April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 1 EMI AND THERMAL ISSUES THE MAIN ANITA EMI ENCLOSURE AND THE SIP EMI ENCLOSURE HAVE SIMILAR CONSTRUCTION,

Slides:

Advertisements

Similar presentations

EMC Performance The need: –implement transmission lines on flex –protect lines against electromagnetic interference Question –how good does the protection.

Advertisements

ZTF Mechanical Walkthrough Matthew Hoff ZTF Technical Meeting 1.

M.PEGORARO Grounding Workshop 24th Jan 08 DT GROUNDING & SHIELDING Presented by A. BENVENUTI.

Mech Systems Proposed EMI Modifications Marc Campell 9/2/03.

J. H. ChrzanowskiNSTX TF Flag Joint Design Review1 NSTX TF Flag Joint Design Review Fabrication and Assembly April 10, 2003 By: James H. Chrzanowski.

K. Liewer ANITA-Irvine CA 11/25/02 Gondola and Power Systems K. Liewer.

Mechanical Status of ECAL Marc Anduze – 30/10/06.

Status of VLPC Cryo-Cooler Cryostat Design Russ Rucinski (Alan Bross) Fermilab.

Collaboration Meeting at UCI, April 7-9, 2005 EMI Control System Design Kurt Liewer.

Collaboration Meeting at UCI, April 7-9, 2005 ANITA Thermal Analysis and Design Kurt Liewer.

CHE/ME 109 Heat Transfer in Electronics

3/5/2007(c) 2007 UEI Inc.1 Design Review United Electronic Industries DNR-12 -3U 12 DNA Rack With CPU/NIC Enclosure.

Don Lynch 9/15/05 HBD Safety Review 1 Mechanical Design And Installation Hadron Blind Detector (HBD) Don Lynch.

ILC Main Linac Superconducting Cryogen Free Splittable Quadrupole Progress Report V. Kashikhin for Superconducting Magnet Team.

VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.

WP7&8 Progress Report ITS Plenary meeting, 23 April 2014 LG, PK, VM, JR Objectives 2014 and current status.

1 Alan Bross MUTAC April 9, 2008 Lithium Hydride Absorber Program A. Bross for C. M. Lei.

4 Amp Load.500 Hard Line Cable SPSM 2 P/S Setup Configuration RF Signal Supplied by RG-6 RF Signal To TV via RG-6 Remove Central Fuse Move 20A fuse from.

PCB manufacturing PCBpro.com.

Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.

GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Document: LAT-PR-0XXXX Section 5.1 Grid Box Design 1 GLAST Large Area Telescope:

L. Greiner 1IPHC meeting – May 7, 2012 STAR HFT Plans for the next year A short report on HFT/PXL plans for post May 2012 TPC – Time Projection Chamber.

LiH Casting & Testing1 Lithium Hydride Disc Casting & Testing Approaches C. M. Lei March 2, 2007.

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 1 GONDOLA DESIGN & ANALYSIS OFFENDING OVERHANG/UNDERHANG CORRECTED ALL ANTENNAS NOW PLACED IN.

PCB procurement WG Status report PCB WG status, 25/03/2014Joerg Wotschack.

1 COMPTON POLARIMETER PRELIMINARY MAGNET DESIGN 06/03/08 Christopher Vidal, Senior Mechanical Designer Ernie Ihloff, P.E., Engineering Group Leader EE.

ZDC Remote Handling Tool Structure and Force Analysis P. Debbins University of Iowa December 10, 2009.

CMS ECAL End Cap Meeting CERN 18 Oct to 22 Oct ECAL End Cap High Voltage and Fibre Optic Monitoring Systems Progress. Progress on High Voltage and.

1 SPP FIELDS MEP Main Electronics Package Preliminary Design Review Bill Donakowski UCB/SSL 13/14 NOVEMBER 2013 MAVEN PFDPU Flight.

Sept. 2008EFW INST+SOC PDR IDPU Chassis Mechanical Design and Development Bill Donakowski Mechanical Engineer UCB/SSL

Main Electronics Package

For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 1 WIPER PDR Stanford,

Proposal for the assembly of the PHOBOS ring counters (H.P. 3/20/98) I would like to propose and discuss with you an alternative layout and assembly procedure.

AEP Mechanical and Power System H. Heetderks. CDR July, 2001NCKU UCB Tohoku AEP Mechanical and Power System H. Heetderks 2 AEP Mechanical Design System.

NFMCC Meeting 3/12/06 A. Bross LiH Absorbers Muon Cooling R&D NFMCC Meeting March 12, 2006 A. Bross.

1 PFDPU Mechanical Packaging PEER REVIEW MAVEN PFDPU Particle and Fields Data Processing Unit Mechanical Packaging and Design Overview May 09, 2011 Bill.

LAT Transport Container1 GLAST LAT Project8 September 2005 LAT Transport Container Design Review 8 September 2005 LAT Transport Container Design Review.

