Developing an In-Situ Inspection Technique for Superconducting Wire Phase 1: Design of a Stud Pull Testing Device By Cory Spicer Advised by Professor Bucinell.

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Presentation transcript:

Developing an In-Situ Inspection Technique for Superconducting Wire Phase 1: Design of a Stud Pull Testing Device By Cory Spicer Advised by Professor Bucinell

Modern Power Transmission: Trouble Ahead Aging equipment and increasing populations are stretching power grids to their limits. More disasters like the 2003 blackout will occur unless something is changed.

A Possible Solution: Superconductivity Provides no resistance to electrical flow. Allows for transmission of power with virtually no loss and much less cable material. Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Background: Summer Internship at Superpower, Inc Mainly tested critical current of HTS samples. Also tested thickness, mechanical properties.

Senior Project: Testing Lamination Strength Performance of HTS device depends highly on quality of adhesion between layers on tape. A method of testing the strength of the lamination is needed. The aim of this project is to work with Superpower and NIST to develop a testing apparatus.

Stud Pull Testing Device This instrument is fixed to the top of the tape, and the strength required to delaminate the layers is considered. Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Stud Pull Testing Device Lamination failure Ekin, Jack, et al. “Electromechanical Studies for Coated-conductor Development” NIST, August 2005.

Preliminary Data Early testing gives an estimate for internal strength. Much more testing needs to be performed to yield statistically accurate results. Ekin, Jack, et al. “Electromechanical Studies for Coated- conductor Development” NIST, August samples

Stud Pull Tester: Important Features Device is bi- axially gimbaled, so force is directed straight up. Capable of testing internal strength and slit edge strength. Ekin, Jack, et al. “Electromechanical Studies for Coated- conductor Development” NIST, August 2005.

Stud Pull Tester: Current Problems Samples must be cooled in a stress-free manner, which is difficult. Epoxy is needed to attach tape to stud puller, which creates a thermal stress boundary layer. There is no previous data to compare and/or verify results.

This Term’s Activities Met with associates from Superpower to select appropriate goals for this phase of the project. Established communications with Jack Ekin at NIST. Familiarized myself with the current status and use of the stud pull tester prototype. Researched some epoxies, such as PEEK.

Planned Activities Work with Superpower, Inc. and NIST to improve functionality of device. Select an appropriate epoxy for cryogenic testing. Possibly investigate numerical modeling of delamination testing.

Acknowledgements Dr. Ronald Bucinell, Union College Dr. Jody Reeves, IGC-Superpower, Inc Dr. Jack Ekin, NIST Questions?