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Objectives Follow installation and upgrade best practice and know how to minimize the risk of damaging components Identify components of the server chassis and motherboard Describe server-class features of CPUs, memory, and expansion cards and perform upgrades Configure CMOS setting and perform BIOS (Firmware) upgrades 4.3 Installing and Upgrading HardwareSlide 2

Adding and Removing Components Check that components have been supplied intact and complete Take a backup of important data and ensure there is a rollback plan Create a clean work environment with plenty of working space and suitable anti-static precautions Gather all necessary tools and equipment Make sure that all devices are powered off and disconnected from the mains Always take time and care Update server documentation Get baseline performance 4.3 Installing and Upgrading HardwarSlide 3

Accessing the Case Chassis intrusion sensors / alerts ESD equipment – Wrist strap – Mat 4.3 Installing and Upgrading HardwareSlide 4

Motherboard Components 4.3 Installing and Upgrading HardwareSlide 5

Server Motherboards Riser cards Drive enclosure / backplane DIP switches / jumpers Diagnostic LEDs 4.3 Installing and Upgrading HardwareSlide 6

Processor Architecture Server-class CPUs versus desktop CPU-based servers RISC and CISC x86 / IA-32 X64 / AMD64 / EM64T 4.3 Installing and Upgrading HardwareSlide 7

Superpipelining and HyperThreading Pipeline (fetch, decode, execute, writeback) Superscalar (perform multiple pipeline actions simultaneously) Superpipelining (longer pipelines but shorter actions [micro-ops]) Instructions come from threads / processes HyperThreading - Simultaneous Multithreading (SMT) – runs multiple parallel threads OS sees two or more “logical” processors 4.3 Installing and Upgrading HardwareSlide 8

Multiprocessing and Multi-core Symmetric Multiprocessing (SMP) means installing more than one CPU Requires boards with multiple sockets Cheaper to use Chip Level Multiprocessing or multi-core Multiple CPUs packaged on the same chip 4.3 Installing and Upgrading HardwareSlide 9

Speed and Cache Clock speed Memory controller speed (Northbridge) Storage expansion bus speed Cache smoothes out speed differences L1, L2, and L3 4.3 Installing and Upgrading HardwareSlide 10

Other CPU Features Virtualization Support AMD-V / Intel VT Malware Protection AMD NX / Intel XD / Windows DEP 4.3 Installing and Upgrading HardwareSlide 11

Packaging and Sockets and Models Heatsinks and Fans Pin Grid Array (PGA) Single Edge Contact Cartridge (SECC) Flip Chip Pin Grid Array (FC-PGA) Land Grid Array (LGA) Voltage Regulator Modules (VRM) 4.3 Installing and Upgrading HardwareSlide 12

Upgrading CPUs Upgrading a Single CPU Upgrading to SMP Upgrading the Heatsink and Fan 4.3 Installing and Upgrading HardwareSlide 13

Memory Type and Speed SDRAM - runs at the same speed as the system bus and uses a 64-bit data bus DDR SDRAM - runs at the same speed as the system bus but performs transfers twice per clock cycle DDR2 SDRAM - as per DDR except that the bus speed is twice that of the internal memory circuitry DDR3 SDRAM - as for DDR2 except that the bus speed is trebled compared to the chip speed DIMM packaging 4.3 Installing and Upgrading HardwareSlide 14

Memory Features (1) Chips – Number of DRAM devices – Storage layout of DRAM devices – High density modules Latency – Column Address Strobe (CAS) Latency (CL) – Number of clock cycles it takes for the controller to look up a memory location – Not directly comparably between different types of SDRAM 4.3 Installing and Upgrading HardwareSlide 15

Memory Features (2) Memory Banks – DIMMs 1 bank per slot – SMP system memory must be balanced Dual-channel Motherboards – Motherboard (or CPU) feature rather than memory type – Modules installed in matched pairs Dual-rank Memory – Two sets of devices on one module – Controller can access one rank or the other – Controller support for limited number of ranks 4.3 Installing and Upgrading HardwareSlide 16

Memory Features (3) ECC – Each memory operation is checked for consistency – ECC slots not compatible with non-ECC modules Registered and Buffered Memory – Regulates electrical load in high density modules – Cannot mix unbuffered and registered / fully buffered 4.3 Installing and Upgrading HardwareSlide 17

Performing a Memory Upgrade Check the documentation Use the server vendor specific memory RAM (or to use RAM from the same manufacturer [same brand]) Do not mix different SDRAM speeds Cannot mix different types When installing dual- or triple-channel memory, use memory kits Try to purchase the highest capacity modules you can afford 4.3 Installing and Upgrading HardwareSlide 18

Expansion Buses and Slots ISA (Industry Standard Architecture) PCI (Peripheral Component Interconnect) Advanced Graphics Port (AGP) PCI eXtended (PCI-X) PCI Express (PCIe) 4.3 Installing and Upgrading HardwareSlide 19

Types of Expansion Cards NIC (Network Interface Card) HBA (Host Bus Adapter) Port expansion card PBX (Private Branch Exchange ) cards VoIP card Fax card Camera card Video Audio 4.3 Installing and Upgrading HardwareSlide 20

Firmware BIOS CMOS Setup UEFI Firmware Update 4.3 Installing and Upgrading HardwareSlide 21

CMOS Setup Program Date Ports and peripherals Fast boot and POST errors Boot order CPU / memory timing Password Power management 4.3 Installing and Upgrading HardwareSlide 22

Review Follow installation and upgrade best practice and know how to minimize the risk of damaging components Identify components of the server chassis and motherboard Describe server-class features of CPUs, memory, and expansion cards and perform upgrades Configure CMOS setting and perform BIOS (Firmware) upgrades 4.3 Installing and Upgrading HardwareSlide 23

Labs Lab 13 Upgrading Hardware 4.3 Installing and Upgrading HardwareSlide 24