Heat sink analysis: analytically and via ANSYS ME 340 Final Project - Dr. Soloviev - Fall 2010 by Mathew Marshal & Kevin Hoopes.

Slides:



Advertisements
Similar presentations
Extended Surfaces Chapter Three Section 3.6 Lecture 6.
Advertisements

Conduction Conceptests
Fin Design for Maximum Thermal Dissipation ME 450: Computer Aided Engineering Analysis Instructor: Dr. Nema Group Members: Wei-Yuan Chu, Brad Holtsclaw,
ME 340 Project: Fall 2010 Heat Transfer in a Rice Cooker Brad Glenn Mason Campbell.
Extended Surfaces Chapter Three Section 3.6.
By S Ziaei-Rad Mechanical Engineering Department, IUT.
Chapter 3 Steady-State Conduction Multiple Dimensions
Analysis of PC Chip Heat Sink Design Royce Tatton ME 340 Dr. Solovjov Fall 2006.
Jed Goodell Jesse Williams. Introduction Problem How much heat does a particular heat sink dissipate How many fins are needed to dissipate a specific.
Thermo-fluid Analysis of Helium cooling solutions for the HCCB TBM Presented By: Manmeet Narula Alice Ying, Manmeet Narula, Ryan Hunt and M. Abdou ITER.
MANE 4240 & CIVL 4240 Introduction to Finite Elements Introduction to differential equations Prof. Suvranu De.
CHE/ME 109 Heat Transfer in Electronics LECTURE 12 – MULTI- DIMENSIONAL NUMERICAL MODELS.
Al 2 O 3 Post Combustion Chamber Post Combustion Chamber ANSYS Thermal Model (Embedded Fuel Grain Concept) Outer radius: 1.25” ( m) Inner radius:
CHE/ME 109 Heat Transfer in Electronics LECTURE 11 – ONE DIMENSIONAL NUMERICAL MODELS.
CHE/ME 109 Heat Transfer in Electronics LECTURE 8 – SPECIFIC CONDUCTION MODELS.
Transient Conduction: The Lumped Capacitance Method
Thermal Analysis Module 6. Training Manual January 30, 2001 Inventory # Thermal Analysis In this chapter, we will briefly describe the procedure.
CHE/ME 109 Heat Transfer in Electronics LECTURE 5 – GENERAL HEAT CONDUCTION EQUATION.
© 2011 Autodesk Freely licensed for use by educational institutions. Reuse and changes require a note indicating that content has been modified from the.
Two-Dimensional Conduction: Flux Plots and Shape Factors
Chapter 4 TRANSIENT HEAT CONDUCTION
by Peter Tu An Engineering Project Submitted to the Graduate
One Dimensional Non-Homogeneous Conduction Equation P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Another simple Mathematical.
1 Calorimeter Thermal Analysis with Increased Heat Loads September 28, 2009.
I-DEAS 11 TMG Thermal and ESC Flow New Features
Non stationary heat transfer at ceramic pots firing Janna Mateeva, MP 0053 Department Of Material Science And Engineering Finite Element Method.
Two Dimensional Steady State Heat Conduction
Transient Thermal Analysis Winter Semester
1 MME3360b Assignment 04 10% of final mark 6 problems, each worth 16.7% of assignment mark Due April 9 th, 2012.
Workshop 7: Thermal Steady State Analysis of a Composite Slab University of Puerto Rico at Mayagüez Department of Mechanical Engineering Modified by (2008):
Two-Dimensional Conduction: Finite-Difference Equations and Solutions
Module 4 Multi-Dimensional Steady State Heat Conduction.
Energy Transport Formal solution of the transfer equation Radiative equilibrium The gray atmosphere Limb darkening.
HOT PLATE CONDUCTION NUMERICAL SOLVER AND VISUALIZER Kurt Hinkle and Ivan Yorgason.
Workshop 6: Thermal Analysis of a Plate with a Hole University of Puerto Rico at Mayagüez Department of Mechanical Engineering Modified by (2008): Dr.
1) Structural Symmetry 2) Bookshelf Problem Jake Blanchard Fall 2009.
Laminar Natural Convection in 2D Glazing Cavities
Chapter 7 External Convection
Develop Epoxy Grout Pourback Guidance and Test Method to Eliminate Thermal/Shrinkage Cracking at Post- Tensioning Anchorages Project Manager Rick Vallier.
9.0 New Features New Coupled-Field Material Property allows Analysis of Peltier Cooling Workshop 6 Thermoelectric Cooler.
9.0 New Features Metal Shaft with Rubber Boot Workshop 7 Load Steps in Workbench.
Convection: Internal Flow ( )
Thermal Analysis Appendix Six. Training Manual General Preprocessing Procedure March 29, 2005 Inventory # A6-2 Basics of Steady-State Heat Transfer.
ME 340 Term Project Winter 2010 Dr. Soloviev Benjamin Parker Cesare Jenkins.
Phase Change Analysis Chapter 9. Training Manual Inventory # March 15, Chapter Overview Phase Change –Terminology –Theory –Material Properties.
Tutorial supported by the REASON IST project of the EU Heat, like gravity, penetrates every substance of the universe; its rays occupy all parts.
Chapter 3 Part 2 One-Dimensional, Steady-State Conduction.
Excel in ME 1-D Transient Heat Conduction Add-in.
Finite-Difference Solutions Part 2
Thermal Analysis Assumptions: Body Temperature (Environment) is 37˚C Heat distribution on outside of device will be modeled via FEA Heat transfer method.
Design and Analysis of Fins with Realistic Boundary Conditions P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Design for.
COUPLED ANALYSES Chapter 7. Training Manual May 15, 2001 Inventory # Fluid-Structure Analysis “One Way” Analysis –Structural deformation effect.
ERT 216 HEAT & MASS TRANSFER Sem 2/ Dr Akmal Hadi Ma’ Radzi School of Bioprocess Engineering University Malaysia Perlis.
Unit 42: Heat Transfer and Combustion Lesson 6: Conduction-Convection Systems.
Chapter Three Sections 3.1 through 3.4
FINITE DIFFERENCE In numerical analysis, two different approaches are commonly used: The finite difference and the finite element methods. In heat transfer.
The Finite Element Approach to Thermal Analysis Appendix A.
Chapter 3: One-Dimensional Steady-State Conduction
TBM thermal modelling status
Extended Surface Heat Transfer
Spencer Ferguson and Natalie Siddoway April 7, 2014
Transient Heat Conduction
Heat sink analysis: analytically and via ANSYS
What is Fin? Fin is an extended surface, added onto a surface of a structure to enhance the rate of heat transfer from the structure. Example: The fins.
Transient Heat Conduction
Thermal behavior of the LHCb PS VFE Board
Exercises. Introduction to Fins
ANALYSIS OF THE HORN UNDER THERMAL SHOCK – FIRST RESULTS
What are Fins ? Fins are extended surfaces used to increase the rate of heat transfer. It is made of highly conductive materials such as aluminum.
Fourier’s law of heat conduction (one-dimensional) Consider steady state conduction.
Presentation transcript:

Heat sink analysis: analytically and via ANSYS ME 340 Final Project - Dr. Soloviev - Fall 2010 by Mathew Marshal & Kevin Hoopes

Problem definition Intel core i7 processors can dissipate up to 130W under full load They must be kept below 373 K to prevent hardware damage We are given a certain rectangular fin, integral heat sink Find the required convection coefficient to keep the base below 373 K.

Boundary Conditions Base exposed to constant heat input of 130W Sides of base are adiabatic Sides and tops of fins are exposed to convective heat transfer to surrounding atmosphere at 298 K Heat sink is solid Aluminum

ANSYS Solution Define Geometry Apply boundary conditions Mesh Solve

ANSYS Solution Results obtained for initial guess for h Iterated until base temperature reached approximately 373 K h value found to be 37.6 W*K/m^2

Analytical Solution h = 39.8 W*K/m^2

Summary ANSYS Solution – 37.5 Analytical Solution – 39.8

Appendix Analytical Solution ANSYS Log file

*SET,_REMOTE_VIS_ID,'39' WPSTYLE,,,,,,,,0 /PREP7 !DEFINE THE BLOCK BLC4,0,0,0.042,0.001,0.045 !MAKE A FIN BLC4,0,0.001,0.0021,0.055,0.045 !COPY THE FINS FLST,3,1,6,ORDE,1 FITEM,3,2 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,3 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,4 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,5 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,6 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,7 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,8 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,9 VGEN,2,P51X,,, ,,,,0 FLST,3,1,6,ORDE,1 FITEM,3,10 VGEN,2,P51X,,, ,,,,0 FLST,2,11,6,ORDE,2 FITEM,2,1 FITEM,2,-11 VADD,P51X FINISH /SOL FINISH /PREP7 !DEFINE ELEMENT TYPE ET,1,SOLID70 ET,2,SOLID70 MPTEMP,,,,,,,, MPTEMP,1,0 !DEFINE CONDUCTION COEFICIENT MPDATA,KXX,1,,250 FLST,2,59,5,ORDE,23 FITEM,2,10 FITEM,2,12 FITEM,2,-14 FITEM,2,16 FITEM,2,-20 FITEM,2,22 FITEM,2,-26 FITEM,2,28 FITEM,2,-32 FITEM,2,34 FITEM,2,-38 FITEM,2,40 FITEM,2,-44 FITEM,2,46 FITEM,2,-50 FITEM,2,52 FITEM,2,-56 FITEM,2,58 FITEM,2,-60 FITEM,2,64 FITEM,2,-65 FITEM,2,67 FITEM,2,-81 /GO !DEFINE CONVECTION COEFICIENT, THIS IS ITERATED TO OBTAIN THIS SOLUTION SFA,P51X,1,CONV,37.60,298 FLST,2,4,5,ORDE,4 FITEM,2,5 FITEM,2,-6 FITEM,2,82 FITEM,2,-83 /GO FLST,2,1,5,ORDE,1 FITEM,2,3 /GO !DEFINE HEAT FLUX ON BOTTOM OF HEAT SINK SFA,P51X,1,HFLUX,68783 FINISH /SOL FINISH /POST1 FINISH /PREP7 SMRT,6 SMRT,2 SMRT,1 MSHAPE,1,3D MSHKEY,0 CM,_Y,VOLU VSEL,,,, 12 CM,_Y1,VOLU CHKMSH,'VOLU' CMSEL,S,_Y VMESH,_Y1 CMDELE,_Y CMDELE,_Y1 CMDELE,_Y2 FINISH /SOL SOLVE FINISH