Pattern Gas Detectors. Towards an R&D Collaboration CERN, 10 September 2007 1 P. Baron1, A. Delbart1, X. de la Broise1, D. Calvet1,

Slides:



Advertisements
Similar presentations
1 500cm 83cm 248cm TPC DETECTOR 88us 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 LATERAL.
Advertisements

Front-end electronics for the LPTPC Outline of the talk:  System lay out  Mechanics for the front-end electronics  End-cap and panels  Connectors and.
Front-end electronics for the LPTPC  Connectors  Cables  Alice readout electronics  New developments  New ideas  Open questions Leif Jönsson Phys.
Electronics for large LAr TPC’s F. Pietropaolo (ICARUS Collaboration) CRYODET Workshop LNGS, March 2006.
6 Mar 2002Readout electronics1 Back to the drawing board Paul Dauncey Imperial College Outline: Real system New VFE chip A simple system Some questions.
Specific requirements for analog electronics of a high counting rate TRD Vasile Catanescu NIHAM - Bucharest CBM 10th Collaboration Meeting Sept 25 – 28,
SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
Bulk Micromegas Our Micromegas detectors are fabricated using the Bulk technology The fabrication consists in the lamination of a steel woven mesh and.
1 Luciano Musa CERN participation to EUDET for TPC electronics CERN, 31 August 2006 Outline Part I – Development of the readout electronics for the LPTPC.
Front-end electronics for Time Projection Chamber I.Konorov Outlook:  TPC requirements  TPC readout options  Options for TPC FE chips  Prototype TPC.
HEP2005, Lisboa July 05 Roberto Campagnolo - CERN 1 HEP2005 International Europhysics Conference on High Energy Physics ( Lisboa-Portugal,
ACTAR Nov 05 Lolly Pollacco CEA Saclay Front End Electronics for ACTAR.
T2K Time Projection Chambers Front-end Electronics – Experience Return P. Baron, H. Bervas, D. Besin, D. Calvet, T. Chaleil, C. Coquelet, X. de la Broïse,
28 August 2002Paul Dauncey1 Readout electronics for the CALICE ECAL and tile HCAL Paul Dauncey Imperial College, University of London, UK For the CALICE-UK.
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.
- Frédéric Druillole - Présentation du SEDI 1 30/06/2015 Complete electronic Readout for Active Target (CERAT) Project Project Physicist’s demands Physicist’s.
Development of novel R/O electronics for LAr detectors Max Hess Controller ADC Data Reduction Ethernet 10/100Mbit Host Detector typical block.
Overview of the read-out electronics for the TPCs at T2K ND280m P. Baron, D. Calvet, X. De La Broïse, E. Delagnes, F. Druillole, J-L Fallou, J-M. Reymond,
L.Royer– Calice DESY – July 2010 Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand R&D LPC Clermont-Fd dedicated to the.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
P. Baron CEA IRFU/SEDI/LDEFACTAR WORKSHOP Bordeaux (CENBG) June 17, Functionality of AFTER+ chip applications & requirements At this time, AFTER+
Large Area Endplate Prototype for the LC TPC 1 D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, M. Dixit, A. Le Coguie, R. Joannes, S.
Micromegas Panels LP electronics P. Colas. Foreword We aim at 1 single system –Same DAQ : easier comparison, less duplicate work We have to keep in mind.
1 E. Delagnes Saclay Dec 3rd CLAS12 Micromegas Tracker: FE electronics
S.Vereschagin, Yu.Zanevsky, F.Levchanovskiy S.Chernenko, G.Cheremukhina, S.Zaporozhets, A.Averyanov R&D FOR TPC MPD/NICA READOUT ELECTRONICS Varna, 2013.
21-Aug-06DoE Site Review / Harvard(1) Front End Electronics for the NOvA Neutrino Detector John Oliver Long baseline neutrino experiment Fermilab (Chicago)
Astrophysics Detector Workshop – Nice – November 18 th, D. Attié, P. Colas, E. Delagnes, M. Dixit, M. Riallot, Y.-H. Shin, S.
The Readout Electronics for TPC with GEM readout chamber (and for almost any other readout chamber) Anders Oskarsson Lund Univ. Electronics: Bruxelles,
