SFB CSEM 4’’

PROCESS FLOW

#1 avant recuit

#1 apres recuit

#2 RT manuel avant recuit

#2 RT manuel apres recuit

#3 RT manuel avant recuit

#3 RT manuel après recuit

#4 avant recuit

#4 apres recuit

TEST SET-UP – NEW connector O-ring

#3 (#3????)

#1 (#4???)

#4 (#2???)

#2 (#1???)

RESULTS Hold 700bar  not broken wafer1Wafer2 Wafer3 Wafer4 top middle bottom top middle bottom top middle bottom top middle bottom

Z11 - DP650RT___Ti-Ni-Au_unif nm s METALIZATION Frame4, frame3, ATLAS devices metalized with mask! Soldering test: 4 times ok! No clean Si surface!