MECH L2- 1 Engineering Specification & Design Portfolio

MECH L2- 2 Engineering Design System Design Detail Design Start Here!

MECH L2- 3 Design Process Define Functional Needs Functional Specification (Continuous updating) Engineering Specification (Continuous updating) Detail Design –Design for Manufacturing –Design for Assembly and Disassembly –Life Cycle Design Prototyping Production Product Launch Maintenance and Support Product Recycling Concurrent and Iterative Activities

MECH L2- 4 Design Procedure Functional Needs Functional Specification Design Analysis Engineering Specification Detail Design Life Cycle Design Design for Assembly and Disassembly Design for Manufacturing Subsystem Decomposition Manufacturing Process Plan Maintenance Recycling Product MarketingMarketing Matl. Selection

MECH L2- 5 Design Specification Functional Specification –Overall requirements –Key functionalities –Overall dimensions –Key performance characteristics –Layout drawing Engineering Specification –Detail performance requirements –Subsystems and subsystems detail requirements –All relevant dimensions –Engineering drawings

MECH L2- 6 Design Portfolio Design specification - Contract Design Schedule Functional design –Design alternatives –Design evaluation Final design solution –Design model and analysis –Engineering drawings –Process Plan References Meeting notes

MECH L2- 7 System Design Define Functional Needs Functional Specification (Continuous updating) –Review existing information Existing designs, patents, codes, legislation, literature search –Decomposition into subsystems Overall layout Subsystem relationship

MECH L2- 8 Flip Chip Bonder

MECH L2- 9 Functional Specification Development

MECH L2- 10 Process Flow I Step 1a - Pattern developed on bare silicon template 1.Clean silicon substrate by sulfuric acid & hydrogen peroxide at 120°C for 10mins 2.Rinse with deionized water and dry clean 3.Spin coat standard photoresist 4.Conduct photolithography by UV exposure 5.Wet etch the pattern by KOH (anisotropic etching) 6.Photoresist stripping 7.Rinse with deionized water and dry clean 8.Dicing Silicon Template

MECH L2- 11 Process Flow II Step 1b - Soft mould Preparation 1.Apply mould release (silicone) on silicon template 2.Clean another silicon substrate by sulfuric acid & hydrogen peroxide at 120°C for 10mins 3.Rinse with deionized water and dry clean 4.Spin coat polymer (PMMA / PDMS) Silicon Template Polymer Pressure

MECH L2- 12 Process Flow III Step 1c - Pattern transfer to the soft mould –Apply silicon template onto polymer with pressure (<5bars) –Curing polymer with suitable conditions –Release of silicon template Step 1d - Soft mould fabricated Heat

MECH L2- 13 Process Flow IV Step 2 - Dipping of soft mould on conductive polymer 1.Apply a layer of conductive polymer into the paste pot 2.Turning the pot and set the height of the paste by height adjustable blade 3.Dipping of soft mould on the conductive polymer Silicon substrate Conductive Polymer PDMS / PMMA Mould

MECH L2- 14 Process Flow V Step 3 - Die preparation 1.Dicing 2.Load into magazine Wafer Magazine

MECH L2- 15 Process Flow VI Step 4 - Formation of interconnect 1.Alignment is conducted between soft mould and IC die 2.Apply soft mould onto the die (displacement control) 3.Lifting of the soft mould for next cycle 4.Soft mould will undergo Step 2 for next die IC die Pressure

MECH L2- 16 Process Flow VII Step 5 - Assembly process 1.Bumped chip is flipped 2.Alignment is conducted between bumped IC die and substrate 3.Apply bumped IC die onto the substrate (displacement control) Sub-mount / substrate Bumped Chip IC die Pressure

MECH L2- 17 Process Flow VIII Step 6 – Curing 1.Batch if assembled package is collected 2.Batch curing of conductive polymer in conventional oven 3.Underfilling is optional Underfill IC die Heat

MECH L2- 18 Functional Specification I Target Package Base Table Pad size20μm - 100μm Pitch (Min)20μm Chip size0.4mm x 0.4mm – 10mm x 10mm Size40mm x 40mm x 0.5mm Material handlingClass epoxy, ceramic, glass, flim Alignment accuracyX±2μm, 3σ Y±2μm, 3σ θ±0.01˚ 3σ