The AFTER electronics from a user’s point of view D. Attié, P. Colas Mamma meeting,CERN Feb T2K electronics.
P. Baron CEA IRFU/SEDI/LDEFACTAR Meeting Santiago de Compostela March 11, A review of AFTER+ chip Its expected requirements At this time, AFTER+
Hold signal Variable Gain Preamp. Variable Slow Shaper S&H Bipolar Fast Shaper 64Trigger outputs Gain correction (6 bits/channel) discriminator threshold.
June 22, 2009 P. Colas - Analysis meeting 1 D. Attié, P. Colas, M. Dixit, Yun-Ha Shin (Carleton and Saclay) Analysis of Micromegas Large Prototype data.
TPC electronics for ILD P. Colas Krakow, IFJ-PAN, ILD Pre-meeting September 24, 2013.
1 Luciano Musa, Gerd Trampitsch A General Purpose Charge Readout Chip for TPC Applications Munich, 19 October 2006 Luciano Musa Gerd Trampitsch.
Front-End Electronics for PHENIX Time Expansion Chamber W.C. Chang Academia Sinica, Taipei 11529,Taiwan A. Franz, J. Fried, J. Gannon, J. Harder, A. Kandasamy,
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
Towards a 7-module Micromegas Large TPC prototype 1 D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, M. Dixit, A. Le Coguie, R. Joannes,
SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.
LC Power Distribution & Pulsing Workshop, May 2011 Super-ALTRO Demonstrator Test Results LC Power Distribution & Pulsing Workshop, May nd November.
D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
Pattern Gas Detectors. Towards an R&D Collaboration CERN, 10 September P. Baron1, A. Delbart1, X. de la Broise1, D. Calvet1,
D. Attié, P. Colas, E. Delagnes, M. Riallot M. Dixit, J.-P. Martin, S. Bhattacharya, S. Mukhopadhyay Linear Collider Power Distribution & Pulsing Workshop.
DHCAL Jan Blaha R&D is in framework of the CALICE collaboration CLIC08 Workshop CERN, 14 – 17 October 2008.
A. SarratILC TPC meeting, DESY, 15/02/06 Simulation Of a TPC For T2K Near Detector Using Geant 4 Antony Sarrat CEA Saclay, Dapnia.
CLAS12 Central Detector Meeting, Saclay, 3 Dec MVT Read-Out Architecture & MVT / SVT Integration Issues Irakli MANDJAVIDZE.
CBM 12 th Meeting, October 14-18, 2008, Dubna Present status of the first version of NIHAM TRD-FEE analogic CHIP Vasile Catanescu and Mihai Petrovici NIHAM.
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
1 E. Delagnes Saclay Dec 3rd FE electronics for Micromégas Trackers
Front-end Electronic for the CALICE ECAL Physic Prototype Christophe de La Taille Julien Fleury Gisèle Martin-Chassard Front-end Electronic for the CALICE.
Overview of TPC Front-end electronics I.Konorov Outline:  TPC prototype development  Readout scheme of the final TPC detector and further developments.
Architecture and Implementation of the Front-End Electronics of the Time Projection Chambers in the T2K Experiment P. Baron, D. Besin, D. Calvet, C. Coquelet,
CEA DSM Irfu IDeF-X HD Imaging Detector Front-end for X-ray with High Dynamic range Alicja Michalowska, CEA-IRFU 1 Journées VLSI June 2010.
Status of hardware activity in CNS Taku Gunji Center for Nuclear Study University of Tokyo 1.
IRFU The ANTARES Data Acquisition System S. Anvar, F. Druillole, H. Le Provost, F. Louis, B. Vallage (CEA) ACTAR Workshop, 2008 June 10.
The AGET chip Circuit overview, First data & Status
FEE for TPC MPD__NICA JINR
A General Purpose Charge Readout Chip for TPC Applications
CTA-LST meeting February 2015
96-channel, 10-bit, 20 MSPS ADC board with Gb Ethernet optical output
Large Area Endplate Prototype for the LC TPC
A Readout Electronics System for GEM Detectors
Power pulsing of AFTER in magnetic field
TPC electronics for ILD
VELO readout On detector electronics Off detector electronics to DAQ
LHCb calorimeter main features
TPC electronics Atsushi Taketani
BESIII EMC electronics
SKIROC status Calice meeting – Kobe – 10/05/2007.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
Presentation transcript:

