WYMAN GORDON ROCHESTER INSTITUTE OF TECHNOLOGY Multi-Disciplinary Senior Design Team KEVIN CONWAY (ME, Lead Engineer) MARK GONZALEZ (ME) ROBERT HAGEN (EE) JOE MAJKOWSKI (EE) JORGE VIANA (ISE, Project Manager) FORGING LOCATOR DETAILED DESIGN REVIEW

OUTLINE I.Introduction of Wyman-Gordon i.Forging Process ii.Manufacturing Environment iii.Customer Necessity & Requirements II.Detailed Design – Electrical Feasibility i.Sensors and System Orientation ii.Processing System Design iii.Data Logging System Design iv.Electrical Display Design III.Detailed Design – Mechanical Feasibility i.Sensor System Bracket Design ii.Sensor Enclosure Design iii.Display Design

OUTLINE (continued) IV.Bill of Materials i.Mechanical Sub-Systems a.Sensor System Bracket b.Sensor Enclosure c.Display Enclosure ii.Electrical Sub-Systems a.Sensors b.Processing System c.Data Logging System d.Electrical Display V.Risk Assessment VI.Schedule

WYMAN-GORDON Global leader in manufacturing of titanium, steel and nickel–based forgings. 50,000 ton press National Historic Mechanical Landmark 3 Primary Markets  Aerospace ( Landing Gear/ Airframe structures)  Energy (Various Turbine Engines and components)  Military (Airframe structures / Vehicle Armor)

1. Billets are heated to 1700 ⁰ F-2100 ⁰ F. 2. Dyes are lubricated with graphite based lubricant (sometimes a non-stick paper). 3. Forklifts transfer the hot billets from the oven to the dye. 4. Workers with crowbars have roughly 60 seconds to position the hot forging within the dye. 5. The operator gets the go-ahead from the workers, the press closes and the billet is forged. 6. The press opens, workers blast the dye with compressed air clearing the debris into the exhaust fans. 7. The forged billet is removed and the process starts all over again. FORGING PROCESS

 Hot Dyes < 900 o F Billets < 2100 o F  Flames and Smoke Graphite based lubricant ignites  Flying Debris Debris is blown out of the dye using compressed air Debris is sucked into the exhaust fans  Dirty and Dusty Dust had encapsulated the entire forging building due to the grinders  High impact Large forklifts Worker with crowbars ENVIRONMENT

Problem: Current Billet Positioning Technique: Visual Judgment = Art Form Majority of the workforce is getting ready to retire. Lack of a medium for knowledge transfer Process is currently less systematic Leads to $1M in scrap and rework Solution: Sensor Positioning System CUSTOMER NECESSITY

 Position the billet within ” of a predetermined position within the dye.  Communicate:  Position relative to the ideal position  Necessary corrections  Catalog position electronically in reference to the part and job number.  Withstand the harsh environment.  Minimal physical and visual interference with operators and forklift drivers  Dynamic/real time feedback throughout process CUSTOMER REQUIREMENTS

SYSTEM LAYOUT 3 Major Components  Computer  Lasers  Display Computer will be used for data storage and laser interface Laser will be used in order to interface with display

 Time of flight sensor  Data acquisition and interface software available  RS232 or RS422 serial interfaces  Has been utilized on measuring red hot materials.  Class 2 laser (No eye protection) Red 650 nm output  Alarm function to supply up to half an amp  Can reference measurement from any point  Measuring Range Black Material.4m - 17m  Resolution.1mm  Repeatability less than.5 mm  Linearity ±2mm (+15°C … +30°C), ±5mm (+30°C … +50°C) OPTONCDT ILR1181 LASER DISTANCE SENSOR

 Sends out a laser pulse and measures time to receive the beam back.  Theoretically the infrared pulse will have more power than the noise floor making it visible to the sensor.  Word of mouth that this has worked on materials emitting infrared noise  Test plan has been produced to confirm accuracy of laser on heated pieces of material. TIME OF FLIGHT SENSOR

PROGRAM INTERFACE

PROGRAM INTERFACE (CONTINUED)

