3/5/2007(c) 2007 UEI Inc.1 Design Review United Electronic Industries DNR-12 -3U 12 DNA Rack With CPU/NIC Enclosure.

Slides:



Advertisements
Similar presentations
A case should be... Case dimension (WxDxH mm) 170 x 405 x 360 with front bezel Motherboard configuration micro ATX (9.6 x 9.6) Drive configuration 2 -
Advertisements

PGS Introduction "Value Series" : Best VALUE gaming cases with the highest C/P Ratio (Cost to Performance ratio). "Professional Series – Red label" :
PGS Introduction "Value Series" : Best VALUE gaming cases with the highest C/P Ratio (Cost to Performance ratio). "Professional Series – Red label" :
PGS Introduction "Value Series" : Best VALUE gaming cases with the highest C/P Ratio (Cost to Performance ratio). "Professional Series – Red label" :
NetSure™ RDB Series.
Engineer Training XL1200 Mechanics. Engineer Training XL1200 Mechanics Confidential 2 The XL1200 is both a Roll to Roll and a Roll to Sheet Printing Machine.
The 5-slot 4U DC chassis is one of a line of products that Asis has developed over the years with it’s vas experience in the ATCA field. Asis AdvancedTCA.
The 5-slot 5U AC Chassis,fully field deployable chassis with AC power supply for full redundancy. AsisAdvancedTCA Class Asis AdvancedTCA Class.
Supermicro © 2009Confidential MCP N installation guide Rech Weng.
PGS Introduction "Value Series" : Best VALUE gaming cases with the highest C/P Ratio (Cost to Performance ratio). "Professional Series – Red label" :
Colin Chang 12/02/09 CM 690 II (Regular, Plus, Advanced) Sales Kit.
PGS Introduction "Value Series" : Best VALUE gaming cases with the highest C/P Ratio (Cost to Performance ratio). "Professional Series – Red label" :
Cad Setup of Vacuum Tank on Dennis Eagle Truck Placement of the tank on the truck chassis, Design of Chassis rail and vacuum system layout calculated in.
3U ATCA Shelf October Proprietary and Confidential-
Enclosures & ComponentsBackplanesSystem PlatformsSwitches, Knobs & LEDsCabinets ATCA Systems Technology Meeting CERN Genève.
Asis AdvancedTCA Class. What is PICMG? PICMG - The PCI Industrial Computers Manufacturer's Group Is a consortium of over 450 industrial computer product.
April 8, 2005 ANITA Collaboration Meeting/UCI/Marc Rosen 1 EMI AND THERMAL ISSUES THE MAIN ANITA EMI ENCLOSURE AND THE SIP EMI ENCLOSURE HAVE SIMILAR CONSTRUCTION,
MIS 1.5 Hardware Overview.
Engineer Training Mechanical Overview. Engineer Training Confidential 2 XL1500 is both Roll-to-Roll and Roll-to-Sheet Printer MachineXL1500-2mXL1500-3mXL1500-5m.
KG4RUL. Utilize Commercially Available Box Contain Multi-band, Multi-Mode Radio Contain AC Power Supply Contain HF Auto-Tuner Provide Connections for.
Heat Sink Selection Thermal Management of Electronics
Simply the Best! Simply the Best! Corporate Overview Corporate Overview.
ZTF Interconnecting Scheme Stephen Kaye
A case should be... The mission of YY-W2xx Server Chassis Application Power User Workstation Small and Medium Business Pedestal Server Quick view at products.
1 An Introduction to the Storage Bridge Bay Specification.
Specific shapes designed for commercial a/V installation requirements
Gaurang Electronic Industries DIN Rail Enclosures DIN Rail PCB Holders DIN Std. Plastic Instrument Cases.
BioWin ®. Bio Gas – The alternative energy source of the future! BioWin ® - Bio Gas Analysis of the future!
AR4702 (cover plate replacement) Remove existing cover plate by removing the 2 x screws fixed through the top of the plate into the chassis (Phillips screw.
Thomas Jefferson National Accelerator Facility Page 1 UITF Progress meeting Approved Labyrinth Fresh air pulled through “chicken wire” gate.
Medical Consumables Tracking (MCT). Gap We do not have the capability to track medical inventory in a manor that integrates securely with the medical.
PGS Introduction "Value Series" : Best VALUE gaming cases with the highest C/P Ratio (Cost to Performance ratio). "Professional Series – Red label" :
INTER-LAKES BASES PRODUCTS. MODEL B-75 MACHINE BASE B-75 Model with panels and doors.
GLAST LAT ProjectDOE/NASA Mechanical Systems Peer Review, March 27, 2003 Document: LAT-PR-0XXXX Section 5.1 Grid Box Design 1 GLAST Large Area Telescope:
Building a PC. Motherboard Selection Ensure the selected motherboard is appropriate for the processor model and frequency you are planning to use AMD.
1 5 December 2012 Laurent Roy Infrastructure / Electronics Upgrade -Cabling (long distance) -Rack and Crate (space, electrical distribution, cooling) -Detector.
By: Dorian Gobert. In 1998, the Gateway G6-450 was "top of the line", the fastest computer Gateway offered. Compared it to the eMachines ET in.
Single Board Controller Comments Roger Smith Caltech
Table of Contents Project Overview (brief explanation of leukodystrophy) Reviewed customer needs Reviewed engineering specs Detailed system lay out Mechanical.
V4 Black Edition Sales Kit Black Revolution VM30001W2Z.
Sept. 2008EFW INST+SOC PDR IDPU Chassis Mechanical Design and Development Bill Donakowski Mechanical Engineer UCB/SSL
-Proprietary and Confidential-
The 2-slot 2U DC chassis is one of a line of products that Asis has developed over the years with it’s vast experience in the ATCA field. Asis AdvancedTCA.
Modern electronics continue to be placed in denser packaging and smaller enclosures, often causing overheating problems Moisture and airborne dust, oil,
LHC CMS Detector Upgrade Project FPIX Cooling Update Stefan Grünendahl, Fermilab For the FPIX Mechanical Group, 29 January 2015 Stefan Grünendahl,
For Official Use Only; Information herein NOT Approved for Export; Contains Proprietary Protected Information; NOT for Public Release 1 WIPER PDR Stanford,
Parts of the computer Deandre Haynes. The Case The Case This Case is the "box" or "chassis" that holds and encloses the many parts of your computer. Its.
Proprietary Material – Innovative Research, Inc. Hands-On Use System-level analysis of an air-cooled cabinet  Model will be set up for successively complex.
MacBone unit enters in condition as shown to left. MacBone unit completely overhauled as shown to right. MacBone unit prior to overhaul.Overhauled MacBone.
Single Board Controller Comments Roger Smith Caltech
109-IDPU-Chassis-Donakowski 1 30 Sep – 01 Oct 2009DRAFT RBSP EFW ICDR 109-IDPU-Chassis-Donakowski IDPU Chassis Mechanical Design and Development Bill Donakowski.
RBSP Radiation Belt Storm Probes RBSP Radiation Belt Storm Probes RBSP/EFW CDR /30-10/1 535 IDPU Chassis Bill Donakowski Mechanical Engineer UCB/SSL.
Ventilation & Airflow NetShelter CX 18U,24U,38U Ambient office air is drawn in to the soundproofed air-intake chambers on either side of the NetShelter.
Genesis Technology USA, Inc. Heatsink Technologies November 2,
We are one of the accredited manufacturers and suppliers of Accoustic Enclosure and Sound Proofing in northern part of India under brand Name of "DDSTHA".
Enclosures & ComponentsBackplanesSystem PlatformsSwitches, Knobs & LEDsCabinets Friedrich Fix 1 AdvancedTCA Systems Platforms according to PICMG.
10 SERIES ® PAGODA STYLE VENT OPTIONS Crenlo’s newest Emcor Product.
CANOVATE MOBILE (CONTAINER) DATA CENTER SOLUTIONS
FuHe Mini-ITX Chassis Product Line:
Bill Donakowski Mechanical Engineer UCB/SSL
Air Distribution Control
Chamber Design and Integration RE3/1 and RE4/1
The mission of YY-W2xx Server Chassis
LSG Capabilities LSG nomenclature: WV - Work Volume AL - Air Lock
SCT/Pixel Draft Rack Layout rcj
OCP Mezz 3.0 Mechanical Recommendations
The Challenges of Electronic Enclosures for US Navy Ships
EVLA LO/IF Racks/Bin/Modules
Tagger Microscope Mounting, Shielding & Cooling
Week 3 Web site Point Filters
Presentation transcript:

