PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays1 IBDR Hilmar Richter ANTEC-GmbH Germany Günter Bollmann, Peter Dinges, Otto Frenzl, Heidrun Köppen, Heribert Krüger, Claudia Popp

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays2 Overview Modul / Array Interfaces –Optical Interface –Electrical Interface Design Implications on Arrays –Detector Stack –Thermal Budget –Cryo Cycling and Vibrational Load Achieved Performance –Cut-off Wavelengths –Bias dependency PA / QA Activities: Flow Plan Procurement Summary

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays3 Optical Interface of the “Red” Array Radial arrangement of 25 high stress modules in groups of 5 modules. The center of the radial arragement is 240 mm in front of the fore optics in the plane of the pupil.

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays4 Electrical Interface Interface design FEE and harness substrate are supported by kapton tubes in order to reduce thermal load to the module All wires from interface parts to the module are stainless steel, wires between interface parts are gold wires The nano connector of the pigtail harness is glued to the harness substrate Thermal loads of the interface parts flow through the cooling strap to the 4 K level

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays5 Detector Stack in the Cavity and Final Bias Design Ball segment Detector contact Ge:Ga crystal Detector contact Gold wire 25 µm Insulator Final design Bias concept has been changed to prevent grounding of detectors by short circuit –Contact diameter decreased at the ball segment side to prevent grounding of the signal line (2) –Contact diameter increased at the ground side (this contact is grounded directly to the module (1)  Slits reduced from µm to µm and therefore less cross talk 1 2 Detector Stack

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays6 Thermal Budget 4 K P = 375 µW 4 P = 624 µW 11 µW 202 µW 162 µW 7 µW 134 µW 108 µW P = 249 µW 25 High Stress Modules 25 Low Stress Modules 2.5 K 1.7 K 4 K 16 Detector Wires (Steel) 4 Long FEE + 2 Long Harness Posts (Kapton) 2 Short Harness Posts (Kapton)

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays7 Cryo Cycling and Vibration Load Slit of 0.2 mm between kapton tube and support part (no gluing) at the free bearing support posts compensates shrinkage of different materials (module, FEE / harness substrate, kapton tube, etc.) during cool-down. After cool-down: slit = mm. Static tests at LN 2 temperatures prove: Kapton tubes withstand deflections of 0.15 mm (0.12 mm) perpendicular (parallel) to the substrate plane. The applied forces correspond to accelerations of 110 g. Above support post design passed cryo cycling and vibration tests with qualification load levels. Free bearing support post Slit

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays8 Specification Cut-off Wavelength Specification high stress module: CW > mV 30 mV

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays9 Specification Cut-off Wavelength Specification low stress module:  CW < mV

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays10 PA / QA Activities: Flow Plan KIP Final check of the completed module before shipping Cleaning and incoming inspection of all parts Detector stack assembly and RSR measurement. KIP: Check of detector stack KIP Final cleaning of the module and check with UV light Preparation of FEE / harness substrate support posts Gluing of the pigtail harness to the harness substrate and implementation of connector saver and short circuit connector Integration of FEE / harness substrate, wiring and fixing of FO

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays11 Procurement / Assembling Status of parts procurement for the integration of QM modules - Delivery of the Gore cables Tecnologica announced connector savers and short circuit connectors for Delivery of FEE and harness substrates PO for the pigtail harness from Cannon placed (delivery time 12 weeks) Routinely going on assembly of FM modules at Antec Time critical: Procurement of pigtail harness

PACS IBDR 27/28 Feb 2002 Photoconductor Detector Arrays12 Summary Interfaces to MPE housing, KT board and IMEC FEE and harness substrate defined Module design finished (specifications fulfilled) Procurement of integration parts initiated and delivery dates fixed