©2005 David LavoDiagnosis & FA Case Study1 Fault Diagnosis & Failure Analysis Case Study David Lavo January 13, 2005.

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Presentation transcript:

©2005 David LavoDiagnosis & FA Case Study1 Fault Diagnosis & Failure Analysis Case Study David Lavo January 13, 2005

©2005 David LavoDiagnosis & FA Case Study2 Fault Diagnosis Analyze the logical behavior of the failing circuit Infer likely fault sites and types Result is a list of nets or gate nodes Used to narrow the search for the defect during physical failure analysis

©2005 David LavoDiagnosis & FA Case Study3 Failure Analysis A physical search for the actual defect If fault diagnosis is not available, must consider the whole die A variety of techniques is used for analysis: –Optical and electron microscopes –Detection of heat and light emission –Varying voltage and temperature to characterize the failure –Expertise is important

©2005 David LavoDiagnosis & FA Case Study4 Case Study: HP Printer Controller Customer-returned parts Total of 12 parts that failed HP’s system test All parts had originally passed wafer & package tests 6 failed production tests upon return, 6 passed Only chips that fail tests are candidates for fault diagnosis

©2005 David LavoDiagnosis & FA Case Study5 Diagnosis Results Candidate List: No. Score Description harmony_core_0#pci_top_0#pcic_mas_top#pci_master#U510*Q:n673( )%SA harmony_core_0#pci_top_0#pcic_mas_top#pci_master#U509*Q:n663( )%SA harmony_core_0#pci_top_0#pcic_mas_top#pci_master#U515*Q:n719( )%SA harmony_core_0#pci_top_0#pcic_mas_top#pci_master#U454#OR_2*I2:D( )%SA harmony_core_0#pci_top_0#S_26*Q:n_27( )%SA harmony_core_0#pci_top_0#S_20*Q:Pci_Master_Rdy( )%SA

©2005 David LavoDiagnosis & FA Case Study6 Schematic View

©2005 David LavoDiagnosis & FA Case Study7 Artwork View (Cell Outlines) U510 U454 U509 U475 U493

©2005 David LavoDiagnosis & FA Case Study8 Full-Die Artwork (0,0)

©2005 David LavoDiagnosis & FA Case Study9 Zoom Level 1

©2005 David LavoDiagnosis & FA Case Study10 Zoom Level 2 – Metal 5

©2005 David LavoDiagnosis & FA Case Study11 Zoom Level 3 – Metal 5

©2005 David LavoDiagnosis & FA Case Study12 Zoom Level 4 – Metal 5

©2005 David LavoDiagnosis & FA Case Study13 Zoom Level 5 – Metal 5

©2005 David LavoDiagnosis & FA Case Study14 Final Zoom Level – Metal 5

©2005 David LavoDiagnosis & FA Case Study15 Metal 4

©2005 David LavoDiagnosis & FA Case Study16 Metal 3

©2005 David LavoDiagnosis & FA Case Study17 Metal 2

©2005 David LavoDiagnosis & FA Case Study18 Metal 1 n27 n673 GND VDD

©2005 David LavoDiagnosis & FA Case Study19 FA Tools Optical Microscopes –Visual inspection of the package, wires, and die X-Ray –Check wire bonding Liquid Crystal –Shows “hot spots” from shorts & leakage Photon Emission Microscopy (PEM) –Also detects radiation from “hot spots” Scanning Electron Microscope (SEM) –Inspection of small features

©2005 David LavoDiagnosis & FA Case Study20 FA Tools (Cont) Atomic Force Microscopy (AFM) –Topographical surface examination Focused Ion Beam (FIB) –High-powered ion stream –Can cut away material or lay down metal Laser –Used for cutting, etching, and heating of metal lines Mechanical Lapper –Grinds away layers of the die Chemical Etcher –Chemically removes certain materials

©2005 David LavoDiagnosis & FA Case Study21 Delayered Die – Metal 2/1 N6 N7 N8 N3 N5 N4

©2005 David LavoDiagnosis & FA Case Study22 SEM View of Metal 2/1 N6 N3 N4 N7 N5 N8 Vdd

©2005 David LavoDiagnosis & FA Case Study23 SEM Close-Up N3 N6

©2005 David LavoDiagnosis & FA Case Study24 Tilted SEM N3

©2005 David LavoDiagnosis & FA Case Study25 Delapped to Metal 1 (Mostly) Metal 1 (N9) Metal 1 (N10) Metal 2

©2005 David LavoDiagnosis & FA Case Study26 SEM Close-Up

©2005 David LavoDiagnosis & FA Case Study27 After Chemical Etch (Clean-Up)

©2005 David LavoDiagnosis & FA Case Study28 Final Results Defect found was a metal-1 to metal-1 bridging fault Defect was near but was not the stuck-at fault implicated by fault diagnosis An exact match to a stuck-at fault is commonly thought to be conclusive, but …. Nearness is important!