Decoder* CentroidingNon-Centroiding Transistor matching (small transistors) Transistor matching (large transistors) Addr b Iref Iout b Iref DAC en_out.

Slides:

Advertisements

Similar presentations

1 The 2-to-4 decoder is a block which decodes the 2-bit binary inputs and produces four output All but one outputs are zero One output corresponding to.

Advertisements

Memory Address Decoding

CMOS Camera System-on-a-Chip

Design and Implementation of VLSI Systems (EN1600)

Prof. John Nestor ECE Department Lafayette College Easton, Pennsylvania ECE VLSI Circuit Design Lecture 20 - Chip-Level.

Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.

Analog-to-Digital Converters Lecture L11.2 Section 11.3.

Sprinkler Buddy Presentation #8: “Testing/Finalization of all Modules and Global Placement” 3/26/2007 Team M3 Kartik Murthy Panchalam Ramanujan Sasidhar.

1 Final Presentation Project A – Spring 2009 High Speed Signal Processing Board Design Student: Nir Malka Lior Rom Instructor: Mike Sumszyk Duration: 1.

Team W3: Anthony Marchetta Derek Ritchea David Roderick Adam Stoler Milestone 5: Feb. 18 th Component Layout Overall Project Objective: Design an Air-Fuel.

Viterbi Decoder: Presentation #7 M1 Overall Project Objective: Design a high speed Viterbi Decoder Stage 7: 1st Mar Component layout (corrected)

Top 3mm (22 pads) x 6mm (59 pads) Vicm DAC_b DAC_p AVDD DAC_Iref DAC_Iout Iref Vicm AVDD AGND Vina Vinb DVDD DGND ClearB DFFclk1 DFFclk2 clkH1 clkH1_mod.

Institute of Electronics, National Chiao Tung University VLSI Signal Processing Lab A 242mW, 10mm2 H.264/AVC High Profile Encoder H.264 High Profile Encoder.

Lecture 8 Micromouse PCB design guide

Dept. of Communications and Tokyo Institute of Technology

1 Process-Variation Tolerant Design Techniques for Multiphase Clock Generation Manohar Nagaraju +, Wei Wu*, Cameron Charles # + University of Washington,

1 Quarterly Technical Report 1 for Pittsburgh Digital Greenhouse Kyusun Choi The Pennsylvania State University Computer Science and Engineering Department.

ASIC1  ASIC2 Things still to learn from ASIC1 Options for ASIC 1.01  1.1  1.2 Logic test structure for ASIC2.

Unit 9 Multiplexers, Decoders, and Programmable Logic Devices

Phase-1 Padring. i PHC Phase 1 Padring 2 03/04/2008 Padring Overview µm Several Blocs :  JTAG pads  Digital Control.

Mateusz Baszczyk, Piotr Dorosz, Wojciech Kucewicz, AGH-UST Krakow Claudio Gotti, Gianluigi Pessina, INFN-Milano Bicocca Angelo Cotta Ramusino, INFN-Ferrara.

CS-EE 481 Spring University of Portland School of Engineering Project Golden Mantle CMOS 8-Bit Analog-to-Digital Converter Team T Travis Tompkins.

Phase-1 Design. i PHC Phase /04/2008 System Overview Clock, JTAG, sync marker and power supply connections Digital output.

Front End Circuit.. CZT FRONT END ELECTRONICS INTERFACE CZTASIC FRONT END ELECTRONICS TO PROCESSING ELECTRONICS -500 V BIAS+/-2V +/-15V I/O signal.

Progress on STS CSA chip development E. Atkin Department of Electronics, MEPhI A.Voronin SINP, MSU.

EP/ED group meeting1 ALICE PIXELS DETECTOR.

Specifications & motivation 2  Lowering integration time would significantly reduce background  Lowering power would significantly reduce material budget.

Background: VLSI Courses at Lafayette  ECE VLSI Circuit Design  Original form: “tall thin designer”  VLSI Processing  CMOS Transistor Characteristics.

Renesas Electronics Europe GmbH A © 2010 Renesas Electronics Corporation. All rights reserved. RL78 Port architecture.

ClicPix ideas and a first specification draft P. Valerio.

ABCN Pad ring V8.0 30/04/13F. Anghinolfi/K. Swientek1 Final ABC130 pads distribution.

ASIC Activities for the PANDA GSI Peter Wieczorek.

Comparators, DAC, and ADC

09/02/20121 Delay Chip Prototype & SPI interface Joan Mauricio La Salle (URL) 15/02/2013.

HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.

1 Quarterly Technical Report II for Pittsburgh Digital Greenhouse Kyusun Choi The Pennsylvania State University Computer Science and Engineering Department.

