Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, D Technology Developments in Europe and EU Supported Activities Possibilities offered by European Industry and Research Institutes 3D Activities in the European HEP community AIDA EU project: 3D integration in WP3 1 Using material from: Valerio Re, Norbert Wermes, Sami Vehänen, Jena-Claude Clemens, Anna Macchiolo, Michael Campbell, Manuel Lozano, Thomas Fritsch, Piet de Moor, Kholdoun Torki, Mark Scannel, Marc Winter, Armin Klumpp. Paul Seller Key technologies: Multi tier ASICs (-> 3DIC/Fermilab) TSV (via last) High density interconnect

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 VTT Frauenhofer IZM IMEC Frauenhofer EMFT CEA LETI (CMP) CNM Information from an AIDA WP3 workshop in May This is not necessarily complete (Sintef? FBK? CNM, ST?) Possibilities offered by European Industry and Research Institutes 2

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 CEA LETI 3 Open 3D initiative: 3D technology service for research organizations and industry cost effective based on mature technology customization possible TSV Solder pillars Solder bumps

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Fraunhofer EMFT 4 SLID interconnection replacing solder bumps Small pitch (limited by alingments precision of flip chip) Stacking possible Pitch < 20 µm in view ICV (Inter Chip Vias) Tungsten filled vias Aspect ration: 8:1 VIA diameter > 2 µm 0.3 Ohm for 2x2x20µm³ Handling concept for thinned ASICs

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Fraunhofer IZM Experience with bump bonding for ATLAS, MEDIPIX, SLAC Pitch ~ 50 µm Tapered VIAs (copper lined) ~ 50 – 100 µm New facility for 3D in Dresden (300 inch wafer) 5

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 IMEC 6 TSV – via last (post processing) Chip backside to metal 1 Pitch: 40 µm Via diameter: 25 µm Thickness: 50 µm (2:1) TSV – via middle (part of CMOS process) Connections to metal 1 Pitch: 10 µm Via diameter: 5 µm Thickness: 20 µm Integrated in IMEC’s 130nm CMOS line Interconnection: In or CuSn microbumps Pitch: 20 µm (10 µm in development)

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 VTT 7

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Activities by European HEP Institutes UK (RAL) Germany Bonn MPP France IPHC CNRS CERN Italy (INFN) 8 Furthermore: Interest by XFEL community

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 ITALY 9 Pixel sensor for superB a)Superpix 1: 2-tier version of a readout chip for hybrid pixels b)APSEL: 3D CMOS MAPS sensors in DNW technology First versions in production (Fermilab 3D iC) Will submit improved versions in the next CNP/MOSIS/Tezzaron run Strong interest in interconnection of tiers (sensor/readout) in heterogeneous technologies (via last) (-> AIDA)

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 France CPPM: ATLAS FE_I4proto chip “translation” in 3D (with Bonn, LBL) 3D visio 10/02/ mm 5.5 mm FE_TC4 Analog C1 3*4 mm FE_TC4 Analog C1 3*4 mm FE_TC4 Digital simple C2 3*4 mm FE_TC4 Digital upgraded C3 3*4 mm Test zone 6.4* IPHC:

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 MPI Munich: 3D interconnection for sLHC 11 3D demonstrator (aimed for ATLAS pixel upgrade) Based on ATLAS FEI3 chip Thin sensors made at MPI HLL SLID interconnection by EMFT TSV by EMFT 1 st step: SLID only (no TSV) Successful (however, problems with alignment & interconnection yield in some chips) 2 nd step: SLID & TSV Trials on dummy FEI3 wafer Next: full process on hot wafers & sensors

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Bonn University: An ATLAS pixel module concept with TSV 12 Similar to MPI project, in collaboration with IZM use very thin (~100 µm) FE-I4 (2x2 cm 2 ) chips use TSV for the routing of signals on the chip backside An ATLAS pixel module with 90µm thick FE-I2 and tapered TSVs is being IZM Berlin First structures arrive Furthermore Bonn joined the Fermilab 3DIC project (3D version of FEI4) Tapered side walls TSV Backside redistribution

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 CERN 13 Medipix 3 chip is ‘3D friendly’ => back side connectivity TSV landing pads in periphery No filling structures in TSV area! Wafers exist, looking for TSV service TIMEPIX 3 will have similar features

