1 AP 5301 / 8301 Instrumental Methods of Analysis Course Coordinator: Prof. Paul K. Chu Electronic mail: Tel: 34427724 Fax: 27889549.

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AP 5301 / 8301 Instrumental Methods of Analysis
Presentation transcript:

1 AP 5301 / 8301 Instrumental Methods of Analysis Course Coordinator: Prof. Paul K. Chu Electronic mail: Tel: Fax:

2 Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth- Heinemann (1992) X-Ray Microanalysis in the Electron Microscopy (4 th Edition), J. A. Chandler, North Holland (1987) Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990) Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987) Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990) Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994) Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991) Scanning Electron Microscopy and X-Ray Analysis (3 rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003) Reference Books

3 COURSE OBJECTIVES Basic understanding of materials characterization techniques Emphasis on applications Course Objectives

4 Classification of Techniques Microscopy and related techniques Surface characterization techniques Elemental / chemical depth profiling techniques Non-destructive testing

5 Light Microscopy Scanning Electron Microscopy (SEM) / Energy Dispersive X-Ray Spectroscopy (EDS) / Wavelength Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD) / X-Ray Fluorescence (XRF) Transmission electron microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED) Microscopy and Related Techniques

6 Auger Electron Spectroscopy (AES) X-ray Photoelectron Spectroscopy (XPS) or Electron Spectroscopy for Chemical Analysis (ESCA) Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), … Surface Characterization Techniques

7 Auger depth profiling XPS depth profiling Secondary Ion Mass Spectrometry (SIMS) Depth Profiling Techniques

8 Radiographic and Neutron Radiographic Tests Electromagnetic & Magnetic Particle Tests Sonic, Electrical, Mechanical, and Visual Tests Photoelasticity Test Liquid Penetrant Tests Leak Tests Acoustic Emission Tests Non-Destructive Testing Techniques

9 Principles of Analytical Techniques

10

11 Understand via modeling and simulation which parameters can improve product yield Systematically identify these parameters within the process Control and reduce / eliminate these parameters by identifying their root cause Process monitor these parameters to measure the success of contamination control efforts Product Yield Enhancement

12 Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM Residues – SEM/EDS, AES, XPS, SIMS Stains, discoloration, hazes – SPM, SEM, XPS, AES, SEM/EDS General surface contamination – XPS, AES, SEM/EDS, SIMS Surface Contaminant Identification

13 Haze on Silicon Surface (SPM)

14 TiN Grains (SPM)

15 Imaging of Hard Disk (SPM)

16 Residues on Integrated Circuits (SEM)

17 Integrated Circuit (SEM)

18 Hard Disk Defects (AES)

19 Si Wafer Surface Contamination (XPS)

20 Depth Profiling

21 Gate Oxide Breakdown (SIMS)