ESREF 2015 chairs Marise BAFLEUR, LAAS-CNRS (F) Philippe PERDU, CNES (F)

Toulouse Venue: Toulouse Historical city in the south of France European capital of aeronautics and space industry 714,332 inhabitants

Toulouse, major international complex for aeronautics, space & embedded systems  Aerospace Valley international cluster  Institute of Technological Research – For aeronautics, space and embedded systems  Aeronautics world center: Airbus assembly line  AIRBUS, EADS, ATR, SAFRAN, THALES, Liebherr Aerospace, Rockwell Collins, Latécoère, Air France  European capital of the space industry :  ASTRIUM, THALES ALENIA SPACE, CNES  Number 1 in France for embedded electronics:  CONTINENTAL, ACTIA, FREESCALE, ON Semiconductor, etc  2 nd largest French University & research cluster:  students, 400 labs with more than researchers

Organization committee Conference Chair & Vice-Chair: – M. BAFLEUR, LAAS-CNRS (F) & P. PERDU, CNES (F) Technical Program Chairs: – F. MARC, IMS, Univ. Bordeaux (F) & H. FREMONT, IMS, Univ. Bordeaux (F) Tutorial Chair: P. JACOB, EMPA (CH) Event Committee Chair : A. BENSOUSSAN, TAS / IRT (F) Workshop Chair: M. CIAPPA, ETH (CH) Conference Scientific Support: – C. BOIT, TU Berlin (D) & F. FANTINI, University of Modena (I) Industrial Exhibition Chairs: – J. GAUDESTAD, NEOCERA (USA) & B. DUCROCQ, LAAS-CNRS (F) Publicity Chair: J. TOUZEL, INFINEON (D) Journal Edition Chairs: – M. BAFLEUR, LAAS-CNRS (F) & P. PERDU, CNES (F) Organization Secretariat: A. DE SOUSA BERDAT, LAAS-CNRS (F) Webmaster: D TRÉMOUILLES, LAAS-CNRS (F)

Conference site Centre de Congrès Pierre Baudis ( 11 esplanade Compans Cafarelli, TOULOUSE 5

Conference site location Downtown Toulouse Close to many hotels & restaurants Metro line A Compans-Cafarelli station Airport shuttle every 20’ Car park 1000 spaces

is online

Scope of papers Quality and Reliability assessment techniques and methods for Devices and Systems Physical Modeling and Simulation for Reliability Prediction Advanced Failure Analysis: Defect Detection and Analysis Failure Mechanisms in New Materials and Transistors Failure analysis and Reliability of Advanced and Nanoscale electronics Focused Ion Beam (EFUG) Power Devices Reliability and Failure Analysis Packaging and Assembly Reliability and Failure Analysis Space, Aeronautic and embedded system

Special focus on Space, Aeronautic and embedded system Harsh environment Uprating Obsolescence Counterfeit Case studies (Failure Analysis, Qualification, Tests …) Event committee with major actors in the field – Chair: A. Bensoussan, Thales Alenia Space (FR)

Topics and layout (1) Only 2 // tracks 3 and half days – Monday afternoon (Welcome, exchanges IPFA, ESREF, ISTFA, Keynotes, expo tour, buffet & light food…) – Tuesday to Thursday, 2 // technical tracks, ended by buffet & light food – Friday open for external workshops Exhibition (up to 25 booths) – Special discount for early booking. Deadline: December 21, 2014 – Small free booths (ex: ESREF2016) – Coffee breaks – Poster sessions – Open for no ESREF visitors (after the morning coffee break to afternoon coffee break) – Only expo hours (before gala dinner) 10

Exhibition in the heart of conference EXHIBITION SESSIONS

ESREF 2015 Exhibition Layout ESREF2015 booth at ESREF2014 exhibition Chairs: J. GAUDESTAD, NEOCERA (USA), B. DUCROCQ, LAAS-CNRS (F)

Deadlines 16 March 2015Submission of summary 30 April 2015 Notification of acceptance 25 May 2015 Submission of extended paper 30 June 2015 Upload of final paper to the online Elsevier Editorial System (EES)

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