Managing Lead and Lead-Free Transition Dr. Sudarshan Lal FCI USA, Inc. Etters, PA (USA) June 20, 2002

> Titre de la présentation - Date - Références - 2 Outline > Introduction > Lead-free test plans > Lead-free implementation for: i) Pressfit ii) Reflow iii) BGA Applications > Test status > Conclusions

> Titre de la présentation - Date - Références - 3 H Commercial2003 H IndustrialNot Clearly Defined H Computer2003 H Telecom/BackpanelNot Clearly Defined Request for segment data made to fleck and bishop H Board and connector performance issues are the cause for a less defined need in the Telecom/Backpanel market Market Segment Requirements

> Titre de la présentation - Date - Références - 4 Regions – Timing Requirements H AmericasNot Clearly Defined H A/P*2003 (Some Appliances in Japan) H Europe2006 (Servers & Auto. 2010) H * Although there is no legislation, pending or otherwise, Japan is calling for the reduction or elimination of lead in Electronics. Several Japanese OEM’s have taken it upon themselves to be as proactive in this market as possible

> Titre de la présentation - Date - Références - 5 H The use of lead in electronics assembly within the European Union will be banned after January 2008 (and possibly as soon as 2006). Servers and Automotive exempted until 2010 ò Since A/P, specifically Japan, is the first regional area to require lead-free products, FCI’s lead-free implementation will be heavily influenced by the needs and requirements of major Japanese OEM customers. Source:Envirowise Website Timing Requirements – Europe & A/P

> Titre de la présentation - Date - Références - 6 Provide leadership, coordination, and communication to FCI Worldwide to implement a lead-free offering of our products where appropriate in a way that: è Identifies marketing and customer expectations è Establishes product conversion priority and timing è Provides leadership and communication è Coordinates activities with the other regions è Provides technology solutions for our products è Assures the generation and communication of technical support data, and è Generates an implementation plan that includes sales, marketing, engineering, manufacturing, and technology actions and timing so that FCI can provide a lead-free product offering that meets the needs of our customers in a timely manner and meets our business objectives. Lead-Free Global Team Charter

> Titre de la présentation - Date - Références - 7 Rather than focus on 40+ product lines, the lead-free team will focus on the three main termination styles. Each termination style will have a different technical solution or a significantly different performance or whisker issue that needs solving. Lead-Free Team Methodology

> Titre de la présentation - Date - Références - 8 Implementation By Termination Style BGA Termination Reflow Thru- Hole SMT Press-Fit

> Titre de la présentation - Date - Références - 9 Advantages of Sn-Cu v. Sn coating > Aesthetically superior bright deposit with low carbon & stable alloy composition > Sn-Cu is less prone to whiskering than pure tin. Alloying helps in whisker mitigation > Low foam, stable solution without strong odors for Sn-Cu bath > Plated Sn-Cu film resistant to discoloration in heat tests > Solderability for Sn-Cu coating is equivalent or better than Sn-Pb and pure tin finishes. Tin coatings after steam aging exhibited poor solderability (longer wetting times, negative forces)

> Titre de la présentation - Date - Références - 10 Technical Solution Press-Fit & Reflow Sn-Cu Plating ( Bath Globally Available) BGA Sn-Cu-Ag Spheres (Spheres Globally Available) Note: FCI Searching Lead-Free Epoxy to Withstand 260 C

> Titre de la présentation - Date - Références - 11 Connector Technical Solution Sn-Cu Plating Perform DOE And Test Plan Utilizing Multiple Boards Press-Fit Lead-Free Implementation Flow Chart Confirm Technical Solution In Press-Fit Applications Test Boards Immersion Ag Immersion Sn Bare Cu/OSP Tin/Lead Nickel Gold

