: New QIE Nov 20, 2007 People interested in QIE10 development:
Novel Semi-Transparent Optical Position Sensors for high-precision alignment monitoring applications Sandra Horvat, F.Bauer, V.Danielyan, H.Kroha Max-Planck-Institute.
Honeywell Advanced Photonics Development Overview ATLAS Meeting January 7, 1999 John Lehman Honeywell Technology Center
DPF 2011 R. Kass 1 P. Buchholz, A. Wiese, M. Ziolkowski Universität Siegen OUTLINE Introduction Result on 4-channel Driver/Receiver with Redundancy Design.
K.K. GanUS ATLAS Pixel Meeting1 Opto-IC/Board K.K. Gan The Ohio State University WBS & 4 July 9, 2003.
Implementing a 10 Gb/s VCSEL Driven Transmitter for Short Range Applications Irfan N. Ali Michael C. Clowers David S. Fink Sean K. Garrison Jeff A. Magee.
The development of the readout ASIC for the pair-monitor with SOI technology ~irradiation test~ Yutaro Sato Tohoku Univ. 29 th Mar  Introduction.
PIN current degradation Versus 3 MeV proton fluence 3 MeV proton (a)(b) (c)(d) Study of radiation damage in VCSELs and PINs for the optical links of the.
BeamCal Electronics Status FCAL Collaboration Meeting LAL-Orsay, October 5 th, 2007 Gunther Haller, Dietrich Freytag, Martin Breidenbach and Angel Abusleme.
Charles University Prague Charles University Prague Institute of Particle and Nuclear Physics Absolute charge measurements using laser setup Pavel Bažant,
A high speed serializer ASIC for ATLAS Liquid Argon calorimeter upgrade Tiankuan Liu On behalf of the ATLAS Liquid Argon Calorimeter Group Department of.
R. Lipton Vertex ‘98 Santorini, Greece The D0 Silicon Microstrip Tracker (D0SMT) Outline  Design  Detector Studies Coupling capacitors Radiation Damage.
Timing System R+D for the NLC Josef Frisch. NLC and PEPII Phase and Timing Requirements (approximate)
1 Status report on the LAr optical link 1.Introduction and a short review. 2.The ASIC development. 3.Optical interface. 4.Conclusions and thoughts Jingbo.
Optical InterLinks LLC (OIL)----- GuideLink ™ Polymer Waveguide Products Multichannel Monolithic Data Network Monitoring Taps Using OIL’s Polymer Waveguide.
0 Frequency Gain 1/R 1 R 2 R 3 0 Frequency Intensity Longitudinal modes of the cavity c/L G 0 ( ) Case of homogeneous broadening R2R2 R3R3 R1R1 G 0 ( )
10/3/2003Andreas Jansson - Tevatron IPM review1 Tevatron IPM Proposed design.
1 Roger Rusack The University of Minnesota. Projects  Past Projects  11,000 channels of 0.8 Gbs for the CMS crystal calorimeter readout.  1,500 channels.
Reliability and Performance of the SNS Machine Protection System Doug Curry 2013.
Radiation hardness of the 1550 nm edge emitting laser for the optical links of the CDF silicon tracker S. Hou 15-Jun-2004.
OVER VOLTAGE OR UNDER VOLTAGE
Status of the CDF II silicon tracking system
Next generation rad-hard links
OPTICAL SOURCE : Light Emitting Diodes (LEDs)
Status report of the ATLAS SCT optical links
MAINS SUPPLY SENSED Over Voltage
VCSEL drivers in ATLAS Optical links
Optical links in the 25ns test beam
Presentation transcript:

VERTEX 2002 Experience with Parallel Optical Link for the CDF Silicon Detector S. Hou for the DOIM group Academia Sinica, Taiwan

VERTEX 2002 Introduction DOIM: D ense Optical Interface Module Byte-wide parallel optical link 8-bits + clock 53 Mbyte/sec, BER  Transmitter : Laser-diode array ASIC driver chip Receiver : PIN-diode array ASIC receiver chip Multi-mode fiber ribbon Laser, Electrical characteristics Bit-error rate test Aging test Radiation Hardness Implementation in CDF

VERTEX 2002 Transmitter: Laser diode InGaAs/InP Edge-emitting laser diode : 1550 nm wavelength 12-ch diode array (9 used) 250  m pitch 20 mA/channel Cleaved mirrors Facet coating Bare laser power:  1 Insertion to fiber: 200 ~ 800  W/ch Fabrication by Chunghwa Telecom Telecommunication Laboratories

VERTEX 2002 Transmitter: driver ASIC Custom design, biCMOS 0.8  m,AMS bipolar transistors only Inputs : Diff. ECL or LVDS signals compatible differential  100 mV Enable by TTL low Nine channels : V cc -V LD across output transistor, 50 , laser control current consumption At 3V, 20mA/ch nominal ~2mA/0.1V adjustable slope