Pattern Gas Detectors. Towards an R&D Collaboration CERN, 10 September P. Baron1, A. Delbart1, X. de la Broise1, D. Calvet1, E. Delagnes1, F. Druillole1, J-L. Fallou1, E. Mazzucato2,F. Pierre2, A. Sarrat2,, E. Virique1, E. Zonca1, M. Zito2. 1CEA Saclay, DSM/DAPNIA/SEDI, Gif-sur-Yvette Cedex, France 2CEA Saclay, DSM/DAPNIA/SPP, Gif-sur-Yvette Cedex, France AFTER- TPC readout electronics The T2K experiment The TPC Electronic architecture The AFTER ASIC Results Status Conclusions LollyPollacco Modified the file Of Pascal Baron

Micro Pattern Gas Detectors. Towards an R&D Collaboration 2 CERN, 10 September 2007 The T2K experiment Super Kamiokande ND280 J-PARC,Tokai Kamioka Goal: Study of neutrino oscillationGoal: Study of neutrino oscillation J-PARC: 50GeV synchrotron (under construction)J-PARC: 50GeV synchrotron (under construction) ND280m: Near detector at 280m from the neutrino production targetND280m: Near detector at 280m from the neutrino production target Time schedule: Q3 2009

Micro Pattern Gas Detectors. Towards an R&D Collaboration 3 CERN, 10 September 2007 The T2K TPCs 359 mm 342 mm 1726 active pads Bulk Micromegas 12 detector modules per TPC plane => 72 modules => pads !! Design of a novel compact readout electronics 2.5m 1m

Micro Pattern Gas Detectors. Towards an R&D Collaboration 4 CERN, 10 September 2007 Initial Requirements & Constraints Store and digitize the detector signal over a 511 sample time window larger than the drift time over 12bits. Must be versatile to be usable with various end-plate detectors and gas (not defined at the beginning of the design Q1 2005): compatible with both polarities of signal, programmable gain Sampling frequency adjustable (1MHz-50MHz) Short time development (2 years for the all electronics) => architecture with limited risks and use of mature technologies. Minimum power consumption (detector inside magnet). Minimize the cabling between detectors and acquisition. Low cost But, fortunately: Low Event rate: beam rate ~0.3Hz; cosmic ~ 20Hz. External trigger available.

Micro Pattern Gas Detectors. Towards an R&D Collaboration 5 CERN, 10 September 2007 A Highly multiplexed architecture to reduce the power consumption taking benefit of the low event rate Read-out Electronic Architecture Architecture principles AFTER ASIC : 72 channels; Signal amplified & stored in the SCA (511 cells) External trigger: digitization of the totality of the SCA of all the channels (2ms) ADC + digital buffer mounted close to the detector Multiple optical fibers send data to off-detector concentrators Interface to common DAQ via standard network Pre-amp and shapers Samplers and multiplexers Analog to digital conversion Digital buffer Data concentration ~ channels 1728 AFTERs On-detector electronics 72 Optical fibers 1-6 Tbaud*/s peak *1 baud = 10 bit ~2 ms retention max. 34 Gbaud/s peak 400 Gbit/s peak ~1-10 Gbit/s averaged Shared DAQ system ~0.1-1 Gbit/s Standard LAN connection(s) 432 FEC 6 Concentrator Cards 72 Mezzanine cards 432 ADCs

Micro Pattern Gas Detectors. Towards an R&D Collaboration 6 CERN, 10 September TPC 1 m 2,5 m 1 of 6 TPC planes (12-modules) Outside magnetInside magnet 1 of 6 Data Concentrator Card 12 duplex Optical fibres x 6 TCP/IP PC Linux 6 DCCs VME/PCI backplane bus Gigabit Ethernet DAQ control Detector B Detector A Global trigger Réseau 1 of 72 modules Front End Mezzanine Card (FEM) 288 channel Front End Card (FEC) 1728 pad Micromegas plane Slow control network Optical fiber to/from DCC Low voltage Power supply 1 of 1728 Front-End ASIC “AFTER” 72 channel x 511 time buckets Switched capacitor array Read-out Electronic Architecture