MECH L2- 19 Functional Specification II Bonding Head Camera Table Bonding pressure<5bar Head bonding temperature (max)400˚C, +30˚C Temperature accuracy±1deg Cooling systemAir cooling Loading timeMax. 200sec, resolution 0.1sec Stage Movement0.5μm per step Leveling resolution- Image processing deviceGray scale pattern matching Focusing system Table movement (x-y motion)1μm per step 2 cameraTwo side camera Chip: mm Substrate:1-2mm

MECH L2- 20 Engineering Specification Development

MECH L2- 21 Polymer Flip Chip Bonder - Schematic

MECH L2- 22 Polymer Flip Chip Bonder

MECH L2- 23 Polymer Flip Chip Bonder Specification - I Machine Structure Module Epoxy Pot System for Conductive Polymer Adjustable Epoxy Blade height by Micro- gauge -Feed at 0.5mm/rev. Dipping for cleaning the Stamping Head Stainless Steel Container with Ultrasonic cleaning -Frequency >40kHz Vacuum System for drying up the Stamping Head after cleaning With filter Substrate Work Holder-X-travel 100mm, resolution 2.5um/step -Y-travel 200mm, resolution 2.5um/step -Z-travel 5mm Chassis & FrameCast Iron & Marble Stone, Casters with Adjustment Pad

MECH L2- 24 Polymer Flip Chip Bonder Specification - II Machine Control Module Controller-Motion control: Pentium 4 grade controller system -Vision PR: Pentium 4 grade controller system Vision Alignment System3 set 256-grey scale 1/3” CCD (at Wafer/Flip/Substrate) Adjustable magnification (0.7X – 4.5X) 640x480 pixels resolution (2-11 um/pixel) Coaxial and Ring light illumination PCI Video Capture card (PAL, 30 frames/sec) Manual adjustment and focusing range -X-travel 10mm -Y-travel 10mm -Z-travel 10mm Motion Control SystemDigital Signal Processing (DSP) control for -Ejector System (X, Y, EjectorCap-Z, EjectorPin-Z) -Wafer System (X, Y) -Substrate Work Holder (X, Y, Z) -Flipping System (X, Y, DieOrient-Ө, Flip-Ө) -Die Pick-up Arm (Z, Ө) -Stamping Arm System (X, Y, Z) Air SourceVacuum 0.8mmHg / Compressed Air bar DAC Controller8-bit resolution ADC Controller0-5V DC Temperature Controller400ºC (max) / +30ºC ramp /10ºC accuracy

MECH L2- 25 Polymer Flip Chip Bonder Specification - III Wafer Handling Module Target PackagesLED, COG, COF Wafer System-X-travel 150mm, resolution 5um/step -Y-travel 150mm, resolution 5um/step Ejector System-X-travel ±10mm, resolution 1.5um/step -Y-travel ±10mm, resolution 1.5um/step -EjectorCapZ-travel 24mm, 4um/step -EjectorPinZ-travel 24mm, 4um/step Wafer Handling-6” Wafer with 8” Ring -Conversion Kit for 2” Waffle Pack Missing die detectorPhoto sensor

MECH L2- 26 Polymer Flip Chip Bonder Specification - IV Pick, Dip, Flip Module Vacuum holder1.0 mmHg Force Control Sensor3 set (Pick/Stamp/Flip) Range 0-150g DAC control Die Pick-up Arm-Z-travel 5mm -Ө -travel 180º, 0.45º/step Stamping Arm System-X-travel 200mm, resolution 5um/step -Y-travel 200mm, resolution 5um/step -Z-travel 100mm Flipping System-X-travel 10mm, resolution 1.25um/step -Y-travel 10mm, resolution 1.25um/step -Flip-Ө -travel 180º, 0.45º/step -DieOrient-Ө-travel ±180º, 0.45º/step

MECH L2- 27 System Design Sub-system I Sub-system II Sub-system III Relationship A Relationship C Relationship B Relationship D Overall System

MECH L2- 28 System Design Internet Patent database – IP and Patent Search Links (WIPS) –e.g. printer head + Epson Research database – Database List – (SCOPUS) –Printer head (title) + Epson (Affiliation)

MECH L2- 29 Design Evaluation Matrix Function (Functions in the Functional Specification) Weighting (Weighting showing the importance of the function) Score Alternative 1 Alternative 2 Alternative 3 Function 1W1R11R12R13 Function 2W2R21R22R23 Function 3W3R31R32R33 Function 4W4R41R42R43 Total score R11*W1+ R21*W2+ R31*W3+ R41*W4 R12*W1+ R22*W2+ R32*W3+ R42*W4 R13*W1+ R23*W2+ R33*W3+ R43*W4