US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 1 US CMS Silicon Tracker Project

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) m End Caps (TEC 1&2) 2,4 m Inner Barrel & Disks (TIB & TID) Outer Barrel (TOB) volume 24.4 m 3 running temperature – 10 0 C 210 m 2 of Silicon Strips

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 3 Blue = double sided Red = single sided Strip lengths 10 cm (innermost) to 20 cm (outermost) Strip pitches 80mm (innermost) to 200mm (outermost) 500 mm high resistivity 320 mm thick low resistivity Silicon Strips

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 4 Kapton-bias circuit Carbon Fiber Frame Silicon Sensors Front-End Hybrid: F lex-ceramic laminate w/integral Kapton cable Pitch Adapter Kapton cable Pins Module Components

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 5  Single sided p/n Industry standard Mass producible at low cost  Surface radiation damage Increases strip capacitance (noise) p/n ok after inversion if adequately over-depleted  High Breakdown Voltages Specific design and processing rules for guard & strip geometries Al strip layer acts as a field plate to remove high field region from Si bulk to Oxide Technology

ROD INTEGRATION Aachen Karlsruhe Strasbourg ZurichWien PETALS INTEGRATION Aachen Brussels Karlsruhe Louvain LyonStrasbourg Brussels Wien Lyon TECassembly TECassembly CERN Frames: Brussels Sensors: factories Hybrids: Strasbourg Pitch adapter: Brussels Hybrid: CF carrier TK ASSEMBLY At CERN Louvain Strasbourg Pisa PerugiaWien BariPerugia BariFirenzeTorinoPisaPadova TIB-TID INTEGRATION FNAL UCSB TOBassembly TIB-IDassembly At CERN PisaAachenKarlsruhe.--> Lyon Karlsruhe Pisa Sensor QAC Module assembly Bonding & testing Sub-assemblies FNAL US in the tracker Integration into mechanics RU FNAL UCSB

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 7 Covered in this talk  Status of Production parts For Modules – Sensors, Hybrids and Module Frames For Rods – Rod Frames  US Readiness US Group Evolution past year and upcoming year Status of all production equipment and manpower  Cost Performance and Schedule

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 8 Components Overview  Stockpiling Parts Now ↔ but with some caveats Sensors (500  m thick) SGS Thomson (ST) ↔ Many problems. Production stopped Hamamatsu (HPK) ↔ Excellent quality. Deliveries behind expected Sensor Frames from Belgium/Pakistan: on track Problems over the past few years appear to all be worked out for now Hybrids from Cicorel/Hybrid SA/CERN ↔ critical path Several design flaws and processing quality issues uncovered. Last one now being resolved Rod Frames from Helsinki/CERN ↔ recent mistake found on some Various residual problems have mostly been found and addressed. One found this week but not expected to cause any delays More may arise with experience..

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 9 August ‘03 US uncovered a problem with ST sensors December ‘03 (3 day sensor workshop at CERN) Re-probing ~1000 sensors in US and EU indicates quality has degraded from original US group conclusion: degradation in time – possible chemical deterioration. January ’04: Place orders with HPK for masks and prototypes February ’04: ST agrees to significant changes in QC and stable processing with the aim of being re-qualified at July ‘04 tracker week. Also agrees to cut order from 18,000 to 11,000. CMS places order with HPK for 7000 sensors May-July ’04: ST delivers 1000 qualification sensors. US builds 177 modules. Sees time evolution in at least 2 modules. Sensor groups see time evolution in 5% of sensors probed. Tracker week - July ’04: probing groups together with ST uncover definitive evidence of corrosion resulting from large phosphorous content in surface oxide. ST is not qualified by CMS. Timeline of ST Sensor Issue

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 10 CMN effect features: Group of noisy strips with a “turn-on” voltage at which all 128 channels show high noise can appear after thermal cycles often accompanied by other types of degradation such as pinhole development, more CMN Often correlated with high current Later: a second chip develops a high noise channel which causes common mode noise Channel previously only had a slightly higher noise (0.3 ADC) Situation as of early‘04 1. Common Mode Noise (CMN)

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 11 Strip 420 & 421 (4µA 15µA). Switching probe chuck vacuum on and off switches these strips on and off. Effect is reproducible. No visible defect seen. without vacuum with vacuum As of early‘04 2. Vacuum effect ↔ single strips !