3/5/2007(c) 2007 UEI Inc.1 Design Review United Electronic Industries DNR-12 -3U 12 DNA Rack With CPU/NIC Enclosure

3/5/2007(c) 2007 UEI Inc.2 Enclosure Requirements Enclosure to be 19” rack mountable, wall mountable and table top capable Aluminum sheet metal construction, painted black Max size: 5.25”H x 17.5”W x 5.5”D Custom backplane for plug-in modules Accept 15 Custom Designed Plug-in Modules: –12 I/O Modules (Plus 1 Extension Bay) –CPU/NIC Module –DC Input Module –Buffer Module Forced air cooling via 3 or 4 axial fans –System to be pressurized to minimize dust infiltration Removable air filter (s)

3/5/2007(c) 2007 UEI Inc.3 Layout Drawing

3/5/2007(c) 2007 UEI Inc.4 Enclosure Isometric View

3/5/2007(c) 2007 UEI Inc.5 Enclosure Front View

3/5/2007(c) 2007 UEI Inc.6 Air Flow Cross Section

3/5/2007(c) 2007 UEI Inc.7 Enclosure W-Modules DC Input I/O Module CPU/NIC Chassis I/O Expansion Buffer

3/5/2007(c) 2007 UEI Inc.8 Enclosure Empty

3/5/2007(c) 2007 UEI Inc.9 Enclosure Exploded ISO Front Mounting Brackets Removable Rear Fan Panel 60x10mm Fans

3/5/2007(c) 2007 UEI Inc.10 Enclosure Exploded ISO Rear Air Filter Backplane Removable Rear Fan Panel

3/5/2007(c) 2007 UEI Inc.11 Chassis EMI Gasket

3/5/2007(c) 2007 UEI Inc.12 Chassis Exploded View Card Cage Left Side Panel Right Side Panel Base Plate Rivets

3/5/2007(c) 2007 UEI Inc.13 Backplane

3/5/2007(c) 2007 UEI Inc.14 Module Requirements I/O and CPU/NIC modules to utilize existing PCB Front Panel captive fastener Inserter/extractor Plug into custom backplane Ability to get DC power from backplane EMI shielding gaskets between modules New DC Input and Buffer modules Blank filler module required to cover unused bays

3/5/2007(c) 2007 UEI Inc.15 CPU/NIC Module

3/5/2007(c) 2007 UEI Inc.16 I/O Module

3/5/2007(c) 2007 UEI Inc.17 Buffer Module

3/5/2007(c) 2007 UEI Inc.18 DC Input Module