MKT-TRMSM060804e August 4, 2006 Connector Solutions for Notebook PCs Technology Roadmap HIROSE ELECTRIC CO., LTD. © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved.

Page 2 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Market Trend Technology Roadmap Solutions Contents

Page 3 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. MKT-TRMSM060804e August 4, 2006 Market Trend Technology Roadmap Solutions

Page 4 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Notebook PC Long Term Forecast Market is still forecasted to show double-digit growth rates % 5% 10% 15% 20% 25% 30% 35% 40% Growth Rate Shipment Growth Rate %14%20%26% 31%24%21%14% 15% Unit: million Source: Display Search, July 2006

Page 5 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Next Gen. Processor -Trance Portable -Mobility Chipset -Outside Graphic Memory -Inside Graphic Memory Memory Wireless LAN Pentium-M Pentium-M (Banias) 130nm 400MHz FSB 1MB L2 Cache Dothan 90nm 400MHz FSB 2MB L2 Cache 2004/Q3 Dothan 90nm 533MHz FSB 2MB L2 Cache 2004/Q4 Yonah 65nm 533MHz FSB Dual CPU Core 2005/Q4 Merom /Conroe 65nm 667MHz FSB 2006/2H Gilo 45nm? 2007? Intel855PM (Montara) 400MHz FSB DDR266 /AGP 4x ICH4-M Intel855GM 400MHz FSB DDR266 /AGP 4x G(PortoraCore) ICH4-M Intel855PM 400MHz FSB DDR333 AGP 4x ICH4-M 2003/Q3 Intel855GM 400MHz FSB DDR266 /AGP 4x G(PortoraCore) ICH4-M 2003/Q3 Intel915PM (Alviso-PM) 533MHz FSB DDR2-533 PCI-Express 16x ICH6-M 2004/Q4 Intel915GM (Alviso-GM) 533MHz FSB DDR2-533 PCI-e G(DX9) ICH6-M 2004/Q4 Intel910GML (Alviso-GML) G(DX9) only ICH6-M 2004/Q4 DDR SO-DIMM Sonoma Platform Centrino Mobile Technology Northwood-M (Pen4-M) 130nm 512K L2 Hyper Threading Prescott-M 90nm 1MB L2 Hyper Threading Tejas-M 90nm 1MB L2 Grantsdale- Mobile 2003 Intel Pro/ Wireless b WPA v1/LEAP Intel Pro/ Wireless2200BG b/g WPA v1 2003/Q4 Calexico2/ Wireless2915ABG a/b/g 11i /e 2004/Q3 GOLAN /3915ABG a/b/g Mini PCI-Express 2005/Q4 NapaPlatform Calistoga Intel MHz FSB DDR2-667? (Dual Channel) PCI-Express 16x G ICH7-M 2006/Jan DDR3 KEDRON n Mini PCI-Express 2006~07 Crestine DDR2-800? DDR3? DUAL Channel DDR PCI-Express 16x ICH8-M? 2007? combined Lakeport- Mobile Santa Rosa Platform Centrino DUO Centrino Quad? DDR2 SO-DIMM /2008~ Source: Intel Mobile Platform Roadmap INTEL Roadmap

Page 6 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved Model Next Generation Notebook PC Configuration High performance is required

Page 7 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. LCD Panel Trend in Notebook PC QXGA 2048 X 1536 WUXGA 1920 X 1200 UXGA 1600 X 1200 WSXGA X 1050 SXGA X 1050 WXGA 1280 X 768 XGA 1024 X 768 SVGA 800 X 600 VGA 640 X 480 Resolution ” 11.3” 12.1” 13.3” 14.1” 15.0” 15.4”W 17”W 19”W 20”W 21”W 14.1”W 13.3”W 12.1”W 11.1”W Source: Taiwan FPD Conference (Display Search) + Hirose Research 10.6”W Size Up Higher Resolution Wide Aspect Small&Light Weight Becomes diversified