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Gold studs Wire bond PCB Heat sink Detector eg. CZT Thick digital ASIC 50um analogueASIC SLID Bonds 3D-IC Upper pixel 3D-IC Lower pixel 4040 pixel ASIC UK: RAL 3D version of an x-ray imager for CZT sensors Based on HEXITEC 8080 chip »Specifically a 3D-ASIC:- with two 2-D active layers bonded together at many points on surface Layer 1:- Analogue preamplifiers Layer 2:- Digital ADCs 40 x 40 pixel, 250 µm pitch »Progress this year. Define a Back-End-of-Line Process with EMFT so we could use different CMOS processes on the different layers. Cu/Sn SLID process with W vias. RAL has designed and built the 2 layer CMOS wafers for EMFT bonding 14

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 EU Supported Projects 15 Project officially started February 1 st 2011 Budget: 26 M€ with 8 M€ from EU over 4 years

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, Project Structure

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 WP 3: 3D interconnection The aim is to build a demonstrator of a 3D vertically integrated pixel sensor, which provides a tool to qualify the technologies that are involved in 3D integration and makes them accessible to the community. WP3 plans to follow a “via last ” approach to 3D integration to build a 2-layer device in heterogeneous technologies, where the two layers are fabricated independently, and TSVs (Through Silicon Vias) and interconnections are made as the last steps of the process. Budget: ~ 800 k€ (EU contribution) 17

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Program & Institutes IdTaskleadParticipantsAssociates 3.2aSensors MPG- MPP INFN-(LE, PD, GE), CNRS- (CPPM, IPHC), CSIC-CNM, UB, STFC 3.2bCMOS ASICs INFNAGH-UST, CERN, CEA, CNRS- (CPPM, LAL, IPHC), INFN-(PV, PI, MI) 3.2cPost processing and interconnection UBONNMPG-MPP, UBONN, INFN-(PV, PI, MI, GE), CNRS-(CPPM, IPHC), STFC, CSIC-CNM, UB, UU 3.2dAssessment of 3D integration MPG- MPP AGH-UST, CERN, CEA, CNRS- (CPPM, IPHC), CSIC-CNM, UB, INFN, MPG-MPP, UBONN, STFC, UU IPASCR, NTUA, DEMOKRITOS, UNIGLA, UNILIV, FOM 18 Participants: CERN, CEA, CNRS, MPG-MPP, UBONN, INFN, AGH-UST, CISC, UB, UU, STFC Associates: IPASCR, NTUA, UNIGLA, UNILIV, FOM

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 FBK (Trento, Italy) Planar pixels, full-”3D” pixels with slim edge; active edge sensors also being developed VTT (Finland) Edgeless detectors, R&D towards 4-side buttable devices (TSVs, flip-chip bonding) MPI-HLL (Munich) Thin pixel sensors with UBM (copper on Ti/W) IMB-CNM (Barcelona) Active edge, “3D“ pixels, bump bonding (UBM and bump growing) Sensors 19 Options for dedicated sensors

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 CMOS readout circuits for 3D integration Possible Manufacturers: IBM (via CERN),IBM (via MOSIS), Chartered (via Equipic), Tezzaron/Chartered 3D (via CMP/CMC/MOSIS), UMC, AMS (via EUROPRACTICE), others Possible selection criteria: CMOS technology node (350nm, 250nm, 130nm, 90nm…) Full wafer access (postprocessing for 3D interconnection)  Possible via CERN (IBM) or CMP(?) Other possibility: use/modify existing chip (e.g. MEDIPIX3) 20

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Post processing and interconnection 21 Workshop in Bergamo (May 23): Contributions from: CAE LETI CMP Fraunhofer EMFT Fraunhofer IZM IMEC T-Micro VTT Plan: select process best adapted for AIDA WP3 goals within the next 6 months Maturity (service or R&D) Projection - Fine pitch, via density

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Conclusions European industry and research institutes offer various processes for 3D integration Shift form basic R&D to ‘service’ Mainly via last processing (but via middle offered by IMEC) ‘mature process’ offer rather modest pitch (vias & interconnects) Fine pitch/hight aspect ration still in R&D stage, but demonstrators being built Several R&D projects for HEP by European groups: Mainly for sLHC, ILC, super B-factories Groups outside HEP show interest (Medipix, x-ray imagers) EU funded AIDA project explicitly addresses 3D integration WP3 will be a common platform to bundle and advance the diverse 3D activities in Europe Emphasis is on heterogeneous technologies (via last), complementary to Fermilabs 3DIC 22

Hans-Günther Moser MPI für Physik TIPP 2011 Satellite Meeting on 3D Integration June 14, 2011 Europe has 3D structures, too (and much older ones) From Valerio Re – VIPS2010 in Pavia 23