Micro Pattern Gas Detectors. Towards an R&D Collaboration 7 CERN, 10 September 2007 Assume that … 50cm diameter 0.25 cm²/pad 8000 pads  10,000 pads AFTER 72 Channels/ASIC 160 AFTER chips 36 FEC 6 FEM 1 Optic Concentrator 50 cm Card (FEM) 288 channel Front End Card (FEC) 1728 pad Micromegas plane Optical fiber to/from DCC

Micro Pattern Gas Detectors. Towards an R&D Collaboration 8 CERN, 10 September 2007 Then … An event of two traces will give us –300 fired pads –300x511x2 bytes = 306Kbytes = Assume 1,000 events/sec –306 Mbyte/sec –Need 1GHz through-put Am not sure we can afford the 1k events/sec Rise –Time difficulty Placing the AFTER layout –Dead-time is common for the full AFTER chip

Micro Pattern Gas Detectors. Towards an R&D Collaboration 9 CERN, 10 September 2007 AFTER Main Features Main features: Input Polarity: positive or negativeInput Polarity: positive or negative 72 Analog Channels72 Analog Channels 4 Gains: 120fC, 240fC, 360fC & 600fC4 Gains: 120fC, 240fC, 360fC & 600fC 16 Peaking Time values: (100ns to 2µs)16 Peaking Time values: (100ns to 2µs) 511 analog memory cells / Channel:511 analog memory cells / Channel: Fwrite: 1MHz- 50 MHz; Fread: 20MHz AFTER 511 cells SCA FILTER PA 76 to 1 BUFFER SCA MANAGER SLOW CONTROL Serial Interface W / R Mode CK ADC TEST In Test Asic Spy Mode CSA;CR;SCAin (N°1) Power On Reset Slow ControlSlow Control Power on resetPower on reset Test mode:Test mode: calibration or test [channel/channel] functional [72 channels in one step] Spy mode on channel 1:Spy mode on channel 1: CSA, CR or filter out No zero suppress. No auto triggering. No selective readout.

Micro Pattern Gas Detectors. Towards an R&D Collaboration 10 CERN, 10 September 2007 AFTER Main Features Main features: Input Polarity: positive or negativeInput Polarity: positive or negative 72 Analog Channels72 Analog Channels 4 Gains: 120fC, 240fC, 360fC & 600fC4 Gains: 120fC, 240fC, 360fC & 600fC 16 Peaking Time values: (50/100ns to 2µs)16 Peaking Time values: (50/100ns to 2µs) 511 analog memory cells / Channel:511 analog memory cells / Channel: Fwrite: 1MHz-100MHz; Fread: 20MHz AFTER 511 cells SCA FILTER PA BUFFER SCA MANAGER SLOW CONTROL Serial Interface W / R Mode CK ADC TEST In Test Asic Spy Mode CSA;CR;SCAin (N°1) Power On Reset Slow ControlSlow Control Power on resetPower on reset Test mode:Test mode: calibration or test [channel/channel] functional [72 channels in one step] Spy mode on channel 1:Spy mode on channel 1: CSA, CR or filter out No zero suppress. No auto triggering. No selective readout. ADC

Micro Pattern Gas Detectors. Towards an R&D Collaboration 11 CERN, 10 September 2007 Possible Changes Pre-amp also outside Slow controlled Shaper Disc Trigger (Sum of Disc) –Slow controlled Selective read-out via FPGA Selective trigger via FPGA Increase in gain by x2 possible Increase of an ADC at 20 MHz read-out

Micro Pattern Gas Detectors. Towards an R&D Collaboration 12 CERN, 10 September 2007 Layout & package Technology: AMS CMOS 0.35µmTechnology: AMS CMOS 0.35µm Area: 7.8 x 7.4 mm 2Area: 7.8 x 7.4 mm 2 Package: LQFP 160Package: LQFP 160 (28x28x1.4 mm) Run: April 2006Run: April 2006 Delivery: August 2006Delivery: August 2006 Test: Start in October 2006Test: Start in October 2006 SCA : 76 x 511 Cells

Micro Pattern Gas Detectors. Towards an R&D Collaboration 13 CERN, 10 September 2007 AFTER Test set-up LABVIEW Test Software Interface card Evaluation kit (Memec) Xilinx Virtex 2 pro Protection 1 Protection 2 No Protection ASIC Test Socket Protection1: diodes + PhotoMOSProtection2: diodes Font-end ASIC Test Card

