Aug. 8-9, 2006 HAPL meeting, GA 1 Open Discussion on Advanced Armor Concepts Moderated by A. René Raffray UCSD HAPL Meeting GA, La Jolla, CA August 8-9,

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Presentation transcript:

Aug. 8-9, 2006 HAPL meeting, GA 1 Open Discussion on Advanced Armor Concepts Moderated by A. René Raffray UCSD HAPL Meeting GA, La Jolla, CA August 8-9, 2006

Aug. 8-9, 2006 HAPL meeting, GA 2 Background There are concerns with the W dry wall in particular regarding He retention and the possibility of exfoliation. We are considering engineered W to enhance the release of the implanted He but this needs to be confirmed experimentally. This discussion session is meant at triggering ideas of other possible options in case the W armor does not work.

Aug. 8-9, 2006 HAPL meeting, GA 3 Roman Aquaduct at Pont du Gard, Provence

Aug. 8-9, 2006 HAPL meeting, GA 4 Possible Advanced Armor Options Include: Engineered materials (to help He release and thermal stress accommodation) (S. Sharafat) Moving solid (pebble beds?, solid belt?, others) (I. Sviatoslavsky) Momentary liquid walls (allowing the solid to melt and resolidify), perhaps using a lower MP material in a high-porosity W structure. (R. Raffray) Wetted walls (would it unacceptable based on impact of pre-shot chamber constituents on target injection and survival, and reformation of film)? (S. Abdel-Khalik/I. Sviatoslavsky) Carbon velvet from ESLI. (T. Knowles) Other innovative ideas. (L. Snead)

Aug. 8-9, 2006 HAPL meeting, GA 5 Some of the Key Questions to be Addressed Include: Would the armor concept be able to accommodate the ion and photon fluxes and provide an acceptable lifetime? Would operation of the armor concept impact the operation of other components (e.g. a wetted wall would result in vapor in the chamber affecting target injection and survival)? Would the armor concept raise other safety or operation issues that would require specific remedial actions (e.g. in case of C, tritium co-deposition)? What is the stage of maturity of the concept and how extensive is the required R&D to develop it for IFE chamber application (measure of development risk)? Others...

Aug. 8-9, 2006 HAPL meeting, GA 6 Momentary Liquid Walls (allowing solid to melt and resolidify) Allowing W armor itself to melt is an option but concerns about stabiliuty of melt layer and integrity of high temperature solid W under melt layer Other possibility is to use a lower MP material in a high-porosity W structure -e.g. ~90%Be in ~%10 W structure -How to fabricate it? -Structure size to provide good melt layer retention through capillarity (microstructure size to be optimized for melt layer retention and integrity) 10%W/90%Be W Structure Coolant

Aug. 8-9, 2006 HAPL meeting, GA 7 Histories of Temperature and Phase Change Thickness for a Be Armor as a Function of the Chamber Sizes for the 350 MJ Target 1-mm Be on 3.5 mm FS at 580 °C No chamber gas Ion and photon energy deposition assumed comparable to SiC Can maintain W at reasonable temperature acceptable lifetime (~1550°C for m chamber) Stability of ~1-10  m melt layer of Be Minimal evaporation, ~0.1 nm for m chamber, ~ fraction of a gram per shot