Embedded Systems Design 1 Lecture Set C Interfacing the MCS-51 to: –D/A Converter –A/D Converter.

System IC Design Lab. Dongguk University 1 Chip design Chip design KIM,D.H., KWON,Y.,SONG,M.K. Department of Semiconductor Science, Dongguk Univ. for the.

S. Bota – Calorimeter Electronics overview - July 2002 Status of SPD electronics Very Front End Review of ASIC runs What’s new: RUN 4 and 5 Next Actions.

CS-EE 481 Spring University of Portland School of Engineering Project Golden Mantle CMOS 8-Bit Analog-to-Digital Converter Team T Travis Tompkins.

Low Power SRAM VLSI Final Presentation Stephen Durant Ryan Kruba Matt Restivo Voravit Vorapitat.

Connector pinouts SiPM4 SiPM3 Power DGND DVDD AGND BiasGND AV- AV+ Bias AGND Digital I/O Enable AGND TRGOUT EXTTRG AGND DOUT1 DOUT2.

Connector pinouts Digital I/O Power TOut AOut DGND DVDD AGND BiasGND AV- AV+ Bias T1Out T1+ T2+ T2Out AGND Enable AGND TRGOUT.

Grounding ADCs & DACs Data Converters (ADCs and DACs) are accurate and sensitive analog devices whose analog ports are vulnerable to unwanted noise (most.

K.Wyllie, CERNIWORID 2004 Readout of the LHCb pixel hybrid photon detectors Ken Wyllie on behalf of the LHCb collaboration and industrial partners The.

Update on the Bus, the HDI and peripheral electronics M. Citterio on behalf of INFN Milano and University of Milan SuperB Workshop: SVT Meeting.

Week 22: Schematic Week 23-Week 27: Routing Gerber files have been available since 9th July 1st prototype: – PCB manufacturer: supervised by KIT – Cabling:

The reading is 7.38 mm. The reading is 7.72 mm.

Insert project logo Gossipo3 & 4 3 rd Prototype of a front-end chip for 3D MPGD Project outline. 7/2/20161GOSSIPO3 prototype.

GGT-Electronics System design Alexander Kluge CERN-PH/ED April 3, 2006.

1 Becoming a Global Leader in Pc-Based & Web-Based Industrial Automation PCL-727 (CH0, 4~20 mA) ADAM 3014 (0~20 mA) PWR 242 PWR 242 Multi Meter (Voltage)

Design of the 64-channel ASIC: status

Low-Power SRAM Using 0.6 um Technology

Iwaki System Readout Board User’s Guide

Scheme for the large full custom cell

Hugo França-Santos - CERN

A 3D deep n-well CMOS MAPS for the ILC vertex detector

Peripheral IP blocks per chip “Superstrip”

Engineering 4862 Microprocessors Lecture 25

1 Gbit/s Serial Link 1 Gbit/s Data Link Using Multi Level Signalling

Design and Implementation of VLSI Systems (EN1600)

بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه

Transistors to Gates Transistors to Gates Gateway To Technology

FIGURE 1: SERIAL ADDER BLOCK DIAGRAM

Silicon pixel detectors and electronics for hybrid photon detectors

SIS20:A CMOS ASIC for SOLAR IRRADIANCE SENSORS in MARS SURFACE

Pt-dse NANO recipe 50 cycles

Quarterly Technical Report III for Pittsburgh Digital Greenhouse

I am asking the customer why the DVDD is rising in two steps and

Design and Implementation of VLSI Systems (EN1600)

Presentation transcript:

Decoder* CentroidingNon-Centroiding Transistor matching (small transistors) Transistor matching (large transistors) Addr b Iref Iout b Iref DAC en_out Addr Decoder* Addr Current source Iref_in Iref I/O pins: Iout, Iref_in, Addr, clk Analog Signals: Iref_in, Iref, Iout Digital Signals: clk, Addr, b, en_out All Blocks are analog except for the Decoders * Decoder also receives clk Addr

Iout DVDD DGND Addr AVDD AGND IREF_in This pad ring will support two chips – one architecture shown Chip dimensions: 1.5mm x 1.5mm Pads: 90 micron pitch Core: 900um x 900um Addr

Design Number: 80208Customer Name: Brita Olson Design Name: CPP2_Class_chip1Customer Account: 3955 MOSIS PKG Name: DIP40Phone: (909) Quantity Packaged: AllFax: (909) Min Pad Size (X): 78umMin Pad pitch (X): 90 um Min Pad Size (Y): 78umMin Pad pitch (Y): 90 um Cavity Size: 310 milsNo rotation