Micro Pattern Gas Detectors. Towards an R&D Collaboration 14 CERN, 10 September 2007 Pulse Shape Range Tpeak (5% -100%) Tpeak (100% -5%) FWHM 100ns111ns182ns150ns 200ns185ns552ns287ns 400ns387ns823ns631ns 1µs893ns2118ns1529ns 2µs1776ns4037ns2953ns FWHM

Micro Pattern Gas Detectors. Towards an R&D Collaboration 15 CERN, 10 September 2007 Charge Gain Charge Range120fC240fC360fC600fC Gain18mV/fC9.7mV/fC6.7mV/fC4.1mV/fC Spread (ASIC)5.6%4%3.8%3.4% Spread (50 ASICs)12%8%7%6.5%

Micro Pattern Gas Detectors. Towards an R&D Collaboration 16 CERN, 10 September 2007 Linearity Specification: Specification: 1% [0-3MIPS]; 5% [3-10MIPS] < 1.2% Full range Measured INL < 1.2% Full range Range: 120fC; FCKW=50MHz At 100MHz, the INL is the same Large speed margin of the system !! Range: 120fC; FCKW=100MHz Peaking Time: 100ns

Micro Pattern Gas Detectors. Towards an R&D Collaboration 17 CERN, 10 September 2007 Baseline of 50 Asics x 76 channels Spread: 360 ADC bin peak-peak Baseline of 1 Asic x 76 channels Spread: 160 to 300 ADC bin peak-peak The mean value is controlled on the FEC card. It will be fixed to the same value on all the TPC FEC cards Pedestals

Micro Pattern Gas Detectors. Towards an R&D Collaboration 18 CERN, 10 September 2007 Equivalent Noise Charge on ASIC Icsa : 400µA measured (dots) and parameterized (lines) for the 120fC range Icsa : 800µA Noise equation for AFTER The current of CSA input transistor is controlled on the FEC

Micro Pattern Gas Detectors. Towards an R&D Collaboration 19 CERN, 10 September 2007 Input Protection Circuit PhotoMOS Other pads 100M Ω 1V 220pF PAD In ASIC Need to protect the electronic against spark Input Protection diode in ASIC, but robustness ??Input Protection diode in ASIC, but robustness ?? => Input Protection diode on the FEC Need to protect the electronic against spark Input Protection diode in ASIC, but robustness ??Input Protection diode in ASIC, but robustness ?? => Input Protection diode on the FEC The TPC must work without distortion of the electric field even in case of problem on a Micomegas module No access to the module inside the magnet during data takingNo access to the module inside the magnet during data taking  PhotoMos to disconnect the pad from the ground [1 PhotoMos for 2*72 channels] The TPC must work without distortion of the electric field even in case of problem on a Micomegas module No access to the module inside the magnet during data takingNo access to the module inside the magnet during data taking  PhotoMos to disconnect the pad from the ground [1 PhotoMos for 2*72 channels] Pad capacitance Measurements on module MM1_005 7 to 17pF Measurements on module MM1_005 7 to 17pF

Micro Pattern Gas Detectors. Towards an R&D Collaboration 20 CERN, 10 September 2007 Equivalent Noise Charge on TPC module Range: 120fC Target value: ENC <750 e - T2K: 200ns or 400ns

Micro Pattern Gas Detectors. Towards an R&D Collaboration 21 CERN, 10 September 2007 Range: 240fC Target value: ENC <1500 e - Equivalent Noise Charge on TPC module

Micro Pattern Gas Detectors. Towards an R&D Collaboration 22 CERN, 10 September 2007 Equivalent Noise Charge on TPC module Range: 360fC Target value: ENC <2250 e -

Micro Pattern Gas Detectors. Towards an R&D Collaboration 23 CERN, 10 September 2007 Equivalent Noise Charge on TPC module Range: 600fC Target value: ENC <3750 e -

Micro Pattern Gas Detectors. Towards an R&D Collaboration 24 CERN, 10 September 2007 ASIC Cross-talk Asic connected to the MM03;Calibration modeAsic connected to the MM03;Calibration mode High signal on ch 18; Range: 120fC; TPeak =100nsHigh signal on ch 18; Range: 120fC; TPeak =100ns Average output Ch 18 Ch 16 Ch 17 Ch 19 Ch 20 Pedestal & FPN subtracted The crosstalk is mainly derivative Relative Cross-talk amplitude (Amplitudes normalized by the 18) 18 < +/- 0.4% Cross-talk is proportional to the distance / ch 18