Page 8 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. What is UMPC (Ultra Mobile PC)? Microsoft: “Origami” Project, Intel: UMPC - Windows XP Tablet PC Edition Touch Panel - Weight: 0.5Kg - LCD Size: 5” to 7” - Communication: WLAN, Bluetooth, WWAN - Battery Durability: 8hrs min. - Target Price: USD500 Windows XP Windows Mobile Smartphone Pocket PC PDA Slim Notebook PC Tablet PC Notebook PC Full Spec Notebook PC (High-end PC) Mobility Full Function UMPC Expects market growth for Mobile usage, Slime, Light Weight, and Small PCs

Page 9 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. MKT-TRMSM060804e August 4, 2006 Market Trend Technology Roadmap Solutions

Page 10 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Wireless Technology Trend Several Standard in Wireless Market 2.4 GHz g 2.4 GHz 54 Mbps a 5GHz 54Mbps b 2.4GHz 11Mbps n WiMAX UWB Wireless USB WPAN WLAN WMAN Bluetooth Wireless UWB MIMO n BWA High Speed Wi-Fi a/b/g WiMAX High Speed Mobility Mobility and high speed achieve seamless wireless

Page 11 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. RF Module Trend Slim and low profile RF module will be necessary for UMPC Mini PCI Type III Card PCI Express Mini Card Ultra-Slim RF Module Down Sizing FX12 (Stack Height: 1.5mm), etc. Mini PCI Socket U.FL (Mated Height: 2.4mm Max) 5mm REF W.FL2 (Mated Height: 1.3mm Max) 2.5mm REF

Page 12 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Miniature Coaxial Connector Technology Roadmap Driving towards lower profile U.FLU.FL-LP(V) W.FL2 W.FLW.FL-LP(G)N.FL 2.3mm* [2.4MAX] 1.9mm [2.0MAX] 1.4mm [1.55 MAX] 1.18mm [1.3 MAX] 1.65mm [1.85MAX] 1.4mm [1.5 MAX]

Page 13 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Miniature RF Switch Connector Year Height (mm) MS-145 I/O & Check MS-147 I/O & Check MS-162 I/O & Check MS-151 I/O MS-151C I/O MS-156 Check MS-166 Check MS-164 I/O & Check H=6 H=3.9 H=5 H=7.3 H=2 Max H=2.5 H=1.2 Max H=1.6 Only for Checking I/O and Checking I/O Easy Lock 6GHz for Desktop MS-156NB Check H=1.6 MS-156NBS Check UnderDevelopment H=5.6 MS-150 I/O & Check Driving towards lower profile Technology Roadmap

Page 14 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved H=4mm pitch=0.5 Year Two piece mating type H=1.5mm pitch=0.5 H=1.5mm pitch=0.4 Height (mm) H=0.9mm, P H=0.9mm, Pitch=0.4 DF30 DF18 DF23 DF17 Next Generation Driving towards lower profile and narrower pitch Micro Board-to-Board Connector Technology Roadmap

Page 15 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved IC11SM4 SMT ｶｰﾄﾞﾊﾞｽﾀｲﾌﾟ 5” HDD 3.5” HDD 1.8” (Slim NotebookPC and music player) 1.8” (Slim NotebookPC and music player) Down Sizing 0.8”? 1.0”, 0.85” 2.5”HDD Surface recording density (G-bits/inch 2 ) Over 100~200Gb/inch 2 (Vertical magnetic recording) Increasing 10 times in Gb/inch 2 HDD Technology Trend Flex circuit will be needed as Interface

Page 16 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Height (mm) Year 0.5 Pitch FH17 ZIF FH18 ZIF&NON-ZIF FH23 ZIF&LIF 0.3 Pitch FH19S ZIF FH19 ZIF FH25 ZIF&ZIF H=1.8 H=1.3 H=1.25 H=0.9 World’s Smallest FH19 ZIF Off-set type FH26 ZIF&ZIF H= Pitch FH27 ZIF FH29 ZIF 0.2 Pitch Next Generation Fine Pitch FPC Connector Driving towards lower profile and narrower pitch Technology Roadmap

Page 17 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Panel Size 1.5” 2” 3” Resolution 128x x x320 Interface 16bit CPU 16bit CPU/RGB 18bit CPU/RGB LCD Panel Technology Trend LVDS interface will be necessary for UMPC LCD for Mobile Phones LCD for Notebook PCs Panel Size 12.4” 14.1” 15” Resolution XGA XGA/SXGA+ SXGA+ Pixels 1024x x768/1400x x1050 Interface LVDS(1ch) LVDS(1ch)/(2ch) LVDS(2ch) Standard Panel Size 12.1” 15.4” 17” Resolution WXGA WXGA/WXGA+ WUXGA Pixels 1280x x800/1440x x1200 Interface LVDS(1ch) LVDS(1ch)/(2ch) LVDS(2ch) Wide LCD for UMPC Panel Size 5” wide to 7” wide Resolution WVGA / WSVGA LVDS Interface is not needed under XGA, but…. Chipsets for UMPC come from Notebook PC, and need to use LVDS interface.

