1 WG5: MPGD related Electronics Tue. Oct. 14 th 9:00 to 12:00 W. Riegler, M. Campbell, CERN 2 nd RD51 Collaboration Meeting Paris, Mon. Oct 13 th to Wed.

Slides:



Advertisements
Similar presentations
1 Summary of WG5 MPGD related Electronics Wed. Oct. 15 th, 2008 Prepared by W. Riegler, presented (and interpreted) by H. Van der Graaf 2 nd RD51 Collaboration.
Advertisements

Bulk Micromegas Our Micromegas detectors are fabricated using the Bulk technology The fabrication consists in the lamination of a steel woven mesh and.
STATUS OF MEDIPIX-3, PLANS FOR TIMEPIX-2 X. Llopart.
Front-end electronics for Time Projection Chamber I.Konorov Outlook:  TPC requirements  TPC readout options  Options for TPC FE chips  Prototype TPC.
Timepix Studies: Medipix Collaboration Summary and More Timewalk Plots Alessandra Borgia Marina Artuso Syracuse University Group Meeting – Thursday 20.
Timepix2 power pulsing and future developments X. Llopart 17 th March 2011.
MEDIPIX3 TESTING STATUS R. Ballabriga and X. Llopart.
Status ‘Si readout’ TPC at NIKHEF NIKHEFAuke-Pieter Colijn Alessandro Fornaini Harry van der Graaf Peter Kluit Jan Timmermans Jan Visschers Saclay CEA.
Data is sent to PC. Development of Front-End Electronics for time projection chamber (TPC) Introduction Our purpose is development of front-end electronics.
Erik HEIJNE CERN PH DepartmentRADWORKSHOP 29 November 2005 MEDIPIX2 for VERY LOW DOSE INITIAL LHC BENCHMARKING MEDIPIX2 for VERY LOW DOSE INITIAL LHC BENCHMARKING.
The design of the TimePix chip Xavier Llopart, CERN MPI-Munich, October 2006.
K. Miuchi June 11, 2009 CYGNUS 09 NEWAGE electronics upgrade & QPIX Kentaro Miuchi (Kyoto University) with A. Sugiyama (Saga University) M. Tanaka (KEK),
HallA/SBS – Front Tracker PARAMETERDESIGN VALUE Microstrip Silicon Detector Number of tiles/plane and size2 Number of planes2 Size of the single
An Integrated Single Electron Readout System for the TESLA TPC Ton Boerkamp Alessandro Fornaini Wim Gotink Harry van der Graaf Dimitri John Joop Rovekamp.
The detection of single electrons using the MediPix2/Micromegas assembly as direct pixel segmented anode NIKHEF: A. Fornaini, H. van der Graaf, P. Kluit,
Pixel Readout Electronics - from HEP to imaging to HEP… Status, requirements, new ideas M. Campbell, R. Ballabriga, E. Heijne, X. Llopart, L. Tlustos,
Power Pulsing in Timepix3 X. Llopart CLIC Workshop, January
1 Readout of a TPC by Means of the MediPix CMOS Pixel Sensor NIKHEFAuke-Pieter Colijn Arno Aarts Alessandro Fornaini Maximilien Chefdeville Harry van der.
Development of the Readout ASIC for Muon Chambers E. Atkin, I. Bulbalkov, A. Voronin, V. Ivanov, P. Ivanov, E. Malankin, D. Normanov, V. Samsonov, V. Shumikhin,
65 nm CMOS analog front-end for pixel detectors at the HL-LHC
1 Update on Silicon Pixel Readout for a TPC at NIKHEF LCWS08 - Chicago 19 Nov 2008 Jan Timmermans NIKHEF.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
1 Status ‘Si readout’ TPC at NIKHEF NIKHEFMaximilien Chefdeville Auke-Pieter Colijn Alessandro Fornaini Harry van der Graaf Peter Kluit Jan Timmermans.
ILC Calorimetry Test Beam Status Lei Xia ANL HEP.
1 TimePix-2 a new and fast general-purpose MPGD readout pixel chip Jan Timmermans, Nikhef MPGD/RD-51 Workshop Nikhef, Amsterdam The Netherlands April 16,
Status of the n-XYTER testing Knut Solvag, Gerd Modzel, Christian Schmidt, Markus Höhl, Andrea Brogna, Ullrich Trunk, Hans-Kristian Soltveit CBM.
BeamCal Electronics Status FCAL Collaboration Meeting LAL-Orsay, October 5 th, 2007 Gunther Haller, Dietrich Freytag, Martin Breidenbach and Angel Abusleme.
Tracking in a TPC D. Karlen / U. Victoria & TRIUMF for the LCTPC collaboration.