Micro Pattern Gas Detectors. Towards an R&D Collaboration 25 CERN, 10 September 2007 SCA leakage Current Reading Phase: 2ms High leakage current can degrade the signal/noise ratio Reading Phase: 2ms High leakage current can degrade the signal/noise ratio Amplitude variation for 2ms of memory time 1 (asic) x 76 (channels) x 511 (memory cells) < 1 ADC bin 97% < 0.5 ADC bin

Micro Pattern Gas Detectors. Towards an R&D Collaboration 26 CERN, 10 September 2007 Power & Yield Yield on a total number of 198 Asics: 73% The main current sources are controlled on the FEC card Icsa = 400µA; 1.88mA & 6.25mW per channel (135.5mA & 447mW per ASIC)Icsa = 400µA; 1.88mA & 6.25mW per channel (135.5mA & 447mW per ASIC) Icsa = 800µA; 2.28mA & 7.52mW per channel (164.2mA & 542mW per ASIC)Icsa = 800µA; 2.28mA & 7.52mW per channel (164.2mA & 542mW per ASIC) The main current sources are controlled on the FEC card Icsa = 400µA; 1.88mA & 6.25mW per channel (135.5mA & 447mW per ASIC)Icsa = 400µA; 1.88mA & 6.25mW per channel (135.5mA & 447mW per ASIC) Icsa = 800µA; 2.28mA & 7.52mW per channel (164.2mA & 542mW per ASIC)Icsa = 800µA; 2.28mA & 7.52mW per channel (164.2mA & 542mW per ASIC) Example of bad chip

Micro Pattern Gas Detectors. Towards an R&D Collaboration 27 CERN, 10 September 2007 Status of electronic Present Status FEC 7 boards produced and tested7 boards produced and tested Foresee PRR in ~Q1-2008; production in ~Q2-Q3 2008Foresee PRR in ~Q1-2008; production in ~Q2-Q Present Status FEC 7 boards produced and tested7 boards produced and tested Foresee PRR in ~Q1-2008; production in ~Q2-Q3 2008Foresee PRR in ~Q1-2008; production in ~Q2-Q Present Status FEM 1 board produced and tested1 board produced and tested Foresee PRR in ~Q2-2008Foresee PRR in ~Q & Production in ~Q3-Q Present Status FEM 1 board produced and tested1 board produced and tested Foresee PRR in ~Q2-2008Foresee PRR in ~Q & Production in ~Q3-Q Present Status AFTER 200 ASICs tested200 ASICs tested Foresee PRR in 12 October 2007; production in ~Q4-2007Foresee PRR in 12 October 2007; production in ~Q Present Status AFTER 200 ASICs tested200 ASICs tested Foresee PRR in 12 October 2007; production in ~Q4-2007Foresee PRR in 12 October 2007; production in ~Q4-2007

Micro Pattern Gas Detectors. Towards an R&D Collaboration 28 CERN, 10 September 2007 Present Status of TPC module Micromegas Module + 1 FEC tested at Lab with 55 Fe source E mesh = 350 V E drift = 200 V/cm ~8% energy 5.9 keV Ar(95%)/iC 4 H 10 (2%)/CF 4 (3%)

Micro Pattern Gas Detectors. Towards an R&D Collaboration 29 CERN, 10 September 2007 Present Status of TPC module 1 complete Module will be tested at the end of September in the HARP cage for cosmic tests 6 FECs 1 Micromegas Detector 1 FEM Power Supply (PC ATX) 1 reduced DCC m Optical fibre Linux PC Power Supply (PC ATX) Ethernet #1 Ethernet #2 (DAQ) RS232 (Console) CERN LAN NIM->LVTTLTrigger HARP flange

Micro Pattern Gas Detectors. Towards an R&D Collaboration 30 CERN, 10 September 2007 AFTER upgrade for nuclear projects: AFTER upgrade for nuclear projects: selective readout; threshold/channel & auto triggering The next week, the complete TPC module will be tested with cosmics The next week, the complete TPC module will be tested with cosmics The Tests prove the full functionality of the electronic The Tests prove the full functionality of the electronic Compact readout electronic for large TPC Compact readout electronic for large TPC Conclusion