Question 27: Outline the key steps for industrialization of machine components and the likely remaining vulnerabilities in achieving them. Achieving industrialization of the large quantity components of the LC will be a major theme over the next several years, leading to the Technical Design Report and costing. Steps include: 1.Breaking the subsystems into appropriate components for industrialization. 2.Identifying interested potential vendors who either have, or wish to develop appropriate facilities for production. Development of multiple vendors. 3.With industry, identify cost drivers and critical procedures; perform value engineering, design for serviceability, reliability, cost optimization. 4.Identify need for further R&D by HEP laboratories and/or industry. 5.Define fabrication process and factory layouts where needed. 6.Define schedule of delivery, testing procedures. Paul Grannis June 2004

Considerable attention has already been given to industrialization of some key components for both cold and warm machines. Both groups clearly understand that the industrialization will become a dominant activity over the next several years. Information from TESLA and X-band on current status of industrialization: 1.Niobium sheet production: 1 vendor has capacity for 100%, 2 more together can do 30%. Have not achieved hoped-for cost reduction for large orders; working on streamlining the facility. Seek factor 2.5 cost reduction. Dominant cost is melting. Eddy current scanning being readied for industry. Squid scanning R&D under contract. 2.Cavity fabrication: 2 vendors at present; needs further infrastructure improvements; welding machine refinement. Seek factor 6 cost reduction. 3.Cavity prep, measurement and module assembly: Up to now, all done at DESY. Have now developed 2 vendors for prep and assembly. Only the cavity measurements would remain at DESY in full production. Need simplification of assembly procedures.

4.X-band structures: Fermilab and KEK have procured satisfactory structures in small quantity from industry. Use standard industry procedures. Seek reduction in cost by factor ~3 5.TESLA modulators: FNAL-built units were used in TTF; now industrializing in 4 companies; 7 have been delivered from industry. 6.TESLA multibeam klystrons: Thales has delivered but still working out gun arcing problems; CPI, Toshiba tubes to be tested soon. Need to develop the horizontal klystron for replacement ease. 7.TESLA rf input couplers: so far use DESY built couplers; have one vendor involved, but need improved production, quality control. Further R&D and subsequent transfer to industry on TiN coatings needed. Large cost improvement is needed. 8.X-band modulators: 2 vendors identified. Work to lower cost of magnetic cells, cooling, assembly; lower cost components. Need higher efficiency.

9. X-band PPM klystrons: At present, 2 tubes – SLAC and Toshiba – have met specs. Contacts with 5 vendors, with preliminary estimates of learning curve and production costs. Are dividing project into subcomponents (e.g. gun). 10. SLED-II system: largest linac subsystem cost; claim elements are all standard for manufacture; need factor of 6 cost reduction. Evaluate Cu plated vs. Al; work on flange sealing method. 11. Cryovessel fabrication: now being made by 1 vendor, but need improved infrastructure or more vendors. 12. Girders for structure/quads: search for supplier; need measurement simplifications, attachment simplifications. 13. Cryomodule support: no information 14. Main X-band Linac quads: made in industry 15. Main Linac SC quads and steering correctors: no information

and so on … Common to cold and warm: 16. Beam delivery system magnets: made in industry 17. Low level rf systems: obtained from industry, standard components For most of the large quantity and state of the art components, industry has been involved, and often has provided working items. The R&D process continues on most items, and work is underway on value engineering and cost optimization. Getting the necessary control of fabrication quality, process control, cost reduction will be a large challenge. There is still much work to be done to get to a successful industrialization for most items, but the process is started. There does not seem to be much worry that the components of either cold or warm LC can be industrialized. The engineers seem to believe that the advertised cost reductions are achievable. Need final stable design to do real industrialization!

My chief worries for industrialization and cost reduction (others may have different choices!):  SC cavity fabrication and preparation  X-band klystrons Summary: Industrialization is understood by both cold and warm projects to be the key need for the next several years. Both have made reasonable starts in working with industry. The primary challenges are different for the two technologies, but I see little to differentiate the probability of success at this time. Getting to a final design from which a cost effective set of quotes can be developed will be a large challenge for either.