CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen1 ATLAS MDT-ASD Integrated Circuit Production And Testing Plan E. Hazen – Boston University.

Slides:



Advertisements
Similar presentations
ITSF STORE BUSINESS SOLUTION PRESENTATION. STORE MODULE INCLUDES: Material Management Purchasing Components Handling Shipments Receiving of parts Store.
Advertisements

Aims e-Business Applications An Overview of Aims Inventory and Procurement Management Design By: Shaikh Abdul Aziz.
Databases Using Information. What is a Database? A database package allows the user to organise and store information. This information can be sorted,
What is New in Inventory & Purchasing? Presented by: Derek Kratz.
Seog Oh/ Duke University/June, 2003 TRT/ ATLAS week at CERN Duke Production Status.
Product Receiving, Storing, and Issuing
WMS: Using LPNs and the Packing Workbench
Serialization, Item Attributes & Quality Control Hank Canitz – Sr. Director Industry Solutions, QAD Marketing QAD Midwest User Group.
Marketing Co-Op. The package = physical container or wrapping for a product It is an integral part of product planning and promotion  10% of the retail.
TABLE OF CONTENTS System Plus Consulting is pleased to publish a reverse costing report on the SJEP170R550 silicon carbide (SiC) power transistor from.
Getting the chip fabricated and tested Dr.K.S.Gurumurthy, Bangalore University Mr. Senthil Kumar, Kongu Engg College,Erode Dr.Tilak, GEC, AP Dr.Bhanu Bhaskara,
MDT-ASD PRR C. Posch30-Aug-02 1 Specifications, Design and Performance   Specifications Functional Analog   Architecture Analog channel Programmable.
ATLAS MDT Electronics Status ● ASD Chip Design (with Harvard) and Production – Full Rad-Hard test campaign completed – Production order for 67,400 parts.
Silicon Design Page 1 The Creation of a New Computer Chip.
Chip Manufacturing Process
Y. Unno, 2007/2/26 sLHC sensor R&D Module Plans (Nobu) Manufacturing plans, including financing (Nobu) Sensor Specs (Nobu)
From Concept to Silicon How an idea becomes a part of a new chip at ATI Richard Huddy ATI Research.
QAD Customer Day – Santa Clara, CA QAD SERIALIZATION, ITEM ATTRIBUTES, QUALITY CONTROL & LOT TRACE WORKBENCH Simplifying Industry Compliance, Materials.
Tom McMullen Week 9 1/4/2013 – 5/4/2013. LETI wafer thinning project flow Phase 1 IDProject NameOwnerDaysStartEnd 3-Feb10-Feb17-Feb24-Feb3-Mar10-Mar17-Mar24-Mar31-Mar5-Apr12-Apr19-Apr26-Apr.
Mind Board Company Profile Company Profile. Meets the challenge of Meets the challenge of creating complex designs PCB DESIGN CENTER.
Digital Circuit Implementation. Wafers and Chips  Integrated circuit (IC) chips are manufactured on silicon wafers  Transistors are placed on the wafers.
Sensor overview Ulrich Heintz Brown University, Providence, RI 6/18/2015U. Heintz - Sensor Overview 1.
& Making it Work Together. Why Manco Systems ? Interface with MANMAN Understanding of Bullard’s Needs Willing to Modify ManBar System Completeness of.
ILearningCampus.com Understanding by doing and learning by talking.
MDT-ASD PRR 28 Aug ’02 J.Oliver Quality Assurance, Production Testing, Database Chip certification, required tests Expected yield QA – Test plan  Production.
Smartcard Evaluation TM8104 – IT Security Evaluation Linda Ariani Gunawan.
ECEn 191 – New Student Seminar - Session 5: Integrated Circuits Integrated Circuits ECEn 191 New Student Seminar.
1 Production and QA of Barrel / Endcap Heat Exchangers ATLAS SCT PRR April 13 th & 14 th 2005John Morris – Queen Mary, University London Heat Exchanger.
March 20, 2001M. Garcia-Sciveres - US ATLAS DOE/NSF Review1 M. Garcia-Sciveres LBNL & Module Assembly & Module Assembly WBS Hybrids Hybrids WBS.
Magnetic Material Specification and Procurement Strategy Dawn Munson 1.
WP1 WP2 WP3 WP4 WP5 COORDINATOR WORK PACKAGE LDR RESEARCHER ACEOLE MID TERM REVIEW CERN 3 RD AUGUST 2010 Michał Bochenek Work Package 3: On-Detector Power.
From Research Prototype to Production
©2004 Deloitte Drop Shipment and Back to Back Order Processes in Oracle 11i July 19, 2004.
Product Development Chapter 6. Definitions needed: Verification: The process of evaluating compliance to regulations, standards, or specifications.
Chapter 24 Stock Handling and Inventory Control 1 Marketing Essentials Chapter 24 Stock Handling and Inventory Control Section 24.1 The Stock Handling.
Eng. Mohammed Timraz Electronics & Communication Engineer University of Palestine Faculty of Engineering and Urban planning Software Engineering Department.
An Overview WMS. Benefits Faster Turnaround times Optimize your resources Reduce Paper work Seamless integration with transaction (ERP) systems Control.
Aloe Vera of America: A Quality IASC-Certified Producer of Aloe Vera Presented by Walt Jones.
Concluding Summary WBS1.1.2 SCT Subsystem A. Seiden BNL March 2001.
CMSC 611 Evaluating Cost Some material adapted from Mohamed Younis, UMBC CMSC 611 Spr 2003 course slides Some material adapted from David Culler, UC Berkeley.
Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing.
Fabrication Technology(1)
Advanced Samples Integrate label printing to existing information system Labels with variable contents should print automatically when the new products.
Tom McMullen Period 3 Week 9 8/4/2013 – 12/4/2013.
Estimated schedule, costs and number of ABC130 needed Tony Affolder.
1 ME1/1 ODMB Production Readiness Review: Schedule and Budget Darien Wood Northeastern University For the ME1/1 Electronics Project.
Technology Supply Chain Management
CS-EE 481 Spring 2007 March University of Portland School of Engineering Project Beaver Marsh: Digital Odometer Team Kirk Chen Josh Eby Brandon Pearsall.
DOE/NSF Review of U.S. ATLAS May 21-23, 2003 CSC Mechanics and Electronics Paul O’Connor Tom Muller BNL May 22, 2003.
Silicon Design Page 1 The Creation of a New Computer Chip.
Production Database Apollo Go, NCU Taiwan Preshower Silicon PRR July 5, 2001.
Module 12 - part 2Slide 1 of 23 WHO - EDM Basic Principles of GMP Documentation Part 2 Part One, 14.
CMS Upgrade Workshop, FNAL, Oct 28-30, O.Prokofiev Update ME4/2 Chambers and Tooling A construction of new ME4/2 prototype at CERN Factory tooling,
Steinar Stapnes, LHCC June The ATLAS inner detector TRT endcap A+B TRT endcap C TRT barrel SCT barrel SCT endcap Pixels uWhole ID sits inside bore.
Logo area 11 T Wire: Procurement Strategy and QA/QC B. Bordini, A. Ballarino, M. Macchini Acknowledgments: thanks to E. Charifoullina for her contribution.
MRP (Material Requirement Planning) The main function of material requirements planning is to ensure material availability on time. MRP helps monitor the.
QAD Customer Day – Santa Clara, CA QAD Customer Value Day WELCOME!
TABLE OF CONTENTS System Plus Consulting is pleased to publish a reverse costing report on the new generation of GaN power transistors from EFFICIENT POWER.
Cypress Manufacturing
GLAST Large Area Telescope:
EWLP 309-pin by Casio Micronics – Fujitsu
Sensor Wafer: Final Layout
Innovia Consulting Customer Conference 2018
Computer Architecture
How do you process 17,200 computers and 5,060 iPads in less than 7 weeks? Frank Spinelli July 10, 2012.
Pico-second TDC Schedule & Production
Chapter 5 Exercise 2 Assume that an order has been placed with your company’s ERP system. These events occur: The customer’s credit is automatically checked.
Partner Portal Training document
Presentation transcript:

