The Role of Packaging in Microelectronics Definition of Microelectronics. Microelectronic Devices, IC Packaging, Purposes of IC Packaging, Semiconductor Roadmap, IC Packaging Challenges, DMT 243 – Chapter 2 M.Nuzaihan

INTEGRATED CIRCUITS (ICs) The Role of Packaging in Microelectronics INTEGRATED CIRCUITS (ICs) Microchips with a transparent window, showing the integrated circuit inside An integration of many such circuit blocks (discrete components such as transistors, diodes, capacitors, resistors were mounted on the PWB) or components on a single chip Resulting in miniaturized product became low in cost and high in reliability. Can be as small as 1mm to 30 mm also known as IC, microcircuit, microchip, silicon chip, or chip Integrated circuit of Atmel Diopsis 740 System on Chip showing memory blocks, logic and input/output pads around the periphery The integrated circuit from an Intel 8742, an 8-bit microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics Types of ICs An (orange-epoxy) encapsulated hybrid circuit on a printed circuit board. ICs are divided into two categories: Hybrid IC (HIC) - Contains interconnected diodes, capasitors and resistors fabricated on asingle plastic, ceramics or insulated aluminium substrate. Has the capability of performing a complete electronic circuit function. Involves two or more material types. Semiconductor ICs /Monolithic ICs /Silicon Chip Contains devices fabricated from semiconductor materials. DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Evolution The first IC in the world in the world in the 1960s had only about 10 elements. Then LSI to VLSI ULSI/GSI – level of 20 to 100 million transistor per chip. Now – IC is projected to reach a billion transistor on a single chip (SOC) DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Evolution DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Packaging Integrated circuit packaging is the final stage of semiconductor device fabrication In the ICs industry it is called packaging and sometimes semiconductor device assembly. Also, sometimes it is called encapsulation or seal (by the name of its last step). DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Packaging Most ICs are bonded to small IC packages - It is possible to attach chips directly to boards. Method used extensively in low-cost consumer electronics. Placing chips in packages enables independent testing of packaged parts, and eases requirements on board pitch and P&P (pick-and-place) equipment. IC Packages - inexpensive plastic packages: <200 pins - packages with >1000 pins available (e.g. Xilinx FF1704: 1704-ball flip-chip BGA) • IC Packaging Materials - Plastic, ceramic, laminates (fiberglass, epoxy resin), metal DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Packaging DMT 243 – Chapter 2 M.Nuzaihan

1st-level Interconnect 2nd-level Interconnect IC Packaging Chip Package (Substrate or leadframe) PCB 1st-level Interconnect 2nd-level Interconnect Encapsulation Printed Circuit Board Substrate Solder Joint Leadframe Au wire Underfill Solder Bump Molding Compound Pin Thru. Hole DMT 243 – Chapter 2 M.Nuzaihan

IC Packaging Classification The Role of Packaging in Microelectronics IC Packaging Classification IC package categories: PTH (pin-through-hole) Pins are inserted into through-holes in the circuit board and soldered in place from the opposite side of the board » Sockets available » Manual P&P possible DMT 243 – Chapter 2 M.Nuzaihan

