SGH-Q200 Service Training Kyoungin Kim R&D Group 3, Mobile Comm. Div. Samsung Electronics

CONTENTS General Information How to assemble the SGH-Q200 Block Diagram and Schematics Circuit Description Phone test Download, Autocal, IMEI , Repair PGM.. Power Levels and Waveforms on PBA Troubleshooting Guide (Refer to SVC Manual)

General Information Frequency range: Channel bandwidth: 200kHz EGSM DCS TX 880~915MHz 1710~1785MHz RX 935~960MHz 1805~1880MHz Channel bandwidth: 200kHz Fundamental frequency:13MHz Intermediate frequencies Tx IF: 270MHz(G), 135MHz(D) Rx IF: 1’st IF ->225Hz, 2’nd IF -> 45MHz

General Information Solution : Agere system(Lucent technology) Design : Dual folder LCD : 128 x 128 Memory : 48M/4M Size and Weight :85(H)x47(W)x19.8(D), 90g Funtion : GPRS Class 8, EFR/FR, WAP, GAME ..etc Operating Time Talk TIME Stand by TIME SLIM(720mA) Up to 150min Up to 70 hr STANDARD(900mA) Up to 180min Up to 85 hr

General Information The chipset for SGH-Q200 Trident : Baseband processor CSP : conversion signal processor PSC2005 : Power Management IC LRS1337 : Flash Memory(SRAM) Atmel : Flash Memory APCIC : Auto Power Control IC BRIGHT3 : Dual band Tranceiver

Exploded View of SGH-Q200

Top View of SGH-Q200

Bottom View of SGH-Q200

Block Diagram (Radio Part)

Block Diagram (Baseband Part)

Circuit Description: Front-End Antenna (ANT1002) Transmitting and Receiving the information desired from air interface. RF Test Switch (CN1001) This is for adjusting and testing the handset in conjunction with the test equipment such as HP8922M or HP8960. Diplexer (U1006) It operates such like a combination of Rx filter and Tx filter, and provides agreeable isolation between Tx and Rx.

Circuit Description: Rx LNA It amplifies weak signal by 14~20dB without increasing the noise significantly. This provides “Step Gain AGC” of ~35dB so that it supplements narrow dynamic range of Rx AGC. RF Rx SAW Filter (F901:GSM , F903:DCS) It has the bandwidth of Rx frequencies, and suppresses interferers which can do affect the IF signal 1st Down-conversion Mixer Received RF carrier is converted to 1st IF (225MHz). Local signal is needed for frequency mixing. It has ~9dB conversion gain, in general.

Circuit Description: Rx IF SAW Filter (F902) Center frequency is 225MHz. It suppresses unwanted image signals made in the 1st mixer 2nd Down-conversion Mixer 1st IF is converted to 2nd IF of 45MHz.. 2nd IF LC Filter It has 200kHz bandwidth with 45MHz center frequency. It attenuates images from the 2nd mixer RSSI It produces DC voltage according to the received signal strength.

Circuit Description: Rx PGA Sets the programmable gain array to one of 50 values separated by 2dB [000000] ~[110001]

Circuit Description: Rx - Digital Rx AGC The purpose of Rx AGC is to maintain the Rx I/Q voltage level, regardless of the received signal strength. In general, Rx AGC has the dynamic range of around 70dB.. Rx I/Q Demodulator It generates both in-phase (I) and quadrature (Q) components of the signal while translating the IF signal to baseband.

Circuit Description: Local VC-TCXO (OSC801) 13MHz fundamental frequency for PLLs and Baseband chipset (U601). RF VCO (OSC901) It supplies Local source frequency higher than RF carrier by 225MHz in conjunction with PLL(GSM) Lower than RF carrier by 225MHz in conjuntion with PLL(DCS) Higher than Tx RF carrier by 270MHz in conjuntion with PLL IF VCO (OSC902) It generates 1080MHz frequency for up-converting Tx I/Q signal to Tx IF and Rx signal to RxIF TX VCO (OSC903) Frequency : 880~915MHz(G), 1710~1785MHz(D)

Circuit Description: Tx 1.Tx I/Q modulator Tx I and Q signals are combined and up-converted to 270(G),135(D)MHz frequency. I, Q voltage levels are 1Vp-p, respectively. 2.PAM (U1002) It increases Tx power level so that PA is capable of transmitting the maximum power up to 35dBm High gain 3stage amplifier: 0dBm input Typ 2in/2out dual band amplifier One power control pin with one band switch

Circuit Description: Tx APCIC (U1001) Dual Band Power control IC for TX power Amp has ~55 dB dynamic range, Contains power detector and operantional Amp converts RF power into DC level. 2. Coupler :F1001(G), F1002(D) The coupling factor is 14dB,20dB. That is, “P(PA output) – 14dB,-20dB” is transmitted to the power detector circuitry

Circuit Description: Logic TRIDENT (U601) Baseband Engine Includes the DSP16000 core,ARM7TDMI microcontroller core,and a standard sets of peripherals for the DSP and ARM communicates with Memory, Keypad, LCD, and other peripherals DSP RAM :20k x 16 DSP ROM : 144k x 16 ARM RAM : 2k x 32 RAM(byte writable) ARM ROM : 4k x 32 ROM(mask-programmable) Processor Interface memory : 512 x 16 shared RAM

Circuit Description: Logic TRIDENT (U601) ARM7TDMI 32-bit microprocessor : main call processing. 32.768kHz X-tal Oscillator : the sleep mode The interface circuitry : reset circuit, address bus (A0-A20), data bus (D0-D15), contrognals(CP_WEN,CP_OEN,EAR_EN,LED_CTL, etc), GPIOs, and the communication ports. Communication ports : UART1 and 2, the JTAG etc. UART1 supports HP equipment interface, down loading, and data service. UART2 and the JTAG are used for the software debugging.

