5. July 2010 Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University) 6” Origami Module and Front End Electronics 6 th Open Meeting of the Belle II Collaboration

6 th Open Meeting of the Belle II Collaboration 2Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Components Testing & Quality Check Assembly Module Test Summary

6 th Open Meeting of the Belle II Collaboration 3Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Components Testing & Quality Check Assembly Module Test Summary

6 th Open Meeting of the Belle II Collaboration 4Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami Chip-on-Sensor Concept Principal feasibility shown in 2009 by building a prototype module using a 4” DSSD Successfully tested in lab and SPS beam Can it be scaled up to the size required for the center 6” sensor of the outer most ladder?

6 th Open Meeting of the Belle II Collaboration 5Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Summary 4” Origami Flex hybrid produced by CERN PCB workshop –long delivery time –almost made by hand –not suitable for series production Several vias broke after soldering of electronics components Only moderate bondability We found a Japanese company for production of new 6” design

6 th Open Meeting of the Belle II Collaboration 6Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami Design for Belle II SVD Present design for center module of outermost ladder (6“ HPK sensors) Consists of 4 parts: –Origami PCB (~ 450 mm long) –PA0: pitch adapter for n-side, glued onto hybrid –PA1, PA2: pitch adapters to connect p-side strips, wrapped around the edge of the sensor Manufacturer: Taiyo Industrial Co., LTD.

6 th Open Meeting of the Belle II Collaboration 7Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami Design for Belle II SVD Design finalized in mid of March –needed some iterations with company –e.g. separate PA0 from hybrid to ensure high precision, tear drop design for vias First batch of PA1 and PA2 received end of March (10 pieces each) 10 pieces of Origami PCB and PA0 shipped end of April Shipment within appointed time PA0 already glued onto hybrids by company

6 th Open Meeting of the Belle II Collaboration 8Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July “ Origami PCB and Pitchadapters Origami PCB –3-layer design –237µm thick (nominal) PA0, PA1 and PA2 –2-layer design –145µm thick (nominal) Origami PCB PA1 PA2 PA0 glued onto hybrid

6 th Open Meeting of the Belle II Collaboration 9Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Components Testing & Quality Check Assembly Module Test Summary

6 th Open Meeting of the Belle II Collaboration 10Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 PA1 & PA2 Top layer (coating) and thus PAs are thicker than expected PAs are rigid  complicates bending Can the company use a thinner coating? We brought one (thinner) pitch adapter made by CERN as sample Shorts and open measurement  no failure found Design issue: –Staggering at sensor side is wrong –Does not match staggering of DSSD –Bonding is nevertheless possible –Can be used for prototype module –Layout will be corrected for next batch

6 th Open Meeting of the Belle II Collaboration 11Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB - Optical Inspection Overall impression is very good Shape of pads and lines look very precise Gold plating of bond pads seems to be uniform PA0 is well aligned to the footprints of the AVP chips. Few minor issues: –On one PCB the top layer of PA0 is slightly displaced by about 88µm (~1 pitch), but still bondable –Drill of some vias is not centered, but within tolerance –The second (left hand) bias pad is covered by the solder stop layer  missing opening –Alignment marks on two PCBs are incomplete (partially removed), e.g. hybrid #10  required for auto adjustment of our bonder..

6 th Open Meeting of the Belle II Collaboration 12Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB – Electrical Test We measured the connection between the connectors and all APV chips ~3300 measurements in total Very satisfying results: 9 of 10 board are good On one PCB we found a single open via near APV #1 (p-side) Design issues: –APV signals lines swapped: 0<>1, 2<>3 –doesn‘t matter for prototype –Bias connection between PA0 and Origami PCB will be covered by neighboring hybrid –change location of pad Origami PCB of neighboring sensor covers and damages bond wires

6 th Open Meeting of the Belle II Collaboration 13Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB – Soldering Was an annoying issue of 4” Origami hybrids (soldered by ~350 °C) Broken vias after soldering, caused by local delamintation Vapor phase soldering ? –lower temperature –Nanonics connector Baking of one hybrid: 65°C Solder cycle w/o applied parts: 5 230°C Optical inspection & electr. Test –no visible damage –all connections still ok –no broken via

6 th Open Meeting of the Belle II Collaboration 14Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB Soldering – Nanonics Connector We equipped and soldered one hybrid using vapor phase soldering  no damage of PCB Nanonics connector is still problematic –connector has two rows of pins –sometimes they are not at the same height –causes bad connection of some pins –resoldering of inner row is difficult Further investigation required Other connector available?

