MIS 1.5 Training

Day 1 Section 1 Overview and Features (30 min) Section 2 Hardware Overview (1 hour) Section 3 Internal Cabling (1 hour) Lab 1 Show and tell (30 min) Lunch Section 4 System Interfaces (1hour 30 min) Lab 2 IPMI, RMM4,(45 min)

Day 2 Section 5 Zoning (2 Hours) Lab 3 Zoning (1 Hour) Lunch Section 6 MegaRAID (1 hour 30 Min) Section 7 lsiutil (30 min) Lab 4 MegaRAID, lsiutil (1 hour) Section 7 Fan Baseboard (45 Min) Lab 4 Fan Baseboard (30 Min)

Day 3 Section 10 BIOS/Firmware Overview (Downloading and flashing) (30 min) Lab 5 Flashing BIOS (30 min) Section 11 Replacing Storbrick (video) (30 min) Lab 6 Replacing Storbrick and flashing firmware Section 12 Replacing Fan Base Video Lab 12 Replacing and flashing Fan Base Lunch Section 13 Replacing disks and flashing disks Lab 6 Replacing disk Lab 7 Replacing fan Lab 8 Replacing Power Supply

Day 4 Section 8 FRU/CRU parts (45 Min) Section 9 BIOS/Firmware Download (30 Min) Section 14 Troubleshooting

OVERVIEW AND FEATURES Day 1 Section 1

Covered in this section What is the MIS 1.5 What are the differences from MIS 1.0

What is the MIS 1.5 The MIS Server Platform features: Up to 2 server modules per platform. Two Intel® Xeon® E series processors per server motherboard, S2600JF family. Intel Turbo Boost Technology 2.0 that automatically allows processor cores to run faster than the base operating frequency, if the cores are operating below power, current, and temperature specification limits (< 35ºC ambient). Dual GbE networking onboard. Up to 8 DDR3 DIMMs (new: 8 GB, 16 GB, or 32 GB) for a single-server motherboard configuration, and up to 16 DIMMs for a dual-server motherboard configuration. Up to 6 HBAs for single servers—these can be full-height (4.25") and half-depth (3.375"), up to 4 externally facing and/or up to 4 internally facing (total external and internal not to exceed 6). For single-server platforms only, optional 4 port1 8Gb Fibre Channel PCIe cards. Up to 4 HBAs per server module (for up to a total of 8 across both server modules) in a dual server system—these can be half-height (2.12"), half-depth (3.375"), 2 internal max and/or a maximum of 2 external. Unique Battery Back-Up PCIe technology allows the optional addition of BBUs without the consumption of any of the available PCIe slots. Two boot drive modules per server, with up to two boot drives per module.

What are the differences with MIS 1.0 Midplanes and interposers replace the need for interior cables. Fewer cables maximize air flow through the unit. Higher capacity fan modules for greater cooling capability Dual server platforms with both server modules installed features hot- swappable server modules for greatly reduced service times. Support for larger capacity drives, higher memory, and faster processor speeds.

HARDWARE OVERVIEW Day 1 Section 2

Covered in this section Front and rear exterior view and Front panel Server Modules StorBrick Fan Baseboard (Fan Base)

INTERNAL CABLING Day 1 Section 3

Covered in this section Manuals HBA to SAS Interposer SAS Interposer to SAS Midplane

Cabling Diagrams are on Servinfo on the MIS 1.5 Page

HBA to SAS Interposers