RSH Front End Electronic R. Beaujean, S. Böttcher Kiel Nov 07, 2005.

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RSH Front End Electronic R. Beaujean, S. Böttcher Kiel Nov 07, 2005

Front End Electronic Block Diagramm Feed back network: C f and R f (parallel) C f (pF) defines sensitivity : (44/ C f ) mV/MeV (for Si) R f (MegOhm) defines time constant of discharging (pile up) shaping amplifier: signal level conditioning for ASIC input improves signal to noise ratio can select fast charge collection Detector FET + OpAmp shaping amp Feed back CSA

CSA Noise considerations: increasing with: detector capacitance (e.g um, 2 cm²) detector dark current ~ SQRT(Id) (doubles every 8 degree K) decreasing with: increasing FET current noise ~ 1/SQRT(gm); gm~SQRT(Id) gm (mutual conductance, forward transfer admittance) is the parameter we can influence by selecting the type of FET and the FET drain current (--> power consumption).

CSA noise versus input capacitance (typical FET)

Range of Energy Deposit Measurements in Si The minimum detectable energy deposit must be ~ 60 keV (well below 115 keV of MIPs in 300 um Si) assuming a dynamic range of 10k for the analogue section, this gives an upper limit of 600 MeV energy deposit Maximum output voltage of the CSA is ~3 Volt --> Cf = 44 mV * 600 MeV / 3V = 8.8 pF the CSA output for 60 keV energy deposit is then 0.3 mV

How to improve the resolution for required energy deposit range at given ADC resolution For CsI and BC430M: Photodiode1+ CSA1 with low C f for low  E events (high gain) Photodiode2+ CSA2 with med. C f for med.  E events (med. gain) Photodiode3+ CSA3 with high C f for high  E events (low gain) For SSD (A, B, C detectors) : only 1 block of SSD-detector + CSA behind the CSA two independent shaping amplifiers with low (x1) and high (x16) gain respectively (the CSA defines the dynamic range).

Layout of typical CSA (Kiel) for PIN2774

Kiel-CSA + 2 cm² detector: rms noise ~ 3 keV

Components small size, SMD active components required 1. FET: BF862 SOT23-3 plastic package equivalent noise input voltage 0.8 nV/  Hz input capacitance 10 pF transfer admittance g m 45 mS typ. 2. OpAmp: AD8005 SOT23-6 plastic package low quiescent current ~ 400 uA low noise, high slew rate, plastic packages have to be qualified for flight

Quiescent Power consumption CSA: FET drain Id~ 3V; amplifier V noise critical FETs may be operated with Id>4 mA, less critical FETs may be operated with Id<4 mA shaping amplifier: V Interface to ASIC positive output signal, shaping time TBD (1-5 us)