6 th Open Meeting of the Belle II Collaboration 15Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB Soldering – Resistor Resistor in front of APV –located between two bond pads –no space for solder stop between resistor and pads solder tin covers bond pad  no more bondable Solution for prototype: –we glued small pads beneath the damaged one Future design: –modified routing of lines between solder and bond pads –glued PA0 acts as solder stop layer Edge of PA0

6 th Open Meeting of the Belle II Collaboration 16Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB – Thermal Cycling Test long term thermal stress resistivity 84 cycles between -10 and +30 °C Same conditions as used for CMS thermal tests Duration: ~ 2 weeks Thereafter we repeated optical inspection and electrical test No damage detected

6 th Open Meeting of the Belle II Collaboration 17Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB – Impedance of Analog Data Line Determined diff. impedance of analog output of p-side APV #1 Measured reflexions of rectangular input signal and adjusted R term until reflection disappeared Measurement:Z diff =  Simulation:Z diff =  Path length: ~ 45 cm,Propagation delay (measured) = 5.46 ns Propagation speed: c = km/s  6.07 ns/m Hybrid cable: Z diff = 125    still no reflexions visible R term << R z R term = 102.6Ω = R z R term = 125Ω

6 th Open Meeting of the Belle II Collaboration 18Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB – Ohmic Resistance of Line Measurement: R line = 22  (single line) Simulation:R line = 9.4   half the measured value Comparison line geometry nominal [µm]measured [µm] line width line distance dist.to next pair  slightly over etched, but does not explain huge difference of R nominal [µm]measured [µm] thickness 9 5 Measurements were done with the tactile sensor of our CMM 5µm copper thickness is compatible with measured resistance Apparently, there is less copper than planned, but this is not a real problem. Anyhow, we originally requested 5µm  less material budget

6 th Open Meeting of the Belle II Collaboration 19Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami PCB – Wire Bonding Fully automated bonding machine Bond process control Easy to find working parameters Very uniform deformation Excellent bondability  Excellent and uniform gold coating Origami Sensor deformation vs. time

6 th Open Meeting of the Belle II Collaboration 20Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Components Testing & Quality Check Assembly Module Test Summary

5. July Assembly procedure of 6” Origami We must newly develop the assembly jigs so that the size of component is entirely different with that of 4” DSSD Origami prototype modules. The procedures should be as simple as possible to minimize the developing and actual assembly time (~7 weeks. limited by my stay at HEPHY), but should be extendable whole ladder for near future production. The procedures are developed to require basic three jigs and these supplements. The Jigs are used to hand the current procedure to the next procedure with keeping their alignment ( assured by pin&hole ). The assembly precision is limited by the difference of pin and hole’s diameter. If we use precise pin and linear bush( circulating boles inside wall of hole to reduce friction ), it easily achieve several  m precision level. As a results, we could assemble very smoothly on schedule using developed procedures without any problems. jig1 jig2 jig3

5. July Procedure1 : Placing DSSD on the Jig1 Attachable stopper to align the DSSD 1. Placing the DSSD on the jig1 2. Fixing DSSD with vacuum chucking Jig1 Poral stone to vacuum-chuck DSSD 3. Removing stopper and pin Commonly used holes to hand Origami components to the other jigs

5. July Placing PAs on the sensor Procedure2 : Placing Pitch adaptors on the DSSD 2. Aligning PAs

5. July Fixing PAs to the PA-jigs with vacuum-chucking 1. Placing PA-jig on the PA 3. Picking up PAs Procedure3 : Placing PA-jigs and picking up the PAs PA-jig Jig1 Vacuum chucking holes PA-jig Pins Chucked PA

5. July Dispensing glue on the backside of PAs 3. Placing PA-jigs on the Jig1 again to glue 1. Placing PAs on the PA-jigs upside down Procedure4 : Picking up PA-jigs, gluing, wire-bonding 4. After cured, removing PA-jigs 5. Wire-bonding p-side of DSSD and PAs Araldite 2011(Epoxy adhesive)

5. July Placing the Support ribs in the groove of Jig2 2. Dispensing glue top of the ribs Procedure5 : Placing ribs on the jig2 and dispensing glue Jig2 Support ribs Jig2 Grooves for ribs Poral stone

5. July Flipping upside down 1. Placing the jig2(Ribs) on the jig1(DSSD) to glue Procedure6 : Placing the jig2 on the jig1 3. Fixing DSSD to the jig2 with vacuum chucking 4. After curing the glue(~24h), removing jig2 Pin Hole Jig2 Jig1 Jig2

5. July Placing the Rohacell on the Jig1 with as same as procedure1 3. Dispensing glue on the Rohacell Procedure7 : Placing the jig2 on the jig1 Jig1Rohacell 2. Fixing the Rohacell with vacuum- chucking Attachable stopper for Rohacell