IC Packaging Classification The Role of Packaging in Microelectronics IC Packaging Classification SMT (surface-mount-technology) SMT packages have leads that are soldered directly to corresponding exposed metal lands on the surface of the circuit board » Elimination of holes » Ease of manufacturing (high-speed P&P) » Components on both sides of the PCB » Smaller dimensions » Improved package parasitic components » Increased circuit-board wiring density DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Packaging Material Plastic – die-bonding and wire-bonding the chip to a metal lead frame – encapsulation in injection-molded plastic – inexpensive but high thermal resistance – Warning: Plastic molds are hygroscopic » Absorb moisture Storage in low-humidity environment. Observation of factory floor-life » Stored moisture can vapourise during rapid heating can lead to hydrostatic pressure during reflow process. Consequences can be: Delamination within the package, and package cracking. Early device failure. DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Packaging Material Plastic Details of a typical plastic package DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics IC Packaging Material Ceramic » consists of several layers of conductors separated by layers of ceramic (Al2O3 “Alumina”) » chip placed in a cavity and bonded to the conductors Note: no lead-frame » metal lid soldered on to the package » sealed against the environment » ground layers and direct bypass capacitors possible within a ceramic package » high permittivity of alumina (εr=10) Note: High permittivity leads to higher propagation delay! » expensive DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics Popular IC Packages Plastic Dual-In-Line (PDIP) PDIP14 SC70 SC70-5 Small Outline Integrated Circuit (SOIC) SO14 Thin Shrink Small Outline (TSSOP) TSSOP14 DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics Popular IC Packages Plastic Lead Chip Carrier (PLCC) PLCC28 Thin Quad Flat Package (TQFP) TQFP32 DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics Popular IC Packages Small Outline Integrated Circuit (SOIC) • Available from SO8..SO28 • Gull-wing leads • Popular, cost effective, and widely available IC package for low-pin-count ICs • Dimensions: 8.6mm x 3.9mm x 1.75mm • Pin-to-pin: 1.27mm (50mil) DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics Popular IC Packages Thin Shrink Small Outline (TSSOP) • Available up to TSSOP64 • Popular, cost effective, and widely available IC package for low-profile applications • Dimensions: 5.0mm x 4.4mm x 1.2mm • Pin-to-pin: 0.65mm (25mil) DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics Popular IC Packages Ball Grid Arrays (BGA) • Shown: BGA54 • Available pin count >1700 • Advanced IC package for high-density low-profile applications • Chip-scale package (CSP) • Dimensions: 8.0mm x 5.5mm x 1.4mm • Pin-to-pin: 0.8mm • Low lead inductance DMT 243 – Chapter 2 M.Nuzaihan

DMT 243 – Chapter 2 M.Nuzaihan

List of plastic mold package DMT 243 – Chapter 2 M.Nuzaihan

List of Ball Grid Array Packages List of Ball Tape Carrier Packages DMT 243 – Chapter 2 M.Nuzaihan

Purposes of IC Packaging The Role of Packaging in Microelectronics Purposes of IC Packaging To provide the signal and power distribution of the packaged IC to the systems. To provide mechanical support and robustness to the fragile IC. To provide for environmental protection of the IC To dissipate heat generated by IC chips To facilitate the packaging and handling of IC chips DMT 243 – Chapter 2 M.Nuzaihan

Requirements for IC Packaging The Role of Packaging in Microelectronics Requirements for IC Packaging Must provide acceptable electrical properties, including capacitance, resistance and inductance. IC assembly technologies should provide a low cost solution for the electrical interface between the chip and package. High throughput manufacturing. High reliability. Repairability or replaceability where interconnection between IC and package should provide removal of the failed IC. DMT 243 – Chapter 2 M.Nuzaihan

SEMICONDUCTOR ROADMAP The Role of Packaging in Microelectronics SEMICONDUCTOR ROADMAP Updated every 2 years by a group of semiconductor companies known as Semiconductor Industry Association (SIA). The roadmap is called International Technology for Semiconductors (ITRS). Three most important parameters for packaging are: (1) I/O which controls the pitch of the IC package; (2) Size of the IC which controls the reliability of the IC to package connection; (3) power which controls heat dissipation properties of IC and system-level packaging. http://www.itrs.net/Common/2004Update/2004Update.htm DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics DMT 243 – Chapter 2 M.Nuzaihan

IC Packaging Challenges The Role of Packaging in Microelectronics IC Packaging Challenges Team Work Activity DMT 243 – Chapter 2 M.Nuzaihan

The Role of Packaging in Microelectronics (NEXT WEEK) Wafer Back Grinding, Die Preparation, Die Attach, Wire Bonding, Die Overcoat, Molding, Sealing, Marking, DTFS, Lead Finish, Electrical Testing, Tape & Reel, Dry Packing, Boxing and Labeling. DMT 243 – Chapter 2 M.Nuzaihan