Page 18 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Up to and after or before Hirose Original Mini-USB USB Standard MQ172 Series ZX Series Next Generation Smaller UX Series(Normal ) 2004 UX Series(Reverse ) UX Series (Space saving Type ) Bigger Smaller Under Development Miniature I/O Connector Provides space saving solutions H=2.4, D=5.0 P=0.65 Technology Roadmap

Page 19 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved IC7 series DIP type IC11S series SMT CardBus type IC11SM4 SMT CardBus type IC13 Ultra-lightweight FPC mounting type IC14 series Micro SMT CardBus type IC8 series IC10S series IC20 series One-tier ExpressCard  IC21 series Two-tier ExpressCard  ＰＣ Card Connector Technology Roadmap ExpressCard

Page 20 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. MKT-TRMSM060804e August 4, 2006 Market Trend Technology Roadmap Solutions

Page 21 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Small PC Structure (Image) HDD Small, High Density, Slim Design, and Light Weight Miniature Coaxial RF Module Main Board Internal Antenna To External Antenna LCD RF Switch Micro Board-to-Board Port ReplicatorFPC/FFC Mini Card LCD Interface Miniature I/O ExpressCard

Page 22 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Miniature Coaxial Connector Global Standard for Radio Module Connector 6GHz Mated Height (mm) Occupied Mounting Surface (mm 2 ) N.FL Series W.FL Series U.FL Series W.FL-LP(G)-xxx W.FL-LP-xxx W.FL2-LP-xxx N.FL-LP-xxx U.FL-LP-xxx U.FL-LP(V)-xxx Lower loss Lower Profile 2.3mm* [2.4MAX] 1.9mm [2.0MAX] 1.65mm [1.85MAX] 1.4mm [1.5 MAX] 1.4mm [1.55 MAX] 1.18mm [1.3 MAX] * Mating height differs by cable size

Page 23 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Miniature Coaxial Connector Test Method Calibration Circuit Measurement Circuit Vector Network Analyzer APC3.5(f) ECAL U.FL Plug SMA adapter Cable Length=1M U.FL Plug Vector Network Analyzer APC3.5(f) SMA adapter 04N* 068N* 066J* 088K*T 062N*D Insertion Loss (dB/m) Frequency (GHz) 088N*PD U.FL Cable Assembly Insertion Loss (Typical/1M Long)

Page 24 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Miniature RF Switch Connector MS-156NB Height : 1.6mm 2.7 (Unit: mm) 6GHz MS-145NB MS-147 Height : 6mmHeight : 3.9mm MS-162 Height: 2.5mm New Product 6GHz 10GHz 6GHz MS-151NBMS-151C New Product 6GHz Interface RF Switch Checking RF Switch 3GHz

Page 25 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Micro Board-to-Board Connector With ground plate 0.5mm Pitch 1.5mm Stack Height 0.4mm Pitch 1.5mm Stack Height 0.4mm Pitch 0.9mm Stack Height 0.4mm Pitch 1.5mm Stack Height DF23 DF18 DF30 FX12

Page 26 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Micro Board-to-Board Connector High Density Board-to-Board Connector Matrix Pitch (mm) Height (mm) DF18DF23 DF12 DF29 DF DF31 FX12 FX11 FX10 Standard Type With Shield Plate Type

Page 27 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Fine Pitch FPC Connector 0.5mm Pitch0.4mm Pitch0.3mm Pitch0.2mm Pitch 1.2mm Height 1.0mm Height 1.25mm Height Short depth (3.2mm) Ultra narrow pitch 0.9mm Height FH19 FH29 FH26 FH23 FH27 1.2mm Height FH33 Short depth (2.5mm)

