Mar KOLON Electronic Materials B.C. TDS (Technical Data Sheet) KP-2100

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 2 KS-8700 Series GENERAL FEATURES Scum Free Excellent Plating Chemical Tolerance Excellent Alkaline Etching Resistance APPLICATION Plating Process Selective Gold Plating Alkaline Etching FILM SPECIFICATION Thickness : 40, 50 m Color (Unexposed) : Green Color (Exposed) : Blue

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 3 General Properties [Circuit Properties] KP-2140KP-2150 Dry film Thickness (  m) 3848 Minimum Develop Time (sec.) 2634 Step21sst41sst Exposure Property Exposure Energy *1 (mJ/cm 2 ) Circuit *2 Properties Resolution (  m) Adhesion (  m) L/S=1/1 Resolution (  m) *1: Exposure Energy ; Real Exposure energy (ORC UV meter), *2: Circuit properties : Perkin-Elmer 5Kw Collimated Exposure, KOLON TEST Artwork ( Glass Artwork )

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 4 General Properties [Strip Properties] KP-2140KP-2150 Step21sst41sst Strip Properties Stripping Time (sec) 3.0 wt% NaOH Tenting Strength(kg) Instron Elongation(mm) ScumScum GeneratorScum free Skin Size - S : Small, M : Medium, L : Large

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 5 Sensitivity vs. Exposure Energy Test condition Stouffer 21 and 41 Step Tablet, Resist step Exposure System : Perkin-Elmer 5kw Collimated Exposure

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 6 Resolution Test Condition Stouffer 21 and 41 Step Tablet, Resist step Test Artwork : KOLON Test Artwork(Glass Artwork) Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110  C, Pressure 4kg/cm 2, speed 2.0m/min Develop. condition : 1.0wt% Na 2 CO 3, Temp. 30 ℃,Break Point 50%, Spray pressure 1.5kg/cm 2

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 7 Adhesion (Minimum Survived Line Width) Test Condition Stouffer 21 and 41 Step Tablet, Resist step Test Artwork : KOLON Test Artwork(Glass Artwork) Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110  C, Pressure 4kg/cm 2, speed 2.0m/min Develop. condition : 1.0wt% Na 2 CO 3, Temp. 30 ℃,Break Point 50%, Spray pressure 1.5kg/cm 2

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 8 1/1 Resolution Test Condition Stouffer 21 and 41 Step Tablet, Resist step Test Artwork : KOLON Test Artwork(Glass Artwork) Lamination Condition : Auto cut sheet laminator(Hakuto 610-I), Temp. 110  C, Pressure 4kg/cm 2, speed 2.0m/min Develop. condition : 1.0wt% Na 2 CO 3, Temp. 30 ℃,Break Point 50%, Spray pressure 1.5kg/cm 2

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 9 Strip Properties Test Condition Pretreatment ->Lamination->Exposure->Develop->Etching -> Strip Temperature : 50  C, Conc. : NaOH 3, 4 wt% TEST Method : Dipping Method

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 10 Tenting: INSTRON Method KP-2140KP-2150 Step Held (21 SST and 41 SST) 8/21 ; 22/41 Strength(kg) Elongation(mm) INSTRON X = 3Ø Y = 6Ø X = 3Ø Y = 6Ø Stress : Load of Max load when the 6mm hole broken. Average of 8 times test. Strain : Displacement during the hole broken at Max.load(mm) Average of 8 times test.

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 11 SEM Images of KP-2140 (X200, X350) Line / Space = 50 / 50  m 200 Times 350 Times 19 / 41SST(7 / 21SST)22 / 41SST(8 / 21SST)25 / 41SST(9 / 21SST)

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 12 SEM Images of KP-2150 (X250, X400) Line / Space = 50 / 50  m 250 Times 400 Times 19 / 41SST(7 / 21SST)22 / 41SST(8 / 21SST)25 / 41SST(9 / 21SST)

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 13 Evaluation Parameters (Sensitivity) Kolon Step (21) Kolon Step (21) Exposure Step Held Development

[Do It Now] [Execution defines Value] Confidential : Properties of Kolon Ind., Inc. 14 General Process Guideline ProcessRecomendationSpecification Lamination Roll Temp. (°C)110 ± 10 Exit Temp.: 50  10 °C Speed (m/min)2.0 ± 1.0 Roll Pressure (Kgf/cm 2 )3.5 ± 1.5 Holding Time Time (min)15min – 8hrsUnder Yellow Light Exposure Exposure Energy (mJ/cm 2 ) Step Held 7~10/21 ST Without Artwork Resist Step Holding Time Time (min)15min – 8hrsUnder Yellow Light Development Chemical1.0 ± 0.2wt% Na 2 CO 3 *Antifoam: Non-silicon Type (0.05 ~ 0.1 vol%) Temp. (°C)30 ± 2 Break Point50~70% Spray Pressure (Kgf/cm 2 )2.0 ± 0.5 Stripping Chemical2 - 4wt% NaOH Temp. (°C)45-55 Break Point40~60% * Clean Room: 20~22 °C, 50 ± 10 % RH