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 12 OB2 sensors “It’s like no diode I’ve ever seen Gromit” - Wallace late ’03 early ’04 3. Peculiar IV Curves

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 13 As of early‘ Long term instability

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 14 Good sensor As of early‘04 5. Structure in leakage current

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 15 initial 3 hrs, no hum. nothing more 1h30, 40% RH Þ new stains on bias (not always visible on video, see later) 30 min, 40% RH Þ stains on guard first usually As of July ’04 tracker week 6."Dots and Stains" development

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 16 Investigation by Strasbourg and Karlsruhe (with help of the Fraunhofer Institute Chemische Technologie) The ratio of elements in white areas of stains indicates the existence of Aluminum-oxide Corrosion ! As of July ’04 "Dots and Stains" origin

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 17 Confirmation by ST Passivation (1 µm) Aluminum (2 µm) Triple oxide layer (1.5 µm) Aluminum corrosion As of July ’04 Both dots and stains are micro-corrosions of the aluminum surface. The mechanism that drives this phenomenon can be the following: Humidity reacts with Phosphorus (present in a 4% concentration into the passivation oxide) and forms an acid (probably H 3 PO 4 ), that corrodes a superficial layer of Aluminum.

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 18 As of July ’04 Failure rate of qualification sensors in 72 h period is 5%  233 sensors tested 72h (room temeperature, r.h.=25-30%) 7a. Long term sensor tests

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 19 7b. Long term TOB module tests sec Maxed out ADC Bits at this point nAAfter 7 hours, bias current started to increase New high noise channels seen in subsequent tests  Dark marks on bias ring occur near high noise channels

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) modules tested 1 module with current increase during LT test As of July ’04 7c. Long term TEC module tests

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 21 The Current Situation  Need 18,200 thick sensors installed in CMS tracker 20,000 total (10% spares) originally all ST Shifted orders to HPK: Winter ’04: 7,000 Summer ’04: 4,500 Autumn ’04: 5,200 TOTAL of 16,700: (1,500 short of installation requirement) Agree to accept ~3,000 sensors from ST Installation of at least 1,500  HPK Shipments Started on schedule in June ’04 Did not yet reach levels expected

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 22 Original Schedule Jan-04Feb-04 Mar-04Apr-04May-04Jun-04 Jul-04Aug-04Sep-04 Oct-04 Mask Production Sensor Pre-Production Sensor Qualification 240 Sensor Production Cumulative Production Sensor Acceptance  Initial plan showed 1 st 7000 sensors delivered by November  Current: ~4000 delivered.  Met with Yamamoto (v.pres.HPK) Oct. 11 at CERN (JI on video: 3 problems identified: (One month lost while analyzing problems) 1.Poly Silicon – operator error caused over-etching 2.Backside SiO 2 too thin – caused high leakage currents 3.Scratches – due to a problem with automated handling devices Recent batches have ~75% yield allowing ~1300/mo. rate If achieve 85-90% then will deliver ~1500/mo.  Agreed: if order placed by Jan. HPK can deliver all 16,700 by Oct Also discussed option to extend quantity by  3,000