Circuit Description: Logic CSP 1099 (U701) Baseband radio and voiceband audio interfaces Baseband receive path Buffer, 10-bit ADC, PGA Baseband transmit path Transmit buffer, GMSK modulator, 9-bit DAC ADC and DACs for Radio and Monitoring 10-bit ADC for sampling RSSI, TXP, and etc Voiceband Receive Path :speaker , mic Event timing and control register To control both B/B receive and B/B transmit activity Power ramping control

Circuit Description: Logic PMIC(PSC2005:U101) Includes six low-dropout voltage regulator LDO1-1.8v, LDO2:VCCD, LDO3:Vrf LDO4-Vapc,LDO5:Vosc/syn,LDO6:VCCA 250ms system reset generator To ensure proper initialization of the system controller 12bit monotonic DAC Pwr_sw1,Pwr_sw2,CS => active low.

Circuit Description: Logic Flash memory Flash ROM:U501(32M x 1),U1010(16M x1) The 48Mbit FLASH ROM is used to store code of the application program. Using the down-loader program, this application program can be changed even after the mobile is fully assembled. SRAM The 4Mbit SRAM is used to store the internal flag information, call processing data, and timer data.

Circuit Description: Logic Power On Press of END key  BATT and POW_ON signals are connected  Q204 turn-on  Q102 turn-on, that is, BATT is connected to VBAT  VBAT is supplied to U101  VCCD and VCCA are applied to U101, U601  VCTCXO signal is enabled  VC-TCXO (OSC801) is operating  Once U601 runs without error, U601 enables POWER_KEEP signal Power Off Press of END key  Q204 turn-on  U601 checks  BB_PWR turns logic high to low  Main application program enter to Power Off mode

Circuit Description: Logic Key Pad The Key Pad is belong to main board. For key-press recognition, the structure of key is consisted of 5 x 5 matrix, which is used input signal key_col(0-4) and output signal key_row(0-4) of Trident. LCD MODULE LCD module is connected to main board by FPCB. This contains an LCD controller. An LCD controller controls the information of displaying from the Trident (parallel 8-bit data) to the LCD.

Test Interface Jig Data cable Test cable

Downloading Setup

Auto calibration Program Setting GPIB CABLE E3632A HP GPIB CARD

Auto calibration Processing

Auto calibration Processing click click click

Auto calibration Processing click

Auto calibration Processing click

IMEI Processing 1.execute winl108tQ200.exe file 2. Select country 3. Click Change H/W ver click

IMEI Processing 1.write H/W ver 2.click write IMEI

IMEI Processing 2.write imei 1.click 3.click 4.click

Repair program Processing

Repair program Processing click click

Repair program Processing

Repair program Processing click

Phone Test Setup PC GPIB CABLE HP8960 Power Supply Gpib cardt TEST PACK GPRS TEST JIG POWER ON SDS S/W - + DC 4.0V SAMSUNG DEBUG SDS D/L DSP JTAG HP8960 Power Supply Gpib cardt RF Test Cable PC Com1 port

Test Information Test Equipment is HP8960 or CMD55. Mode : Test mode (Tx : BCH+TCH, Rx : CW generator) Tx power level pass/fail limit have to be modified to allow calibrated Tx power levels of SGH-Q200

Power Level & Voltage Waveform Rx Chain – Analog: Measurement Environment Test Mode Cont Rx on HP Setup: RF Generator Screen RF input = -50dBm, RF Gen Freq = 947MHz, (Channel is 60) RF Gen Band =GSM

Power Level & Voltage Waveform Rx Chain Ant s/w In LNA In LNA out

Power Level & Voltage Waveform Rx Chain Mixer In Mixer out IF SAW Out

Power Level & Voltage Waveform Rx Chain 2’nd mixer out

Power Level & Voltage Waveform Tx Chain Active Cell mode HP Setup RF input = -50dBm, TCH Channel = 60CH RF Gen Band = GSM

Power Level & Voltage Waveform Tx Chain Tx locking 0.8~2.5V TxIP TXEN1

Voltage Waveforms: Local OSC901 RF Local @ 62CH OSC902 IF Local

Voltage Waveforms: Logic OSC801.4 13MHz TCXO Out osc601 32.768kHz clock

Repair Examples

Baseband Problems Power-On Failure Abnormal Operation of Charging and EL Backlight Abnormal Operation of Vibrator and Buzzer Abnormal Operation of Key, MIC, and LED RF Part : Refer to SVC manual

Checkpoints: Power-On Failure 1.Press END Key or Turn On Auto Power on SW of interface test jig 2.check following Name Node Value VBAT VCON2.1 >3.3V? VCCD U101.4 >2.85V? NO=>check U101,C112 Vrf,Vosc,Vsyn U101.31,35,36 =3.0V? No=>U101.1=1.8V? No=>check U101,C103,C104,C120 Check clock signal U801.4 Freq=13MHz? Vrms>300mV? 900mVpp? No=>check u801,osc801 3. Memory check

Checkpoints: Charging and EL Backlight

Checkpoints: Vibrator and Buzzer

Checkpoints: Key, MIC, and LED Key recognition check Metal Dome Array CN202 pin#1,2,3, and 4 VCTCXO_IN (C807) MIC check MIC400 contact U401 pin#1,2,and5 LED check Control signal =>keypad LED: LED_CTL, =>SVC_LED: SVC_LED(Q601.2:high,Q601.3:low) VCC

Thank you!!