Listing 823. GPON/EPON the next generation of broadband optoelectronics system on a chip

GPON on a Chip GPON/EPON the next generation of broadband optoelectronics system on a chip Optical networking. Use of proven semiconductor fabrication technology to build a low cost, integrated electrical and optical system on the same IC chip (GPON).

Market Primary market is manufacturing of electrical and/or optical network communication components. This is a global opportunity as high-speed networks are being installed all over the world.

Market Growth Significant global growth for the PON technology is predicted in the next five years. Worldwide market for GPON electronics -- optical network terminals (ONTs) and optical line terminals (OLTs) -- will be worth $4.7 billion in 2011, up from about $1.3 billion this year.

Major players Verizon Ericsson AB Alcatel-Lucent France Telecom Nokia Siemens Networks Cisco Intel PacketFront

Problem Solved by the Technology Integration between optical and electronics- based systems by using a single device. Today the connectivity is made through specially made couplers and components that have relatively higher losses, more expensive to manufacture, and are less reliable.

How the Technology Solves the Problem A proven semiconductor manufacturing processes and methodologies, which are very precise, reliable, and at a lowest cost of manufacturing.

Technology Deployment Delivered to the manufactures via systems and processes used by semiconductor manufacturing companies. The products will be sold to the network content providers.

Competitive Advantage Significant cost savings. Lower cost resulting from fewer components.

Development Platform Manufactured with semiconductor processing tools.

Development Status Near prototype stage. Optical coupler is ready for production, detectors and filters are off the shelf, the laser diode needs to be reconfigured, gratings on the silicon substrate need optimization.

Intellectual Property Ownership The I.P. belongs to the seller, a large U.S. semiconductor manufacturing materials company. There are no known liens or encumbrances.

Patent Status U.S. Patents Pending: 1. Patterning 3-D Features in a Substrate. 2. Optical Coupling to IC Chip. 3. Multiplexed Optical Sub-Assembly. 4. Wafer Level Alignment of Optical Elements. Patent information provided upon request.

Productization The existing development team is in Silicon Valley, USA. Some engineering resources would be required to complete the development. The team and know-how are available from the U.S.

Deal Structure Sought The deal structure envisaged is the sale of this technology asset. Acquisition in 3 parts: Initial acquisition. Payment triggered when patents are issued. Royalties on product sales 3-5% Royalties

Frequently Asked Questions And Answers Why is the developer of this technology listing this technology? Although the developer is a Fortune 500 company, it supplies semiconductor manufacturers and does not have existing channels to bring this product to market.

Follow Up Please refer to Tynax listing number: 823 with regard to this opportunity. Inquiries should be directed to: Moshe Sarfaty

Thank You