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen1 ATLAS MDT-ASD Integrated Circuit Production And Testing Plan E. Hazen – Boston University

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen2 Chip Production Plan Overview Packaged devices purchased through MOSIS No wafer/die level testing Packaged devices tested by us on custom-made automatic tester Database of key parameters kept; devices serialized Generous (15%) spares allotment kept in storage indefinitely (dry N 2 ) for repair/replacement

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen3 Chip Production Plan Wafer Layout Agilent AMOS14TB process (0.5  m) Die size 3.2 x 3.9 mm 5 x 4 die per field 45 fields / 900 die per wafer 6 inch wafers

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen4 Chip Production Plan Wafer/Chip Yield Wafer Yield –25 wafers started per lot –15 good wafers guaranteed per lot –MOSIS expects to ship 20 wafers Our estimates based on 15 wafers are likely quite conservative Die yield –90% based on test of 100+ devices –Others’ experience with this process is similar We use 80% yield to be conservative

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen5 Chip Production Plan Estimate of Quantity Required

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen6 Chip Production Plan Fabrication Steps GDS File sent to MOSIS (identical to final prototype file) MOSIS arranges production: –Layout of reticle site with 20 identical chips –Manufacturing of mask set –Wafer fabrication at Agilent –Wafer qualification using test structures –Shipping of finished wafers to packaging vendor Delivery of packaged ICs to us

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen7 Chip Production Plan Post-Production Processing Receive parts in sealed bags / trays Unpack and serialize (barcode labels) Test in automatic tester –Assume throughput of 3 chips/minute (3-5 sec test) Total test time about 10 man-weeks –Record all parameters in database –Categorize: Not Functional, Partially Functional Fully Functional; several “Quality Grades” Store in dry nitrogen before assembly Seal in moisture-proof bags for shipment to assembly house

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen8 Chip Production Plan Automatic Tester Automatic Test Station –Custom designed for MDT-ASD –Full AC/DC Test in 3-5 sec –All parameters recorded directly in database More details to follow!

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen9 Chip Production Plan Schedule

CERN 30 Aug 2002ATLAS MDT-ASD PRR -- E. Hazen10 Chip Production Plan Preliminary Quotation (Previous estimate was $335,000 total)