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 23  Summer 2003 US finds broken cable traces US reviews handling and studies alternative handling schemes CERN finds breaks are widespread Vendor says design is fatally flawed New design implemented after only 2 months delay  Winter 2004 US finds strange failure mode in modules US traces the problem to the hybrid CERN responds instantaneously – halts all hybrid production Find vias are not properly plated, with breaks occurring at unknown rate US Halts production of TOB and TEC modules except for ST qualification Many TEC & TIB modules already done in EU (small radius HPK thin sensor modules) EU continues building  Summer 2004: Vendor bought out. Management serious about solving this problem, with better resources. 4 variations of design processed  Autumn 2004: QC Engineer at vendor - all trials are highly successful! Week October CMS qualifies substrate Week October 22 – CMS to qualify fully loaded hybrids Timeline of Hybrid Issues

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 24  Flex cable fragility Problem was quickly solved Good US/CERN relationship CERN relationship with vendor 1.Hybrid Cable Problem

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 25 Cu Example of a good via Example of a bad via 2.Good Vias and Bad Vias

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 26 US Hybrids Delivery Schedule  Oct. ’04: 200 TB hybrids old processing, known via prob. – hesitant to use with HPK sensors  Nov.’04: 270 TOB hybrids not the most recent design but all passed the testing, and fraction was test with all passing extreme thermal testing  Jan.’05: 200 TOB TEC hybrids  Ramping up to Apr. ’05 Monthly rates ~700 TOB, ~500 TEC Half of the TEC will be sent back to Europe after they are wire-bonded and tested at FNAL/UCSB/MEX Each of the 3 North American hybrid processing centers has a minimum sustainable capacity of > 24/d  > 1600/mo We can lose a hybrid processing center at any time without loss of hybrid throughput

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 27  Winter-Spring ’03: CERN reports that modules arriving from US have huge numbers of damaged wirebonds US proposes a successful solution (encapsulate joints) CERN confirms  Winter-Spring ’04: Rochester studies find flexible mother cable in rod can damage module wirebonds in transport CERN/US engineers study problem and design Al stabilizers.  Autumn ’04: US Discovered error in cross-bar placement on roughly 50% of rod frames (type-H). Helsinki developing the repair method. US will ship back ~40 type H rod frames for repair  Large numbers of rods will be stockpiled in advance of full production of modules Module and Rod Transportation

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 28 US CMS Tracker Group Brown University R. Hooper, G. Landsberg, C. Nguyen, H. Nguyen University of California, Riverside (UCR) P. Gartung, G. Hanson, G.Y. Jeng, G. Pasztor University of California, Santa Barbara (UCSB) A. Affolder, S. Burke, C. Campagnari, F. Garberson, D. Hale, J. Incandela, P. Kalavase, S. Kyre, J. Lamb, R. Taylor, D. White + technicians University of Illinois, Chicago (UIC) E. Chabalina, C. Gerber, L. Nigra, T. Ten Fermilab (FNAL) M. Demarteau, A. Ronzhin, K. Sogut, L. Spiegel, S. Tkaczyk + technicians University of Kansas (KU) P. Baringer, A. Bean, L. Christofek, D. Coppage Mexican Consortium: Cinvestav: H. Castilla, R. Perez, A. Sanchez Puebla: E. Medel, H. Salazar San Luis Potosi: A. Morelos University of Rochester (UR) R.Demina, R. Eusebi, E. Halkiadakis, A. Hocker, S. Korjenevski, P. Tipton 19 joined group this past year (includes 3 UCSB technicians) - now adding a few more post-docs & students 9 left the group (includes KSU plus several from UCSB)

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 29 Preparations  Good parts in large quantities are coming in Deliveries will not be smooth Meeting the schedule will require Higher than expected peak production rates Extremely robust and stable production lines Well trained personnel  Previous proven capacity in US is 15 modules/day/site Further capacity expansions Almost no further fabrication equipment needed and no expansion in test equipment required UCSB and FNAL have already completed these changes Achieve by extending work day (split shifts) and/or adding support personnel to major production tasks  Rates now possible: FNAL: 18/day sustainable and 21-24/d peak UCSB: 21/d sustainable and 27-30/d peak

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 30 Assembly Plates UCSB Plates # Fabricated (parts made) # Commissioned (ready to be used) plates used in module production so far TOB R-phi777 TOB Stereo333 TEC R5 R-phi222 TEC R5 Stereo222 TEC R6555 TEC R7*222 FNAL Plates TOB R-phi555 TOB Stereo333 Total29  Total of 29 plates in the US (capacity of 3 modules per plate)  UCSB setup to do TEC.OR.TOB in any given day  All have been exercised and are ready for use.

