EMC Technology Roadmapping: A Long-Term Strategy Marcel van Doorn Philips Applied Technologies EM&C Competence Center Eindhoven, The Netherlands, March 2006 EMC Zurich Singapore 2006

EMC Zurich in Singapore 2006, Marcel van Doorn 2 Agenda 1.Technology Roadmapping Framework 2.EMC Technology Domain 3.Trends & Needs 4.EMC Technology Roadmap 5.Conclusions & Outlook

EMC Zurich in Singapore 2006, Marcel van Doorn 3 Agenda

EMC Zurich in Singapore 2006, Marcel van Doorn 4 Technology Roadmapping Framework Vision on Domain Strategy & Program Roadmap Vision on needs and goals Inventory of technologies and gaps User needs and technology expectations Connect needs and possibilities over time Strategy and technology planning - Program of projects - Time span 1 – 3 years - “What, Why, When” - Time span 5 – 10 years

EMC Zurich in Singapore 2006, Marcel van Doorn 5 Agenda

EMC Zurich in Singapore 2006, Marcel van Doorn 6 EMC Technology Domain EMF human exposure Product safety Intentional EMI Measuring & Test techniques Test facilities & instrumentation Standards & regulations Antennas & probes Spectrum management Safety Standardization & Testing Design Management & education Modelling & simulation RF absorption materials Design methodologies Filters Grounding & shielding Radio noise Cross talk Transients: ESD, lightning Signal & Power integrity Transmission lines Wired & wireless networks PCB analysis & design Chip & package modelling Cables & connectors Large systems Automotive Power & rail Aerospace & avionic Application

EMC Zurich in Singapore 2006, Marcel van Doorn 7 EMC View on Electronic Systems Application areas Application Network System Subsystems Interconnect Components EMC STANDARDIZATION Challenging EMC technology areas Consumer Electron. Medical Lighting Telecom Automotive Power & Rail Aerospace &Avionic Military EMC DESIGNEM SAFETY

EMC Zurich in Singapore 2006, Marcel van Doorn 8 Agenda

EMC Zurich in Singapore 2006, Marcel van Doorn 9 Trends & Needs: Overview End-user / market needs Safe, secure, defect less, highly reliable, low cost products, interference free, EMC/EMF compliant Product trendsTechnology: System in Package (SiP), System on Chip (SoC), shrinking silicon & packaging, nanotechnology, decreasing supply voltages, higher-frequencies / speed, wireless networks (cm – m – km), Applications: on/in-body sensors, digital TV/radio, integration of functions (TV/radio + PC + wireless + …), module design, automatic driving (fail safe), shorter time-to-market, shorter life-cycle, EMC needs New methods & tools to decrease emission and increase immunity of components, and (sub)systems. Control future EM environment by legislation & standardization (new test methods, freq-bands, limits).

EMC Zurich in Singapore 2006, Marcel van Doorn Transistor gate length (nm) On-chip clock frequencies (GHz) Off-chip frequencies (GHz) High-speed buses Equiv. switching edge rate (ps) Supply voltage (V) * Source: International Technology Roadmap for Semiconductors 2004 Frequencies Rise/fall-times Supply voltages Noise margin EMISSION IMMUNITY SIGNAL / POWER INTEGRITY PROBLEMS Trends: Semiconductors Technology *

EMC Zurich in Singapore 2006, Marcel van Doorn 11 Agenda

EMC Zurich in Singapore 2006, Marcel van Doorn 12 Technology Roadmap: Theme = area of concern for end user Sub- theme 1 Technology area challenges Sub-sub- theme 1 Sub-sub- theme 2 Sub- theme 2 Trends: Technology evolution of a sub(sub)-theme State-of-the-artTechnology gapWhite spot

EMC Zurich in Singapore 2006, Marcel van Doorn 13 EMC Roadmap Framework EM Safety EMC Standardization EMC Design EMF Product Safety Intentional EMI Component Sub-system Interconnect System Multimedia IC / Module testing Test methods 1 – 140 GHz Modeling & Simulation EM Spectrum Control

EMC Zurich in Singapore 2006, Marcel van Doorn 14 Roadmap: EMC Design Modeling & Simulation Emission + Immunity Trends: faster time-to-market, module re-use, HS-digital, wireless, lower supply voltages 100 MHz – 3 m40 GHz – 7.5 mm10 GHz – 3 cm DESIGN RULES  integration in expert systems / design tools Integral Design Approach IC-SiP - Sub circuit PCB Sub-system Complete system EMC analysis / verification EMC synthesis / compliance Signal / Power integrity

EMC Zurich in Singapore 2006, Marcel van Doorn 15 Agenda

EMC Zurich in Singapore 2006, Marcel van Doorn 16 Conclusions An EMC technology roadmap: Helps to identify a future direction of the EMC technology domain (vision 8 – 10 years); Provides a logical link between vision and strategy; Helps in setting goals for EMC technology development: Strategic Research Agenda.

EMC Zurich in Singapore 2006, Marcel van Doorn 17 Outlook To develop a comprehensive EMC roadmap that identifies emerging market requirements and challenging EMC technology gaps.

EMC Zurich in Singapore 2006, Marcel van Doorn 18 EMC Research topics vs. European Technology Platforms ENIACeMobilityARTEMISNEMERTRACERRACESTP I. EMC METHODOLOGIES Materials / meta-materials – Signal and Power Integrity – EMC impact of new technologies – Interconnects (wireless, wired) – Semiconductors – Module & System level – Transients protection xxxxx II. EMC STANDARDIZATION / CONTROL New test methods – Unification of standards – EM spectrum control – Emerging issues xxxx III. EM SAFETY / SECURITY Human exposure to EM fields – EMC for functional safety – Intentional Electromagnetic Interference xxxxx IV. EM MODELING & SIMULATION New computational techniques – Modeling novel materials – Non deterministic modeling – Certification by simulation – Expert systems / design tools – EM dosimetry xxxxx Priority ranking Short-, Medium-, Long-Term relevance

EMC Zurich in Singapore 2006, Marcel van Doorn Brain-Implants Thank you for your attention ! Questions ?