VERTEX 2002 Transmitter assembly Die-bond / Wire bond laser-diode array on BeO submount driver chip on substrate fibers on V-groove Alignment fibers to laser emitting facets

VERTEX 2002 Receiver : PIN & ASIC InGaAs/InP PIN diode : 12-ch array, matching laser diode wavelength by TL, Chunghwa Telecom. Operation condition : 50 ~ 800  W on,  10  W off  1.1 W/module Outputs : differential ECL, nine independent channels

VERTEX 2002 Receiver assembly Die-bond / Wire bond PIN-diode array on Al 2 O 3 submount driver chip on substrate fibers on V-groove Alignment, fibers to PIN-diodes

VERTEX 2002 Assembly procedure

VERTEX 2002 Transmitter characteristics Transmitter tests : L-I-V and temperature 50 MHz diff. Inputs, 2.5V common mode  100 mV, 50% +Dcyc Laser light MT-12ST fanout & Tek O/E probe

VERTEX 2002 Laser diode: L-I-V Laser light at 20, 30, 40 o C water-bath chiller precision ~0.1 o C measured at substrate I-V little temperature dependence approximately linear L-V Drop with temperature Duty cycle diff. Input 50% stable, little offset to 50%

VERTEX 2002 Laser diode: temperature Light power vs. Temperature Measured in stable cooling/heating process Temperature at substrate precision ~0.1 o C Approximately linear drop to temperature

VERTEX 2002 Receiver response Receiver connected to a Transmitter Light power chosen for wide distribution Light pulse width are consistent Receiver ECL outputs by a Tektronix diff. probe Consistent duty cycles in favored operation range (2.8~3.2V) Saturates for high light level

VERTEX 2002 Transmitter uniformity : light outputs Production transmitters light from pigtail at 30 o C wide deviation channel-by-channel mainly due to insertion efficiency Span within ~400  W  ~72  W to the mean/module Effect operation dynamic range in threshold, saturation limit

VERTEX 2002 Transmitter uniformity : light pulse widths Ch-Ch Light power deviation Is approximately a const. scaling factor L-V linear fit, normalized slope to L(3V) indep. of light power Light pulse width is uniform,  ~1%, indep. of light power

VERTEX 2002 Receiver uniformity : ECL duty cycles Two production batches monitored at 550  W & 970  W light pulse width 45% ECL duty cycle is uniform 48.1% at 550  W, (2 nd batch)  =0.7% 4% wider in 1 st batch due to chip tuning Wide light input range Saturation monitored at 970  W

VERTEX 2002 Receiver uniformity : duty cycle deviation Input lights ~950  W, width 45% for all channels ECL outputs of a module deviation to the mean  ~1.5% for both batches

VERTEX 2002 Bit-Error Rate test BERT by Fermilab PC ISA boards TTL to Tbert, Rbert boards At 63 MHz, minimum BER  10 –12 Burn-in 3-days on ASICs, diodes 1-day BERT  reject devices infant mortality bad components fail quickly

VERTEX 2002 Accelerated Aging test 4 transmitters at 60 o C, 330 days Wear-out degradation 0.15  0.08  W/day at 60 o C no failure Accelerating factor F=exp( E a / k b ) (1/T 1 –1/T 2 ) F=29 for T= – 5 o C Failure due to light degradation Min transmitter spec 200  W down below receiver threshold 50  W ~100 days at 60 o C, or 8 years at – 5 o C 90% C.L. for 0 failure, P=0.064 upper limit = 40 ch. In 3 years

VERTEX 2002 INER 30 MeV proton Irradiation CDF requirement : 200 kRad tolerance INER test beam : transmitter in DC mode. fiber connection out of beam area, measuring L, T versus dose.

VERTEX 2002 Bulk damage, annealing Bulk damage dominant, linear dep. to dose Ratio of light drop is consistent for a module, indep. of light power Degradation  10% for 200 kRad

VERTEX 2002 UC Davis 63.3 MeV proton UC Davis test beam : 10 transmitters on two Port Cards Examined after 200, 400 kRad, for L I, V measurements Light degradation ~10% for 200 kRad Similar I-V, L-V characteristics after irradiation, slope for L vs. V degrades similarly.

VERTEX 2002 DOIM implementation : transmitters Transmitters on Port Cards Total 570 transmitters 128 Port Cards, 5 transmitter each board

VERTEX 2002 DOIM implementation : receivers Receivers on FTM 10 receivers on each board, reading 2 Port Cards

VERTEX 2002 Status 570 pairs implemented ~10 % bit-error flagged excess light at -5 o C optical reflection, contact electrical pin contact  2% has fatal damage is improving

VERTEX 2002 Summary DOIM, a byte-wide optical link is implemented in CDF Edge-emitting laser light  linear to I-V and T Laser-diode array coupling to pigtail fibers large deviation  a major disadvantage Radiation tolerance is high bulk-damage dominant  linear degradation to dose