APIC Company Proprietary Ver 3.5 Introduction to APIC September 2003

A P I C APIC Company Proprietary Slide 2 Ver 3.6 (Sept 2003) Advanced Photonics Integrated Circuits Corporation Founded in September 1999Founded in September 1999 Currently about 40 employeesCurrently about 40 employees 80% with advanced technical and business degrees80% with advanced technical and business degrees Two business locationsTwo business locations Honolulu (10,000 sq ft) - Headquarter & processing Culver City (26,000 sq ft) - Design center & R&D Culver City (26,000 sq ft) - Design center & R&D

A P I C APIC Company Proprietary Slide 3 Ver 3.6 (Sept 2003) APIC Culver City Building

A P I C APIC Company Proprietary Slide 4 Ver 3.6 (Sept 2003) APIC Honolulu Building

A P I C APIC Company Proprietary Slide 5 Ver 3.6 (Sept 2003) Technology and Product Areas HIP (Highly Integrated Phontonics) Chips “System-on-a-chip” - convergence of photonics and electronics on one chip Ultra-sensitive homeland defense sensors Multi-band translithic imager

A P I C APIC Company Proprietary Slide 6 Ver 3.6 (Sept 2003) Value Proposition Reduce footprint Reduce customers’ parts count Reduce losses associated with pigtailing Reduce customers’ costs Integrate active and passive photonic devices:

A P I C APIC Company Proprietary Slide 7 Ver 3.6 (Sept 2003) BUSINESS AREAS PIC components/optical modules for military and commercial markets Government Contracts

A P I C APIC Company Proprietary Slide 8 Ver 3.6 (Sept 2003) Key Business Milestones Intel Capital Investment:May 2001 ASML Development Agreement:July 2002 Silicon Genesis Development Agreement: Sept 2002 Intel Collaboration Agreement:October 2002 Applied Material Etching SupportJan st Military contract (Sub to Lockheed-Martin)March 2003

A P I C APIC Company Proprietary Slide 9 Ver 3.6 (Sept 2003) Current Government Contracts IDAward DateCustomer /13/2003 LMT N C /11/2003ONR N /11/2003NAVAIR Plus other smaller contracts for a total of $8.5M.

A P I C APIC Company Proprietary Slide 10 Ver 3.6 (Sept 2003) SOI Fabricated Wafer

A P I C APIC Company Proprietary Slide 11 Ver 3.6 (Sept 2003) EA-6B Jammer Application

A P I C APIC Company Proprietary Slide 12 Ver 3.6 (Sept 2003) E-2C Radar Applications

APIC Company Proprietary Ver UAV Laser Communication

A P I C APIC Company Proprietary Slide 14 Ver 3.6 (Sept 2003) Photoacoustic Effect Laser In Pressure Waves from laser absorption Microphone

A P I C APIC Company Proprietary Slide 15 Ver 3.6 (Sept 2003) Photoacoustic System Laser Detection Cell Power Meter Computer Signal Output W0W0 Coated Window Lock-In Amplifier Microphone Gas Sample Inlet Gas Exit r Pump Modulated Current Driver Modulated at natural resonant frequency of the cell  =  1 Sample is held for integration period 1 – 10 sec. Anti-reflective coating Each discrete wavelength is stepped through and any addition of spectra is done at each step before moving on. It takes 2-3 sec to scan laser range dependent on actuator speed l

A P I C APIC Company Proprietary Slide 16 Ver 3.6 (Sept 2003) Chemical Agents--VX and GB CO 2 Range

A P I C APIC Company Proprietary Slide 17 Ver 3.6 (Sept 2003) Carbon Nanotube Sensor

A P I C APIC Company Proprietary Slide 18 Ver 3.6 (Sept 2003) TIVISIT : Multi-Band Imager Back-side illuminated sensor (Thinned to microns) SLM (LC or MQW) Pitch: 10 um for vis/NIR Output: coherent, monochromatic, grey-scale optical image grey-scale optical image Smart Signal Processing Layer Pre-filtering (Difference of Gaussian for object of interest detection) Signal conditioning (gain ranging for SLM drive Sampling capacitors for SLM IR Sensing Layer Uncooled NIR: Ge, AlGaAs or InGaAs Cooled LWIR: AlGAAs QWIPs or InSb SOI CMOS Visible/UV Sensing Layer High resolution, low- noise visible IR Input: wide spectral band, optical image laser BOX Ge BOX Metal1 Metal2 Metal3 SLM input

