High energy Ions From this direction Liquid Hydrogen Target Gold Foil surround (Not Shown) 3 Layers of Silicon Vacuum Chamber Calorimeter R3B Si Tracker Layout Optimised for tracking of high-energy protons to select events from QFS reactions e.g. (p,2p), (p,pn)…

Silicon ASICs (12 or 16 per side of each module) Rigid PCBs with flex tail 1 per side of module with Al cooling plate between Feed through connectors. 68 way. 24 Connector with all connections for up to 16 ASICs on one side of Si module. 150 pins per connector: 4 diff pairs for serial data 1 diff pair for TS clock 3 single ended for I 2C 1 wired OR for FT OR 1 diff pairs for Val/gate 1 single ended for reset 4 pins ladder address (3 levels) 8 pins for 2x PT100 1 pin for Si bias voltage/return 64 Ground pins 4 per ASIC 32 Power pins 2 per ASIC (A & D) 24 Extra grounds Buffer board including LVDS buffers, power regulation and signal isolation. The R3B Si tracker comprises 30 double sided modules like the one shown here: Outer layer 12 modules (16+16 ASICs each) Middle layer 12 modules (16+16 ASICs each) Inner layer 6 modules (12+12 ASICs each) Shared Si module support PCB. No active parts, routing only (Probably 1 annular shape PCB handling all 30 modules) Diagram to show how a single Si module (ladder) is connected to the Si support module and feed-throughs. Power connection for ASICs and Si bias (common for all modules)

Si Inner Si Middle Si Out er ASIC 120k strips 912 ASICs Si Inner ASIC Si Middle ASIC Si Out er ASIC x6 x12 FPGA enet FPGA enet FPGA enet FPGA enet FPGA enet FPGA enet Detectors in Vacuum DAQ in Air Slow Control 10G Switch DAQ PC(s) To R3B DAQ 30 uTCA FEE cards + switches and clock card CALIFA Timestamp & coincidence links R3B Si Tracker (NUSTAR) Clk & trig i/f White Rabbit timing FMC i/f FMC i/f FMC i/f FMC i/f FMC i/f FMC i/f 3x uTCA crates

Outer detector assembly (300µm) Inner detector assembly (100µm) Plan to use the same mask set for the green detector of the outer and inner modules to reduce cost. In total 4 different masks are needed. R 3 B Si Tracker Sensors

Silicon sensors Four different geometries (A, B, C, D), and thickness of 300 um (outer ring) and 100 um (inner ring). Number of strips ranges from 876 in D(100) detector to 2048 in C(300) um strips in stereo configuration of p and n side ABC DB 300 um 100 um

Alignment and Bonding Three ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Adjusting bonding parameters on our sample pieces has allowed us to achieve good wire bonds with sufficiently good pull strengths.

R3B Si Tracker Status - 19 April 2013 Main Highlights: First ASIC prototypes delivered and testing system constructed Tests of ASIC so far show they are functioning Readout tests of 300um prototype Si finished, 100um ongoing Approval given to Micron for production of 300um Si sensors Prototype flex cable received and assembled Assembly procedure of ASICs to Flex trialled Prototype ASICs bonded to flex cable and awaiting bonding Production of prototype Si ladder underway Production of prototype readout underway Final R3B PDRA interviews held at Daresbury yesterday (18 April 2013) Conceptual design for a target mechanism done Mechanical design concentrating on supporting the Si tracker structure and vacuum chamber, insertion and removal, etc. Status will be reported at R3B Collaboration Meeting in GSI in May.

Dave Seddon, Liverpool Si C fibre structure ASIC chips mounted on Flex board Cu cooling blocks Coolant ~-20° C flowing in Cu pipe

Day 3

Day 3 - Section

Prototype R3B Si Tracker Modules  Work underway to determine how to align the sensors to be wire bonded together Hoping to be able to use cut edges of the detectors if good enough quality and relationship with Fiducials marked on Si well established.  Work also underway on Si test assemblies Bonding jigs built to test gluing and wire bonding with ‘mechanical’ Si pieces (300 um so far). Liverpool and Daresbury technicians training in LSDC. Confident that sensors can be wire bonded successfully.  Next steps Wire bonding of ‘real’ R3B Si sensors and readout with VA1TA ASIC test boards (before R3B ASIC PCBs available) planned for end of January Plan to build ‘mock-up’ detector module trial assemblies with 300um glass and glass blank ASIC chips.

£155k (+VAT) For masks and 14 sensors R3B Si Tracker Prototype Sensors 13 (+1) useable R3B Si prototype sensors from Micron since summer All 4 designs (A, B, C, D) and 2 thicknesses (100um and 300 um). All tested in Liverpool LSDC against specifications.

The R3B Si prototypes Goal: to assembly one detector module to test the detector performance as well as the production process. silicon sensors mounting frame PCB ASICs

Alignment and Bonding Three mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. At each corner, use the SmartScope’s feature finder to identify the edges, and find where these lines intersect to define the corner.

Alignment and Bonding Three ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Adjusting bonding parameters on our sample pieces has allowed us to achieve good wire bonds with sufficiently good pull strengths.

Full Flex PCB completed PT100 ASICs Fit here

All three items viewed from above. The black raised ASIC vacuum pads can just be seen on the vacuum jig underside. 200um spars in laser cut stencil to separate ASICs.

ASIC-Flex Assembly Procedure: I

ASIC-Flex Assembly Procedure: II

ASIC-Flex Assembly Procedure: III Testing of chip assembly can start now

Flex during attachment to copper cooling plate Attached with double sided thermal adhesive coated copper tape

ASIC/Si test box – prototype detector Copper cooling plate(s) fixed to FR4 PCB ready to accept Flex boards. FR4 board waiting for silicon to be fitted and wire bonded.