5. July After cured(~24h), removing Jig1 1. Placing Jig1(Rohacell) on Jig2(DSSD) to glue them Procedure8 : Placing the jig2 on the jig1 Jig1 Jig2 Rohacell Jig1 Jig2

5. July zzz… Procedure9 :Placing the PCB on the Rohacell to align Tired man 2. Aligning the bonding pads of the PCB to the bonding pad for N-side of DSSD 1. Placing the Origami PCB on the Rohacell(Jig2) to align Jig2 Attachable support for the Origami PCB Origami PCB Microscope

5. July Procedure10 :Picking up the PCB, gluing and wire-bonding 2. Dispensing glue on the backside of the PCB 1. Placing the Jig3 on the PCB(jig2). And then, picking up PCB to the Jig3 with vacuum-chucking Placing the jig3 again to glue the PCB and Rohacell on the Jig2 4. After cured(~24h), removing Jig3 5. Wire-bonding APV to n-side DSSD Jig3PCB support Jig2Jig3 Jig2

5. July Procedure11 :Wrapping PAs, gluing and wire-bonding 2. Dispensing PAs and gluing to the PCB 1. Wrapping the PAs with special jigs 3. After cured, wire-bonding the PAs to the APV. => Assembly completed We think the developed procedures are based for the full ladder production to extend to the lateral direction. Jig2 Special jig

6 th Open Meeting of the Belle II Collaboration 33Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Assembly – Required Equipment Origami assembly toolbox

6 th Open Meeting of the Belle II Collaboration 34Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Assembly – Finished Module Although the schedule was very tight, we succeeded to finish the first module before the B2GM

6 th Open Meeting of the Belle II Collaboration 35Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Components Testing & Quality Check Assembly Module Test Summary

6 th Open Meeting of the Belle II Collaboration 36Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami Module – Sensor Characteristics Sensor #8: B2HPK_ _8 Dark current: 80V Rpoly: –p-side:16.3 M  –n-side: 2.9 M  –confirmed by measurement IV Curve Specifications of Polysilicon Resistors 18 March 2010 by HPK Process parameters Poly resistor Measurment results (Mega Ohm) Serial No.PsideNside MAXMINAVE 1P1N1P P1N1P P1N1P P1N2 5P1N2N P1N P1N2N P1N3 9P1N3 10P1N3 11P1N3 12P2N2 13P2N2 14P2N2 15P2N2 16P1N2 17P1N2 18P1N2 19P3N2

6 th Open Meeting of the Belle II Collaboration 37Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Stripscan Sensor #8 (n-side) I_strip = nA R_poly =2.76 Mohm C_ac= pF No pinhole HPK: AC AL short at strips 275/276 - could be verified by C_ac measurement! 376. July 2010

6 th Open Meeting of the Belle II Collaboration 38Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Origami – Source Test Made a source test using 90 Sr source Module works well  all APVs ok No I 2 C problems Currently we can read out 8 of 10 APVs (limited by existing readout system) Due to leak of time: –Only one single run performed –No cooling pipe applied –Results are very, very preliminary!

6 th Open Meeting of the Belle II Collaboration 39Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Source Test – Very Preliminary Results Average cluster noise: p-side:3330 e - n-side: 963 e - Some noisy strips on both sides Noise on p-side seems to high Need to investigate Requires measurements with cooling!

6 th Open Meeting of the Belle II Collaboration 40Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Source Test – Very Preliminary Results II Low SNR on p-side  should be > 10 with cooling n-side benefits from short pitch adapter (PA0) and short strips

6 th Open Meeting of the Belle II Collaboration 41Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Components Testing & Quality Check Assembly Wire Bonding Module Test Summary

6 th Open Meeting of the Belle II Collaboration 42Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Summary Origami Components: –New 6” Origami PCB and PAs manufactured by Taiyo Industrial Co., LTD. –Delivered all parts in time –Excellent quality –Only some minor issues –PA1 and PA2 should be slightly thinner to ease bending –Some design issues  will be solved with next batch Assembly Procedure –Design and production of jigs within few weeks, thanks to effort of Onuki-san –Proposed assembly procedure verified by building prototype module –In principle scalable for ladder production –Only minor modifications required, e.g. using linear bush to enhance precision Module Performance –All APVs work well –High noise level on p-side  but currently no cooling applied –More tests and analysis required –Beam test and irradiation scheduled for October 2010

6 th Open Meeting of the Belle II Collaboration 43Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Thank you for your attention

6 th Open Meeting of the Belle II Collaboration 44Christian Irmler (HEPHY Vienna), Yoshiyuki Onuki (Tohoku University)5. July 2010 Backupslides