US Module Production June 2, 2005 J. Incandela For the US CMS Tracker Group.

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Presentation transcript:

US Module Production June 2, 2005 J. Incandela For the US CMS Tracker Group

April 29, J. Incandela 2 US Hybrids Inventory (approx) Hybrids as of 5/7/05 FNALITUCSBIT L12pu L12pd0-0- L12su0-0- L12sd0-0- L34pu L56pu R5p5- R5s2- R626- R754- Roughly enough to hold us until some time in the week of June 13.

April 29, J. Incandela 3 US Module Assembly Weekly Cumulative ABFABF% A or B L12pu % L12pd % L12su % L12sd % L34p % L56p % R5N % R5S % R % R % Total %

April 29, J. Incandela 4 US Hybrid Testing Totals

April 29, J. Incandela 5 US ARCS Testing Status

April 29, J. Incandela 6 UCSB ARCS Testing Results 822 Total Tested 814 Grade A 3 Grade B 5 Grade F This week: 19 of channels bad (0.031%) Total Production: of channels bad (0.051%) Will show this data for all US starting next week.

April 29, J. Incandela 7 US LT Testing Status

April 29, J. Incandela 8 Planning and rates All indications are that UCSB and FNAL can both now comfortably do 7 plates per 8 hour day and probably can do 8 per day at least 50% of the time. We are continuing to make improvements to achieve higher rates: Streamlining some of the gantry operation (eliminating surveys on gantry for all but one plate per day at FNAL) Exchanging UCSB KS 8060 with an FNAL KS 8090 to reach higher module wirebonding rates at UCSB Both sites have been continuing to ramp up manpower Planning for TEC production (JI with Lenny Spiegel) I have asked FNAL to consider making 5 TEC R7 plates for production of R7 modules per day starting November Cost does not look terribly high – rough estimate is now around 130k$-200k$ for 4 months including equipment and all manpower but this needs to be refined. UCSB would assist with wirebond fixtures, shipping boxes, programs for testing etc. Will need to get such a plan formally approved and have SC support for use of US contingency

April 29, J. Incandela 9 US Assembly Plates Now in use In progress or to be proposed Totals Plate TypesUCSBFNALUCSBFNALActual If add R7 at FNAL TOB R-phi76215 TOB Stereo3477 TEC R5 R-phi333 TEC R5 Stereo333 TEC R6555 TEC R73538 Totals

April 29, J. Incandela 10 Amtech Hybrids (D. Stuart) Status: We received 5 electrical prototypes from Amtech, 3 TEC and 2 TOB. Four of the five tested good. The fifth had a fatal bonding problem on one line. Visual inspection of the hybrids indicates some quality issues that need to be addressed: - The inner row of redundant bonds on the back end of the APV chip have been touched by the bonding wedge. This pushes them down and puts a nick in the wires. The wires pass pull tests, but this is a robustness concern. We are discussing optimal bonding parameters to avoid this. Inspection of the standard hybrids from HSA show that the same thing is happening to them. Some of the parts had stray solder splashes. This needs to be addressed with more cautious solder application and/or kapton masking. Schedule: Three or four more weeks are needed for qualification: two weeks to finalize the new bonding parameters and one or two more weeks to assemble and inspect the remaining mechanical and electrical prototypes. Beginning ~July 1, we expect they can assemble 100 in the first week while D. Stuart is there for rapid inspection. If the inspection and testing of these are successful, the full rate of 200/week can begin the second week of July.