A P I C APIC Company Proprietary Slide 19 Ver 3.6 (Sept 2003) Our Product Categories Optical-electrical conversion –Transmitters, detectors, transceivers Amplification –EDWA, SOA DWDM (mux/demux) –AWG, gratings, interlevers Optical switching –MEMS, PZT fiber, thermo-optic & electro-optical switches Optical signal control and management –Dispersion, ICOM, VMUX

A P I C APIC Company Proprietary Slide 20 Ver 3.6 (Sept 2003) Optical Networking Food Chain Proposed position for APIC Network Services Photonic and IC Components Network Equipment Modules / Subsystems Network Software

A P I C APIC Company Proprietary Slide 21 Ver 3.6 (Sept 2003) Technology: Materials SOI Substrate Mature process; reliable substrate Capitalize on standard, high-volume semiconductor manufacturing processes Inherently low polarization sensitivity Potential for integration of active optoelectronic devices (including electronic control circuits) Ge and InGaAsP High yields for simple devices

A P I C APIC Company Proprietary Slide 22 Ver 3.6 (Sept 2003) PIC “foundation” 2. Reconfigurable OADM; Integrated mux + VOA 4. Tunable WDMA Tx/Rx 1. Mux/demux (AWG) 3. Multi-channel receivers Common Platform for Products

A P I C APIC Company Proprietary Slide 23 Ver 3.6 (Sept 2003) Fabricated SOI Chip

A P I C APIC Company Proprietary Slide 24 Ver 3.6 (Sept 2003) SOI Chip Output

A P I C APIC Company Proprietary Slide 25 Ver 3.6 (Sept 2003) Fabricated Thermo-Optic Switch On/Off switch Mach Zender-based 1x2 and 2x2 in development

A P I C APIC Company Proprietary Slide 26 Ver 3.6 (Sept 2003) Heater Bias Optical output Thermo-Optic Switch Response 30 µs cycle time (On -> Off -> On)

A P I C APIC Company Proprietary Slide 27 Ver 3.6 (Sept 2003) Tunable Receiver/Channel Equalizer on one chip

A P I C APIC Company Proprietary Slide 28 Ver 3.6 (Sept 2003) Integrated Ge detector with SOI waveguide

A P I C APIC Company Proprietary Slide 29 Ver 3.6 (Sept 2003) Product: Multiple Channel Receiver SOI + Ge Photo Detector array + Circuit amplifiers +Clock Recovery Patented Germanium integrated Array Photo Detectors Prototype has been fabricated in the lab Data TIA Array CDR AWG Demux Input Aperture PWR Object Plane Input Waveguide Output Aperture Image Plane PWR Array of Detectors Ge or InGaAs Clock Data Recovery (CDR); Trans-Impedance Amplifier(TIA)

A P I C APIC Company Proprietary Slide 30 Ver 3.6 (Sept 2003) Drop Add Elimination of 4 N interconnections (e.g. 160 for a 40-channel system) Reconfigurable Optical ADM Control Electronics Array of 2x2 Switches

A P I C APIC Company Proprietary Slide 31 Ver 3.6 (Sept 2003) Honolulu Cleanroom Facility

A P I C APIC Company Proprietary Slide 32 Ver 3.6 (Sept 2003) Culver City Cleanroom

A P I C APIC Company Proprietary Slide 33 Ver 3.6 (Sept 2003) Strategic Relationships Wafer fabricator Semiconductor fabricator Optical Comms electronics manufacturer Equipment Vendors APIC University Research Defense Contractors

A P I C APIC Company Proprietary Slide 34 Ver 3.6 (Sept 2003) Summary - Capitalize on Advantages Skilled technical people –Defense electronics –University research Focus on materials handling and fabrication Benefits of SOI IC manufacturing technology Convergence of Photonics and Electronics on one chip “System-on-a chip” implementation Translithic and nano technolgy Ultra-sensitive chemical & biological sensors