Page 28 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Fine Pitch FPC Connector Product series Height (mm) Pitch (mm) Contact arrangement FPC thickness (mm) Pin Variation FPC With Notch / Ear for Retention FPC side Tail side FH One side FH19S One side FH One side ,40-60 X FH Both side staggered FH Both side staggered FH Both side staggered X Fine Pitch FPC Connector Matrix

Page 29 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Mini Card MiniSD SD microSD SD Card DM3A: Standard Mount DM3B: Reverse Mount DM3C: Hinge DM1 DM2 DM3 New Product (Under Development) Card Volume (mm 3 ) MiniSD SD microSD  165  1,613 

Page 30 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved Unit: mm Small & Light Weight Design for Mobility 2-Piece Structure for Automatic Assembly IC21 ： PC Card and ExpressCard Combo Type IC20 ： ExpressCard Single Slot ExpressCard (Under Development) Assemble Main Connector Fit Main Connector with Guide Unit (IC20) (IC21)

Page 31 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. SIM Card With Card GuideSlide Lock TypeCompression ID1A ID1BID1C

Page 32 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. LCD Interface Connector Contact Pitch = 1.0mm, 30 pos. Mounting Height: 1.0mm (Standard offset) 1.1mm (Reverse offset) MDF76 SPWG ver. 3.0 Contact Pitch = 1.0mm, 8 – 30pos. Cable Type: Wires, FPC, and Micro Coaxial Mounting Height: 1.0 or 1.1 (Offset) 1.0 (Reverse) 1.65 (On Board) SPWG ver. 3.0PSWG ver. 1.2 Contact Pitch = 0.9mm, 40 and 50 pos. Mating Height: 3.5mm DF19 DF36 (Under Development) DF24 Micro Coaxial Pitch = 0.4mm, 40 pos. Mating Height: 1.5mm Vertical mating

Page 33 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Miniature I/O Connector Headset Jack I/O Connector mini USB H=2.0mm P=0.5mm, H=2.0mm P=0.4mm, P=0.4mm, H=2.4mm UX Next Generation ZX ST LX GX MQ212 (Under Development) - Robust design - Complete lock type I/O EIAJ RC5240 Standard Audio Jack

Page 34 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. Port Replicator ST Receptacle Cradle Plug (Straight) Plug Mounting Height: 3.0mm 10, 18, 24, 36 pos. (See detail for variation) Mating Cycle: 10,000 times Fully mated Removal Fully Removed EX60B Fully mated status The shutter of the receptacle rotates. Receptacle Plug Zero withdrawal force when angled. 29 pos. Cradle Plug (Right Angle)

Page 35 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. (1) Effective mating length: 1.5mm (2) Ground connection (3) Mating sequence (4) Supporting high-speed transmission PCI Express: 2.5Gbps (5) Countermeasure against flux rise (6) Self-alignment: +/- 1.2mm (w/ shutter: +/- 0.7mm) (7) Dedicated power supply contact 3A per contact (8) Mating durability: 5,000 times ＥＸ８０－※※ Ｐ Signal contact Grand pin Power supply pin ・ Detection terminal １ ０． ３ １． ５ Sig Rate :2.5Gbps Sig Level :0.5Vp-p X= １ 00 ps /div Y=100 mV/div InputOutput Metal Shell G Dimples Ground Contact Docking Connector EX80 With Shutter Type

Page 36 MKT-TRMSM060804e August 4, 2006 © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved. With Miss-Insertion Protection HRS IIP RJ45 RJ11 Standard RJ45 RJ11 Design prevents mis-mating of a RJ-11 plug into the RJ-45 jack. Model: TM2RNBV-LD Model: TM11RUX-7DNA-1028 Model: TM11RX-5A-LDNA TM2RN １ V-E88 TM18R-TO-88 TM2RN １ V-E62 Crosstalk performance: Measured with the TM11RUX-7DNA and TM21P-88P. Modular Jack (RJ45, RJ11)

All products, data, and schedule are based on current expectations and subject to change without notice. Do NOT design based on this document. Contact Hirose for the latest specifications, drawings, and availability. Company names, product names, and brands may be claimed as the property of the company. © 2006, HIROSE ELECTRIC CO., LTD. All rights reserved.