> Titre de la présentation - Date - Références - 12 Utilizing a Metral EON press-fit pin Testing conducted with: Tin-Lead, OSP, ImAg, ImSn, & Ni-Au Boards Telecom UE Tests: H Vibration & Shock – 50 Contacts – Min. & Max. PTH Board H Thermal Shock/Humidity – 50 contacts – Min. & Max. PTH Board H Mixed Flow Gas – 25 Contacts – Max. PTH Board Only H Repair (Insertion/Retention, Heat Age, Hole Deformation) 150 Contacts – Min. & Max. PTH Board Lead-Free Press-Fit Test Plan

> Titre de la présentation - Date - Références - 13 Press-Fit Test Results Status > Vibration & Shock : No abnormalities found > Thermal Shock/Humidity test: In Progress > Mixed Flow Gas: Initial Preparation Completed. Going to MFG chamber > Repair (Insertion/Retention, Heat Age, Hole-size): Passed within normal limits > Compliant pin resistances were within specifications (less than 1 milliohm)

> Titre de la présentation - Date - Références - 14 Connector Technical Solution SnCuAg BGA Perform DOE And Test Plan Utilizing Copper Board BGA Implementation Flow Chart Confirm Technical Solution In BGA Applications Test Boards Bare Cu/OSP

> Titre de la présentation - Date - Références - 15 Test PCB Pad Plating: OSP (Cu with Coating) H 1.) Thermal Shock Testing Per MEG-Array Product Spec GS H 2.) Solder Joint Tensile Strength & 3-Point Bend Testing per MEG- Array Product Specification GS a. Solder ball pull strength. H 3.) Solder Wicking Evaluation H 4.) Thermal Cycling per IPC-SM-785 (Telecom Central Office Environment) Lead-Free BGA Test Plan

> Titre de la présentation - Date - Références - 16 Lead-Free BGA Test Results > Passed three-point bend test. No dye penetration observed. Micro-cracks were absent > Lead-free solder tensile strength was greater than standard Tin- lead solder > Solder joint reliability was equivalent to Tin-lead

> Titre de la présentation - Date - Références - 17 Connector Technical Solution Sn-Cu Plating Perform DOE And Test Plan Utilizing Copper Board Re-flow Termination Implementation Flow Chart Confirm Technical Solution In Re- flow Applications Test Boards Bare Cu/OSP

> Titre de la présentation - Date - Références - 18 Lead-free Re-flow Test Status > Solderability was excellent exhibiting normal forces and percentage coverage comparable to Tin-lead > Tensile Strength using Instron was similar to Tin-lead > Whisker tendency not studied yet. Reflow should minimize whisker formation > Need to develop plan for i) Bergstik-thruhole ii) Bergstak-SMT iii) Memory-SMT Products

> Titre de la présentation - Date - Références - 19 Resins & Molding For Lead-Free Three resins failed to withstand the industry anticipated 260C peak re-flow temperature for lead free soldering. These resins are : LCP A (280C) (“Baby H”Metral Headers) PPS (Card Edge Press-Fit) SPS (GBIC SMT) Polyamide 46 & Polyphthalamide high temperature nylons passed at all re-flow temperatures in the dry state, but failed at all re-flow temperatures (even the current 223C) in the wet state via blistering. The failures were due to the hygroscopic property of the material and not the re-flow temperature. In general, those materials with a melting point of 285C and lower exhibited visual and/or dimensional defects following exposure to 260C and higher re-flow temperatures. All resins with melting points greater than 285C successfully sustained the industry anticipated 260C peak re-flow profile without visual/dimensional damage. Converged EON Metral Headers Use LCP E – Melt Temp = 335C

> Titre de la présentation - Date - Références - 20 Existing FCI Lead-Free Products

> Titre de la présentation - Date - Références - 21 Conclusions H FCI maintains an open dialogue with suppliers, contract manufacturers, OEM’s and consortia regarding lead-free technical solutions. Presently customers are interested in plans, capabilities and limited test samples H The global lead-free team is in the process of identifying & testing lead-free solutions for BGA, press-fit & re-flow products H Implementation and smooth transition shall be case-by- case based on credible scientific data of proven reliability, market demand, regulatory compliance, supply assurance, quality and competitive cost