Thermal Equivalent Circuit for a Transistor. Junction Temperature Case TemperatureHeat Sink Temperature Ambient Temperature.

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Presentation transcript:

Thermal Equivalent Circuit for a Transistor

Junction Temperature Case TemperatureHeat Sink Temperature Ambient Temperature

Thermal Resistance from Junction to Case Thermal Resistance from Case to Heat Sink Thermal Resistance from Heat Sink to Ambient Total Average Power Loss

Motorola MS-10 Heat Sink

Performance Under Forced Air Flow

Thermal Characteristic in Free Air

Top View of MS-10 Heat Sink

Hole Pattern for a TO-3 Case

Mica Insulator

Thermal Resistances for Mica Insulators

Clip-On Heat Sinks

Thermal Performance

Thermal Resistance for Clip-On

Bond-On Extrusions for DIP Packages

Thermal Performance

Thermal Resistances for Bond-On

Example TO-220 case style dissipating 5 watts R JC = 3.0  C / Watt (from device spec) T Jmax = 150  C T Amax = 50  C Find the proper heat sink to keep the junction temperature from exceeding 150  C in natural convection.

Need to determine a value for R CS – depends on the mounting technique. If the device is mounted without an insulator, but only with Thermalcote, (silicone grease), check page 57, Figure 9 for TO -220 case style.

R CS = 1  C/W No Insulator Use Thermalcote

Thermalloy P/N 6030 Temperature rise above 5 Watts Power Dissipation = 66  C

Thermal Resistance R SA As long as R SA is less than 16  C/W, the requirement is met.

Thermalloy P/N 6030