GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 1/9 PH-DT Status of Microchannel Cooling J. Daguin (CERN PH/DT) A. Mapelli (CERN PH/DT) M. Morel (CERN PH/ESE) J. Noel (CERN PH/DT) G. Nuessle (UCL) P. Petagna (CERN PH/DT) Status of thermal tests Status of integration/infrastructure Micro-fabrication plans

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 2/9 PH-DT Tests on “GTK SFB” Design Continue

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 3/9 PH-DT New Kapton Heater: “GTKSym v1.1” FLOW IN FLOW OUT HEATING SURFACE Better adapted size (40 x 60 mm) 3 separated heating regions 15 PT100 temperature sensors Test under mild vacuum (1÷2 ·10 -2 mbar) No detectable leak Contact by thermal grease (Electronics) (Sensor) Waiting for new 3D thermo-mechanical simulator (“GTKSym v2.0) -> see talk by M. Morel

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 4/9 PH-DT Some Thermal Results (T uniformity) FLOW IN (T ~ -2 °C) FLOW OUT (T ~ +1.5 °C) HEATING SURFACE (middle row of temperature sensors) P = 15 W (½ nominal) Q = kg/s (½ nominal)  T IN-OUT ~ 3.5 °C

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 5/9 PH-DT Thermal Results (Preliminary transients)

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 6/9 PH-DT Thermal Test Programme Explore temperature uniformity in design conditions Explore temperature on sensor vs. inlet coolant temperature Explore sensitivity to flow rate errors Explore off-design conditions (e.g. partial chip failure) Explore time gradient of temperature in case of cooling failure Define electronics on/off transient properties (cooling on)

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 7/9 PH-DT Integration in GTK Module Work space prepared inside the Divisional Silicon Facility (bldg 186) Dedicated Technical Student starts end of August Possibly one US Summer Student available before then Staystik: paste -> received; film -> sent from firm Also available: diamond-loaded SU-8 (spin-coatable in thickness < 1  m Diamond-loaded epoxy ME7159 from “Al Technology”

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 8/9 PH-DT Infrastructure Meeting agreed with EN/CV-DC on May 26 th to start discussing detailed specs for the cooling plant (preferred option: cold liquid C 6 F 14, scaled down from CMS PIX unit, single unit with 3 branches, controls under Unicos+PVSS) 1 rack needed in the cavern (exp. site visited on May 6 th, preliminary requirements provided to Gilles Maire on May 17 th ). Option A: rack in TCC8+ minimal distance from GTK – longer access time after dump Option B: rack in ECN3+ shorter access time after dump – very long transfer lines Open question: optimal position for controlling PLC?

GTK WG Meeting May 24 th 2011 Status of Microchannel Cooling - Paolo Petagna 9/9 PH-DT Micro-fabrication plans Final round of optimization of micro-fluidics design Define minimal thickness (long process, requires many hours in clean room). Target: 150  m Increase reliability of bonding process, in particular for Si-Si Enhance analysis via non-destructive methods to improve QA/QC for serial production