Amphenol PCI Express 1.1/2.0 Solution

Page 2 PCI Architecture Roadmap During the Intel® Developer Forum in September 2007, Intel Fellow Ajay Bhatt provided a chronology of PCI Express, as shown in the figure. This year PCIe 2.0 and two virtualization specifications were approved.

Page 3 Main Board Connectors Introduction Main Board Connector Overview: PCI Express (AMTA Product) DDR2 & 3 (AMTA Product)

Page 4 PCI Express Connectors Overview G630EXXX161XEU G630EAAX161XEU G630EXXX260XEU G630EXXX5X1XEU G630EXXX6X0EU PCIe DIP Series PCIe 164P DIP with Latch Series PCIe SMT Series PCIe Straddle Series PCIe Press-Fit Series G630FXXX161XEU G630FAAX161XEU G630FXXX260XEU G630FXXX5X1XEU G630FXXX6X0EU Type Speed GEN1 GEN2

Page 5 PCI Express 1.1/2.0 Card Edge Connector, DIP Type Product Features: 1.Complies with the PCI SIG standard for PCI Express implementation. 2.Scalable modular design maximizes card interoperability for user flexibility--1x, 4x, and 8x add-in card can plug into 16x connector. 3.Solder tail options for 2.08 and 2.36mm PCB thickness. 4.Contact area plating: Gold Flash, 15u” or 30u” gold plating. 5.RoHS compliant, Lead free version available. PN: G630EXXX161XEU Dip Type

Page 6 PCI Express 1.1/2.0 Card Edge Connector, Straddle Type Product Features: 1.Complies with the PCI SIG standard for PCI Express implementation. 2.Scalable modular design maximizes card interoperability for user flexibility--1x, 2x,4X,16X 3.Solder tail options for 2.08 and 2.36mm PCB thickness. 4.Contact area plating: Gold Flash, 15u” or 30u” gold plating. 5.RoHS compliant, Lead free version available. PN: G630EXXX260XEU Straddle Type with XXX

Page 7 PCI 1.1/2.0 Express Card Edge Connector, SMT Type PN: G630EXXX6X0EU SMT Type with retention tabs Product Features: 1.Complies with the PCI SIG standard for PCI Express implementation. 2.Scalable modular design maximizes card interoperability for user flexibility--1x, 2x,4X,16X 3.Solder tail options for 2.08 and 2.36mm PCB thickness. 4.Contact area plating: Gold Flash, 15u” or 30u” gold plating. 5.RoHS compliant, Lead free version available.

Page 8 PCI 2. 0 Express Card Edge Connector, Press Fit Type Product Features: 1.Complies with the PCI SIG 2.0 standard for PCI Express implementation. 2Scalable modular design maximizes card interoperability for user flexibility--1x, 4x, 3Solder tail options for PCB thickness from 2.36mm to 4.19mm. 4.Contact area plating: Gold Flash, 15u” or 30u” gold plating. 5. HF compliant, Lead free version available. PN: G630EXXX5X13EU Press Fit Type with plastic post Product Benefits: Avoid the soldering problems (reliable solder joint) due to TH aspect ratio.

Page 9 Amphenol PCIe Product develop flow chart Request Simulation (Mechanical, Electrical) Molding Mass production Sample Run Verification Modify Time & Cost FailPass 3D Model create

Page 10 PCI Express 2.0 Press Fit Type-FEA Simulation 3D Model Construction

Page 11 PCI Express 2.0 Press Fit Type-FEA Simulation SI Simulation

Page 12 PCI Express 2.0 Press Fit Type-FEA Simulation Mechanical

Page 13 PCI Express 2.0 Fit Type SI Testing Result NEXT-Rx1 aggression Rx2 NEXT-Rx3 aggression Rx2 NEXT-Tx2 aggression Rx2NEXT-Tx3 aggression Rx2

Page 14 All signal integrity parameters meet requirements of the PCI Express 2.0 specification. Differential Insertion Loss Differential Return Loss PCIe 2.0 Press Fit Type SI Testing Result

Page 15 PCIe 2.0 Press Fit Type Mechanical Testing Result

Page 16 PCI Express R/A 2.0 Press-Fit Product Features: Complies with the PCI SIG standard for PCI Express implementation. Scalable modular design maximizes card interoperability for user flexibility--1x, 4x, and 8x add-in card can plug into 16x connector. The retention tabs at two ends to protect the solder tails. Contact area plating: Gold Flash, 15u” or 30u” gold plating. RoHS compliant, Lead free version available.

Page 17  Wesely Huang, Product Manager (Server&Storage Connector)   TEL:  FAX:  Mobile:  5F., NO361, Fusing 1st Rd., Gueishan Township, Taoyuan County 33375, Taiwan (R.O.C) AMTA Contact Window