Temperature Sensor Array Using flexible Substrate 陳俊廷

Outline  Abstract  Introduction  Design  Fabrication  Results  Conclusions

Abstract  Temperature sensor array based on MEMS technology  Temperature sensor array is composed of 256(16×16) sensors inside a 28×20mm 2 area  Polyimide (PI) thin film (35μm) with a copper layer (40μm) on one side as the starting material  Doubled-sided fabrication process is applied to create the sensing elements and interconnects for scanning circuitry  Measuring the resistance of each element in the temperature sensing array

Introduction  Research on artificial skin for robots has been popular, that should be highly arrayed in a requested area on a flexible substrate  Higher density on a flexible copper-polyimide substrate  Temperature sensing element is a platinum resistor  The temperature variation is detected by measuring the resistance change of the resistor due to temperature variation

Design

 The resistance is proportional to length and inversely proportional to cross-sectional area  The platinum layer is designed to be long and narrow ； the copper is relatively wide, in order to ensure that the resistance change is caused by the meandering platinum patterns  Copper layer was designed to be 10 times larger than platinum  The resistivity is 10.6μΩ-cm for platinum and 1.68μΩ-cm for copper

Design

Fabrication

Results  A thermocouple is used for measuring the accurate ambient temperature  α is the TCR of platinum  T 0 is the ambient temperature

Conclusions  A 16×16 temperature sensor array in a 28×20mm 2 area is fabricated on a flexible copper-PI substrate using MEMS fabrication technology  The dimensions of the copper and the platinum patterns are carefully designed to ensure the temperature dependent resistance of the copper layer is negligible during the temperature measurement