1 SPP FIELDS MEP Main Electronics Package Peer Review Bill Donakowski UCB/SSL 18 NOV 2014 MAVEN PFDPU Flight Unit SPP MEP Baseline.

Progress on the Prototype design Catania Goikoetxea, Mikel Navarro Medrano, Javier Mainz, March 31st,

H. Katajisto RE EDR 10/10/02 Enclosures for the RPC Link Boards Outline Introduction Periphery General Services Components, materials Manufacture, Assembly.

109-IDPU-Chassis-Donakowski 1 30 Sep – 01 Oct 2009DRAFT RBSP EFW ICDR 109-IDPU-Chassis-Donakowski IDPU Chassis Mechanical Design and Development Bill Donakowski.

 Scope : 32” AX68( ) chassis models.  Purpose : AX68 is EOL. AX68 W/F to be replace with MTK8222LS W/F ( or )  Advantage.

RBSP Radiation Belt Storm Probes RBSP Radiation Belt Storm Probes RBSP/EFW CDR /30-10/1 535 IDPU Chassis Bill Donakowski Mechanical Engineer UCB/SSL.

Thermal Shield Update Niklas Templeton 15/02/16 (final update of placement  )

Cloudland Instruments Hawkeye Mechanical Design Snapshot Compiled April 8th, 2016.

Cooling Circuit Design Steve Virostek Lawrence Berkeley National Lab February 29, 2012 MICE Coupling Coil Cryostat Design Review Lawrence Berkeley National.

1 LUND March 16 th, 2016 ESS ELLIPTICAL CRYOMODULE Vacuum vessel: Ports and sealing, Manufacturing feedback LUND, March 16th, 2016 Unité mixte de recherche.

Status of EPS Battery configuration finalized Solar panel layout –finalized Solar panel Substrate is ready for bonding EM – fabricated and Completed the.

Genesis Technology USA, Inc. Heatsink Technologies November 2,

MICE Coupling Coil Fabrication Steps to Complete Allan DeMello Lawrence Berkeley National Laboratory Coupling Coil Working Group January 28, 2014 January.

Heatsink Technologies. Overview  As board-mounted chips grow in speed, the demand for shielding the chip has become increasingly more desirable to meet.

Piero Belforte, HDT 1998: Advanced Simulation and Modeling for Electronic System Hardware Design Part3

Baby-MIND Modules & Services

T. Bowcock University of Liverpool

Bill Donakowski Mechanical Engineer UCB/SSL

PANDA Collaboration Meeting , BINP Sergey Pivovarov.

Hawkeye Mechanical Design Snapshot

The 11T cryo-assembly: summary of design and integration aspects

OCP Mezz 3.0 Mechanical Recommendations

'. \s\s I. '.. '... · \ \ \,, I.

EVLA LO/IF Racks/Bin/Modules

Mechanical Discussion

Mimosa18 on PCB (from the chip side)

' '· \ ·' ,,,,

NPS mechanical design 11/13/2018 Jlab meeting

NPS mechanical design 01/31/2019 Jlab meeting

GLAST Large Area Telescope:

Enclosure openings with wires

OCP Engineering Workshop Rack & Power, Advanced Cooling Solutions, Data Center Facility

Presentation transcript:

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 1 EMI AND THERMAL ISSUES THE MAIN ANITA EMI ENCLOSURE AND THE SIP EMI ENCLOSURE HAVE SIMILAR CONSTRUCTION, EXCEPT FOR THE THERMAL RADIATOR PLATE FRAME CONSTRUCTION IS WELDED 316L SS, FOLLOWED BY COPPER PLATING (THE ANITA RADIATOR IS AL-6061 AND WILL ALSO BE COPPER PLATED) SIDE PANELS ARE COPPER AND HELD IN PLACE VIA BLIND CAPTIVE NUTS SIDE PANELS ARE REMOVABLE AND WILL ALSO PROVIDE FOR CONNECTORS EMI GASKETS WILL BE USED BETWEEN COPPER PANELS AND FRAME THE CABLING PLANS NEED TO FINALIZED FOR BOTH ANITA AND THE SIP

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 2 EMI AND THERMAL ISSUES CONFIGURATION FOR PALESTINE TEST (NO EMI CONCERNS)

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 3 EMI AND THERMAL ISSUES

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 4 EMI AND THERMAL ISSUES

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 5 EMI AND THERMAL ISSUES SURF-PRO HEATSINK FOR UM TV TEST LESSONS LEARNED: TOO MUCH TIME TOO EXPENSIVE TOO PRECISE FOR PCB

April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 6 EMI AND THERMAL ISSUES SURF-V1 HEATSINK FOR TX TV TEST LESSONS LEARNED: QUICK DESIGN AND FABRICATION LOWER COST LOW MASS, MAY REQUIRE FABRICATION IN MATERIAL WITH BETTER THERMAL CONDUCTIVITY