High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Phase I Phase II ~1000km north of Shenzhen Sunshine. 3km to Long River New Factory in Jiujiang,

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Presentation transcript:

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Phase I Phase II ~1000km north of Shenzhen Sunshine. 3km to Long River New Factory in Jiujiang, Jiangxi

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits New Factory in Jiujiang, Jiangxi Phase I Phase II Phase I (a): 1 st & 2 nd Floor direction is the same as the Shenzhen Sunshine Phase I (b): 3 rd Floor Rigid-Flex Production Phase II: Market-oriented (TBA) Each Floor has ~15,000m 2 Floor Area Phase I total floor area ~ 45,000m 2 Phase I (a): 1 st & 2 nd Floor direction is the same as the Shenzhen Sunshine Phase I (b): 3 rd Floor Rigid-Flex Production Phase II: Market-oriented (TBA) Each Floor has ~15,000m 2 Floor Area Phase I total floor area ~ 45,000m 2 Waste Water Treatment Facilities

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits New Factory in Jiujiang, Jiangxi R & D Center Phase I Multi-purpose Recreation Center (& Canteen)

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits New Factory in Jiujiang, Jiangxi Operators and Staff Dormitories Service Apartment for our VIP

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Jiujiang Factory Phase I Major Investment ProcessesMachinesInvestment (USD) Inner ImagingPretreatment to Etching2,283,000 Inner CheckingAOI1,600,000 Inner PressingBrown Oxide to Pressing2,645,000 Drilling 5,600,000 1st Copper PlatingPTH + Panel Plating3,070,000 2nd Copper PlatingPattern Plating4,000,000 Outer ImagingPretreatment to Etching1,100,000 Solder ResistSolder Mask + Legend1,550,000 Surface FinishENIG+HASL1,000,000 ProfileRouting+V-score1,860,000 Final CheckingE-testing1,450,000 Major Investment Total26,158,000 Total Equipment Investment30,234,600

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Conventional Rigid PCB BackplaneMetal CoreRigid/Flex High performance material Sequential Lamination HDI Heavy Base Copper Rogers Teflon N+N design with blind/buried via D/S – 22/L PCB 6oz inner & 5oz outer 4-level any layer, stacked via Aluminum Core Rigid/Flex with HDI or without HDI 5mm board thickness Product Mix – PCB Technology

High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Jiujiang Sunshine Technology Roadmap