-1-CERN (11/24/2010)P. Valerio Noise performances of MAPS and Hybrid Detector technology Pierpaolo Valerio.
11 October 2002Paul Dauncey - CDR Introduction1 CDR Introduction and Overview Paul Dauncey Imperial College London.
IEEE/NSS Oct 22, Electron Counting and Energy Resolution Study from X-ray conversion in Argon Mixtures with an InGrid-TimePix detector. D. ATTIÉ.
Eleuterio SpiritiILC Vertex Workshop, April On pixel sparsification architecture in 130nm STM technology ILC Vertex Workshop April 2008 Villa.
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
5 May 2006Paul Dauncey1 The ILC, CALICE and the ECAL Paul Dauncey Imperial College London.
VMM Update Front End ASIC for the ATLAS Muon Upgrade V. Polychronakos BNL RD51 - V. Polychronakos, BNL10/15/131.
The digital TPC: the ultimate resolution P. Colas GridPix: integrated Timepix chips with a Micromegas mesh.
Development of a Front-end Pixel Chip for Readout of Micro-Pattern Gas Detectors. Vladimir Gromov, Ruud Kluit, Harry van der Graaf. NIKHEF, Amsterdam,
CERN PH MIC group P. Jarron 07 November 06 GIGATRACKER Meeting Gigatracker Front end based on ultra fast NINO circuit P. Jarron, G. Anelli, F. Anghinolfi,
R. Kluit Nikhef Amsterdam R. Kluit Nikhef Amsterdam Gossopo3 3 rd Prototype of a front-end chip for 3D MPGD 1/27/20091GOSSIPPO3 prototype.
Update on works with SiPMs at Pisa Matteo Morrocchi.
TIMEPIX2 FE STUDIES X. Llopart. Summary of work done During summer I have been looking at a possible front end for Timepix2 The baseline schematic is.
Timepix in EUDet – CERN contribution Michael Campbell PH Department CERN Geneva, Switzerland Spokesman, Medipix2 Collaboration.
Technical status of the Gossipo-3 : starting point for the design of the Timepix-2 March 10, Vladimir Gromov NIKHEF, Amsterdam, the Netherlands.
NEWS FROM MEDIPIX3 MEASUREMENTS AND IMPACT ON TIMEPIX2 X. Llopart CERN.
Pixel structure in Timepix2 : practical limitations June 15, Vladimir Gromov NIKHEF, Amsterdam, the Netherlands.
Overview of TPC Front-end electronics I.Konorov Outline:  TPC prototype development  Readout scheme of the final TPC detector and further developments.
C.Beigbeder, D.Breton, M.El Berni, J.Maalmi, V.Tocut – LAL/In2p3/CNRS L.Leterrier, S. Drouet - LPC/In2p3/CNRS P. Vallerand - GANIL/CNRS/CEA SuperB -Collaboration.
Pixel Sensors for the Mu3e Detector Dirk Wiedner on behalf of Mu3e February Dirk Wiedner PSI 2/15.
Trigger & Tracking detector for CMS
Technology and R&D Summary and next steps Burkhard Schmidt.
A Low-noise Front-end ASIC design based on TOT technique for Read-out of Micro-Pattern Gas Detectors Huaishen Li, Na Wang, Wei Lai, Xiaoshan Jiang 1 State.
R. Kluit Nikhef Amsterdam R. Kluit Nikhef Amsterdam Gossipo3 3 rd Prototype of a front-end chip for 3D MPGD 1/27/20091GOSSIPO3 prototype.
DCH FEE STATUS Level 1 Triggered Data Flow FEE Implementation &
ALICE INDUSTRIAL AWARD for its collaboration to the ALTRO Chip
A General Purpose Charge Readout Chip for TPC Applications
Charge sensitive amplifier
LHC1 & COOP September 1995 Report
INFN Pavia and University of Bergamo
SiD Calorimeter R&D Collaboration
DCH FEE 28 chs DCH prototype FEE &
L. Ratti, M. Manghisoni Università degli Studi di Pavia INFN Pavia
A Fast Binary Front - End using a Novel Current-Mode Technique
Status of n-XYTER read-out chain at GSI
BESIII EMC electronics
TPC chamber for Medipix2/TimePix
Commissioning of the ALICE-PHOS trigger
Pre-installation Tests of the LHCb Muon Chambers
Backgrounds using v7 Mask in 9 Si Layers at a Muon Higgs Factory
The LHCb Front-end Electronics System Status and Future Development
Presentation transcript:

1 WG5: MPGD related Electronics Tue. Oct. 14 th 9:00 to 12:00 W. Riegler, M. Campbell, CERN 2 nd RD51 Collaboration Meeting Paris, Mon. Oct 13 th to Wed. Oct. 15 th

2 Agenda 09:00IntroductionWerner Riegler 09:20Experience with the design and submission of the Medipix3 pixel readout chip in 0.13 um CMOS Xavier Llopart 09:40TimePix-2: general purpose applications and requirements NIKHEF 10:00GEM Amplifier Shaper Tracking ON EventsAntonio Ranieri 10:30CoffeeAll 10:50Electronics developments for a Micromegas-based digital Hadron Calorimeter Renaud Gaglione 11:10The SLAC KPiX Chip for ILC Digital Hadron Calorimetry Andy White 11:30The MIMAC AsicJean Pierre Richter, Germain Bosson 11:50Contribution to the development of portable multichannel systems for detector studies Jose Toledo

3 TASK 1 Definition of front ‐ end electronics requirements for MPGDs TASK 2 Development of general ‐ purpose pixel chip for active anode readout TASK 3 Development of large ‐ area detectors with pixel readout TASK 4 Development of portable multichannel systems for detector studies Working Group 5, Tasks

4 Task1: Definition of front ‐ end electronics requirements for MPGDs The idea of this task is the development of common front-end requirements for MPGDs. The necessary prerequisite for this task is a detailed understanding of MPGD signals as well as a common language for electronics parameters (e.g. ENC, Shaping time, Peaking Time etc.) 2nd edition of “Particle Detection with Drift Chambers” contains now 100 pages on Signal Theorems and Frontend Electronics Discussion.

5 Task1: Definition of front ‐ end electronics requirements for MPGDs A survey of existing frontends and it’s specifications and applicability should be carried out. Questions of the following Nature should be discussed: E.g. The ATLAS Muon System Cathode Strip Chambers (Multi Wire Proportional Chambers) use and analog pipeline (SCA) for storing the charge before digitization is necessary, because an ADC sampling at 40MHz is excluded due to Power Consumption Constraints. Do present ADCs have a power consumption that allows continuous digitization ? Using a Micro Pattern Gas Detector for this application, would a simple Time Over Threshold Measurement be sufficient to do the Job ? More General: Are time over threshold measurements for charge measurement sufficient for MPGD tracking applications. Many of the MPGD specification questions can be carried out by Simulations.

6 Task1: Definition of front ‐ end electronics requirements for MPGDs Our goal is a report with these issues within a few months time. We have to get organized and work on it … An outline of the report will be circulated soon among the Persons/Institutes that indicated interest in this task (WG5: Task1) such that we can define who does what.

7 Task2: Development of general ‐ purpose pixel chip for active anode readout Pixel Chips like Medipix in conjunction with MPGDs have opened a completely new window of applications. Further development of this technique is essential …

8 Task2: Development of general ‐ purpose pixel chip for active anode readout Limitations of Timepix: Chip architecture originally designed for imaging is used for single (or sparse multiple) event readout Non triggerable Full frame readout only Either arrival time OR amplitude information Biggish pixels cf CCD’s etc

9 Task2: Development of general ‐ purpose pixel chip for active anode readout Successor of Timepix e.g. “Timing and Tracking Pixel (TTPix)”): Front end Simple preamp - no charge summing ( ≠ MEDIPIX3) Noise <100e- rms(~MEDIPIX3) Positive and negative input charges (=MEDIPIX3) Up to 5-10nA per pixel leakage current compensation (=MEDIPIX3) Discriminator Single threshold with ?X?-bit tuning (=MEDIPIX3) Threshold variation < noise(=MEDIPIX3) Power consumption In the region of uW/pixel (<MEDIPIX3, no charge sum)

10 Task2: Development of general ‐ purpose pixel chip for active anode readout Start Stop Preset PRESETTABLE COUNTER PRESET LATCH Hit Trigger (Shutter) D Carry Preamp Out VTH ToT (clk) Arrival Time (fine) Rst Count Compatible with TPC and tracker applications Possible Pixel Architecture

11 Task2: Development of general ‐ purpose pixel chip for active anode readout Readout: Externally Triggerable Fast OR Signal Sparse data only (address sent, =zero suppression) Continuous R/W i.e. continuous sensitivity No event counting mode

12 Task2: Development of general ‐ purpose pixel chip for active anode readout Summary: Technical specs are converging Significant detailed design effort still needed Some questions remain Behaviour of fine timestamp measurement circuit over large matrix Is ToT useful for timewalk correction?

13 Task2: Development of general ‐ purpose pixel chip for active anode readout Organizational Matters: 0.13um CMOS runs are expensive, 0.5MSfr/run. Assuming two runs we have a cost of 1MSfr ‘just’ for production, no manpower etc. counted yet. With 50kSfr from “here and there” this will not be possible within RD51. Good news: 1) Common spec for silicon application and gas detector application seems possible. 2) Medipix consortium is interested to contribute with experienced manpower and money, but timescale may be an issue (not immediately … MPIX3 …) Important Questions: How to organise efficiently a coherent design team across different countries ? Intellectual Property needs to be clearly defined in ase of commercial interest. Medipix3 readout hardware and software system may be inappropriate. Project Management – Consortium agreement is needed (MPix3 or other).

14 Task2: Development of general ‐ purpose pixel chip for active anode readout How to proceed: Collaboration with MPIX3 consortium is essential and we have to make an effort to convince them that this is of interest to them. Final definition of Specifications and technical design work can go ahead. All interested parties should meet, possible around MPIX3 workshop end of Nov at CERN, in order to define financial and organizational aspects – to be organized.

15 Task3: Development of large ‐ area detectors with pixel readout

16 Task4: Development of portable multichannel systems for detector studies Development on such a system based on the VFAT chip (TOTEM) is ongoing (see presentation)