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 31 US Production Steps/Status TaskCapacityManpower issuesSoftware Issues? Hardware Issues Hybrid Bonding & Thermal Cycle 84/dMexico not yet onlineNo Module Assembly>50/dNoneNo Module Bonding>50/dNoneNo ARC Testing>50/dNoneNo LT Testing200/wkUCR post-doc searchNo ARC LED>50/dNoneNo Module Reinforcing >50/dNoneNo Rod Assembly>6/dNoneNo Single rod test>6/dUCSB post-doc searchYesPossibly Multi-rod burn-in32/wk

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 32  97% modules meet the current stringent geometric specs Few failures are just outside the relative angular requirement  US now applies 2 nd order corrections No new modules outside specs  Production quality excellent! Single Sensor Modules 0.20% Faulty strips Introduced faults < 0.1% rate Two Sensor Modules 0.55% Faulty Strips Introduced faults < 0.1% rate Will be much lower w/HPK D x(Frame-Sensor) ( m m) D x(Sensor-Sensor) ( m m) Dq (Frame-Sensor) (mdeg) Dq (Sensor-Sensor) (mdeg) Module Mechanical Precision

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 33 MC Study of effect of misalignments on pt resolution: single  sample, p T =100 GeV Recent US modules Mean 0.0 RMS 3.5  m Min -7  m Max +7  m Misalignments and PT Resolution

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 34 Hybrid Thermal Cycler/ARCS Status  Recently upgraded code PLL forcing Drifting pedestal check Added xml file auto- upload  UCSB, FNAL and Mexico City test stands are commissioned and ready We have all ARCS equipment+spares we need

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 35 DAQ Equipment Status  2 fully equipped Vienna boxes at UCSB and FNAL  UCR Vienna box has enough DAQ equipment for 4 slot stand TPO needed for 6 slots  2 single-rod stands Just received enough oMUX cards so re-cabling between rod types unnecessary  2 multi-rod thermal cyclers Both MUXs have been used to test 5 rods tested simultaneously Have enough equipment to fully commission system Only 5 MUX cards + DAQ spares missing  To instrument UCR Repair Center & have all critical spare components required in the US we need: 2 TSC – in production? 3 TPO – in production? 2 eMUX boards – “ “ 7 oMUX boards – “ “ 5 VUTRI - in production 10 PAACB – half are built, half being assembled now 10 hybrid-to-utri adaptors – in production

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 36 DAQ Equipment Status II  With current TPOs : With 1 failure we lose either: 70% capacity of a Vienna box 1 single rod system 1 multi-rod system Cannot run more than 16 APVs in UCR stand  Without the additional MUX, VUTRI, PAACB, hybrid-to-utri adapter boards Can’t run UCR LT at full capacity which is crucial to ops of US Repair center  With current TSC complement: With 1 failure we lose either: 1 Vienna box 1 single rod stand, or 1 rod thermal cycler Component shortages and failures ↔ potential to severely limit production testing capacity

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 37 Backup Equipment  Spare sensor and hybrid tools were produced at UCSB for UCSB, FNAL and Brussels.  Upgraded OGP computer OS and OGP software Automated routine occasionally missed fiducial marks. The new software fixes this problem.  Set up back-up gantry computers with spare U600 controllers and expansion cards already installed.  We purchased backup components for every piece of production equipment or tooling that, if it were to fail, would cause a reduction in production rates.

