Design Team 6 Alex Volinski Derek Brower Phil Jaworski Jung-Chung Lu Matt Affeldt
Software Flow Routing / Board Layout Components/Assembly Electrical Considerations
Software Packages Schematic Advantages Schematic creation ◦ Libraries ◦ ERC and simulation Schematic to Layout
Layout ◦ Libraries ◦ Layers and Routing ◦ Labels ◦ DRC Fabrication
Important Terminology ◦ Layers Metal Silkscreen Solder mask ◦ Traces ◦ Spaces ◦ Trace/Space
Important Terminology ◦ Pads Surface Mounts ◦ Vias Drilled Metal Plated Holes
Layout by importance of Position Align components in a common-sense approach Regulators Sensor IOSensor IO Sensor IOSensor IO Memory User I/O Micro- controller JTAG USB/ UART
Routing in PCB Artist ◦ Place components inside green PCB border ◦ Yellow lines are connections that need to be made
Layout Example of 2-Layer Board ◦ Bottom Level Grounded
Begin Making Traces
Tracing Problem
Grounding Techniques ◦ Series Common Impedance ◦ Parallel Low Potentials High Impedance ◦ Multipoint Contains Currents Reduces Inductance
Power Distribution ◦ Single-Point Single Reference ◦ Multipoint Impedance Coupled ◦ Star Distribution Central Reference Equal Lengths
Through-hole ◦ DIP Surface mount ◦ SOIC ◦ BGA ◦ QFN
Surface Mount ◦ Stay above 0805 Through Hole ◦ Much easier and less performance
Solder Reflow ◦ Allows precise soldering of Surface Mounts (below 0805)
Decreasing impedance vs. protecting a section
Multi-Layer board is capacitor
Avoiding Radiating EMI At ‘low’ frequencies (<100 MHz) no components will be antennas Be aware of attached cables Layout board to reduce coupling
Software Flow ◦ Advantage of making schematic ◦ Layers, Libraries, Fabrication Routing / Board Layout ◦ Layers, Traces, Pads vs. Vias ◦ Importance of position ◦ Grounding Techniques, Power Distribution
Components/Assembly ◦ Different types of components ◦ Through Hole / Surface Mount ◦ Weighing options for better performance Electrical considerations ◦ Stray Capacitance ◦ Ground Plane Traces ◦ Antennas to avoid radiating EMI