1 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Module Approval Explained 04/18/02 Jeffrey Schiffer

2 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Agenda Background Existing Module Approval Status Details of the Requirements Proposed Changes Single Device Approval Industry Consortium

3 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Background Before the Module Approval process –ALL intentional radiator implementations need to be individually “type” approved. –This is a large burden to OEM’s (each instantiation must be individually approved), and also to the regulators that need to process the applications –Translates directly to a TTM and cost issue

4 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Present Regulations The FCC released (6/26/00) Public Notice DA , governing Part 15 unlicensed Modular Transmitter approval The process has been incorporated in the R&TTE requirements (EU) The Japanese MPT are currently reviewing the process The FCC regulations have been sent to China, and further discussions are required

5 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Modular Approval Full Modular Approval is for compliance with ALL 8 of the requirements Limited Modular Approval is available as a sub-set compliance with the “Grantee” retaining control over the final installation of the device (this includes liability) The FCC is concerned with Transmitters, not receivers (exception is scanning receivers)

6 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Factors to Consider Unit needs to be a complete transmitter –Reference Oscillator “on-board” –Antenna –The only connectors power supply Modulation/data inputs Comply with RF Exposure requirements The Grant holder is responsible for compliance of the module in its final configuration

7 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners The Requirements 1.Must have its own RF shielding 2.Must have buffered modulation/data inputs (concern is over-modulation and excessive data rates) 3.Must have its own regulator to control output power and sideband splatter 4.Must comply with antenna requirements Section , Either be permanently attached or have a unique connector. Antennas need to approved with the module. Additional antennas can be added with a Class II permissive change.

8 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners The Requirements 5.Must be tested in a “stand-alone” configuration. Non battery operated devices need to meet AC line conducted requirements (Section ) 6.Must be labeled with its own FCC ID, if inside then System need copy of label (Contains FCC ID: xyzmodel1) 7.The device must comply with any specific rules of operating requirements, (transmit timing requirements, etc.). Instructions for compliance need to be submitted. 8.Must comply with applicable RF exposure requirements.

9 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Proposed Radio Architecture PA D/A */* M LO DET. BasebandHardware Protocol Software ## PlatformComponents F ref or F ref Ant ## AFE / Up-converter ## Platform ## Grant components

10 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Module Approval for Programmable Network Radio DA Proposed Implementation 1) Fully Shielded UnitNo Change 2) Buffered Modulation InputsSeparated from Module 3) On-Board RegulatorNo Change 4) Comply with Antenna Requirements ,4 No Change 5) Independently TestedNo Change 6) LabelingFollow SDR recommendation 7) On-Board Reference Osc.Change * (Future) 8) Comply with Applicable RF Exposure Requirements No Change The following list compares the proposed architecture to the current FCC - Modular Approval Process:

11 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Single Device Approval Several technologies advancements have occurred allowing radio integration to be adopted for high volume cost wireless applications. Vendors are providing modular solutions for the PC platform with differing levels of radio integration.

12 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Single Device Approval LTCC Technology ( Low Temperature, Co-fired Ceramic) Allows high integration of radio components by embedding passive devices within substrate. Generates dramatic cost savings. Extends low loss behavior to an operating range beyond 40Ghz. Crystal component is too large for LTCC integration. Proposal –Change MA to allow Module/device without an integrated crystal to be approved. –Grant would be for; Module/device, Antenna, and Crystal plus load capacitors.

13 ® Intel Labs ® Slide No. *Third party brands and names are the property of their respective owners Industry Consortium Intel was asked by the FCC to head an Industry Consortium to disseminate information on building compliant solutions The FCC supplied initial contact names with a first group meeting beginning of March. The Consortium will have 3 focus areas: –Modification of the Module Approval process for SW Radios –Harmonization of the Module Approval process world wide –Providing industry guidance on building compliant systems