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 38 US Module Types

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 39 6 R6 modules built using new HPK sensors All 6 modules are perfect Not a single flaw IV profile as expected Turn-on at low voltage Plateau bias current ~ nA First HPK Module Results From UCSB

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 40 UCSB TEC Production  Miscellaneous info Have built all required types successfully: R5S, R5N, R6, R7 25 shipping boxes (20 modules each) built All carrier plates (100 per type) and all wirebond fixtures complete  Capacity Could saturate UCSB production capacity with TEC modules Will depend on need and availability of parts as well as TOB production parts availability and schedule Another step higher in production capacity (by extending work day via overlapped shifts): Bonding and Testing capacity adequate LT testing capacity limit is ~100 per week Eventually will be mostly TEC (TOB burn-in shifted to rods) or sampled

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 41 Outstanding problems/issues  DB stability For our production rates, we must automate all DB queries. Need to standardize and maintain stable all data structures We rely on data to be accurate and complete from all preceding processing of components and structures. Successfully collaborating with our int’l colleagues  Old or un-installable components Prefer to remove them physically from our production sites and to have them properly marked in DB  Rods We have recently achieved major milestones with rods but we are not out of the woods. See below

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 42 Rods  Rod assembly understood  Rod Testing Single rod testing is under control Multi-rod Had many problems with software and hardware Recently achieved major milestone at FNAL Can now run maximum at capacity (8 SS rods or 6 DS rods – i.e. up to 72 modules) for 3 days with thermal cycles!  Remaining Get UCSB multi-rod test stand operational at same level as FNAL Had problems with some hardware- now fixed To finalize fault finding tests Finalize Database info and transfer methods  Need experience with many rods to determine if there are issues with components.

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 43 Mechanics:Tracker Outer Barrel 0.9 m Full Prototype Wheel (for MSGCs) Final Cylinders at CERN Rods before/after modules installed

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 44 Support mechanics : CF space frames and/or Honeycomb structures   Mechanics: Tracker Inner Barrel

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 45 Digital Optical Hybrid Interconnect Board Analogue Optical Hybrid Frontend Hybrid R#2 R#4 R#6 Mechanics:Tracker End Caps

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 46  May 2003 Beam Test (Bunched 25 ns beams of muons and pions) Systems of 6-10 TIB, TEC, TOB modules Detector performance as expected!  May 2004 Beam Test Multiple rods, petals, and shells Larger system integration tests Tracking tests Position resolution, hit efficiency Beam Direction Substructures in Test Beams

Michael EppardTest General Meeting The TOB Cosmic rack in the test beam in June 2004  Michael Eppard (CERN)  on behalf of TOB CERN  23rd July 2004

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 48 S/N > 32 S/N Module 300V (PEAK)

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 49 Ivan Reid ORCA reconstruction of tracks

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 50 Cost Performance  Delays have cost us Recently extended production to Jan Net increase of 600k$ in project  Other US costs Paid for Masks (NRE) at Hamamatsu to be able to transfer sensor order from ST 290k$ Misc. equipment for higher/more robust production ~100K$  Anticipated costs US Tech. to work at CERN on hybrids for 6 months 50k$ (?)  Currently schedule has no contingency…

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 51 SST Schedule Completion: Jan An aggressive schedule Will be revised: Assumes 500 hybrids/wk Actual 400 hybrids/wk

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 52 Summary  No longer have a manpower shortage In process of adding some personnel at UCSB  Have studied all possible threats to production stability Purchased or manufactured spares  Further increased capacity to ~50 modules/d Requires manpower (~ 4-5 FTE total)  Systems All stages of production have been exercised and are near to final except rod testing Multi-rod stands rapidly converging

US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 53  Strips have been at war with poor components ST sensors have too many uncertainties Switched to HPK! Hybrids problem is solved – large deliveries starting early ‘05  US Role has been extremely important  We are doing everything we can do Conclusion