DATA ACQUISITION Data exported into column format in excel. File name/path specified in program 3 values exported  Time  Distance  Error

 Set each alarm to trigger High when box is within spec or too close to the sensor  High = 24V Low = 16V  Alarm zones will intersect to within spec (Red zone)  When inside the tolerance zone all four alarms are logical high, triggering green light indication  When outside tolerance triggers respective arrow circuit with low signal LOGIC SETUP outside zone Piece Logical high for each High Low

 When an alarm line is low, circuitry in respective arrow is triggered turning on red LEDs (indicating direction needed to move)  All alarms lines being high, triggers green LED circuitry to turn on center circle giving the go ahead to operators  2 different types of circuit boards needed DISPLAY

ARROW CIRCUIT SIMULATION  Ground is the signal line  When high circuit essential an open(no current flow)  When low, voltage differential of 8V creates current flow of 8.546mA  LEDs have maximum rating of 10mA  LEDs will not be supplied to much current and will turn on

CIRCLE CIRCUIT SIMULATION  All inputs high, no current to diodes, Power BJT is on which allows current to flow through the BJT and the LED's to draw power  9 Green Diodes, max rating of 20 mA  Resistors set to 330 ohms to limit current.

CIRCLE CIRCUIT SIMULATION  All inputs are low. Current drawn for LEDs is minimal at 30pA.

CIRCLE CIRCUIT SIMULATION  Worst case only one input is low.  Circuit still draws small current of 56.6pA  LEDs should not glow with this current.

DISPLAY CIRCUIT PCB BottomTop Silk Screen

WIRING HARNESS  RS-422 uses 24/4 shielded wire  Other connections 244AWG

MECHANICAL DESIGN

Protective housing for Sigma-Epsilon Sensors Thermal insulation is primary function Die Temp °F High temperature insulation for use in fire protection Aluminum Housing 1/8” thick sheet top ¼” Al Block bottom support Weight: 9.5 lbs. External Port for Sensor Harness View hole for Sensor Optics Air Purge System Increase visibility of line-of-sight to environment Additional cooling of sensor (secondary function) ENCLOSURE

Determine the necessary thermal conductivity (k-factor) of the insulation (0.875” thk) to provide acceptable operating temperatures for the sensor (50°C) Radiation dominated heat transfer problem Assumptions: q rad = q conv The bulk temperature for convection was 900 °F (773 K) h = 15 W/m 2 *K (free convection of air) Excluded Forced convection within box Aluminum outer case 0.125” thick ( m) ɛ = 0.18, k = 218 W/m*K Area = in 2 ( m 2 ) 0.875” thk, k = W/m*K (0.067 Btu/h-ft-F ) Chosen Material: 427 °C (900 °F) : W/m*K ENCLOSURE

Provides Horizontal and Vertical Motion Allows sensors to view distinct billet geometries Aluminum/Steel Build Al blocks, Al Square Tubing, Steel Blocks Weight: 24 lbs. Horizontal Travel Steel Rail Guide (double track T-slot) Supports Enclosure & Vertical Adjustment Fixed w/ Set screw to Rail. Vertical Adjustment (Telescoping Bars) 5” Adjustable Height Height Maintained w/ Set screw (0.375”) Die Measuring Configuration Sensor w/o Telescoping feature Located lower (rests on Steel Rail Guide) ENCLOSURE SUPPORT

Exploded View Die Measuring Configuration ENCLOSURE SUPPORT (CONTINUED)

Find necessary pressure applied from set screw to hold sensor up Basic Static Problem w/ friction Parameters Weight: lbs. Friction coefficient (Al –Al dry): 1.05 Area of contact( minimal): in 2 Results The Set-screws require a maximum of 5.2 psi of pressure to maintain static equilibrium SET SCREW ANALYSIS

Rests on Shoe of Die Press Provides horizontal motion to all sensors Length: 4 ft. Aluminum/Steel Build Al Sheet, Al Square Tubing, Steel Block Weight w/o sensors: 43lbs. ( 88 lbs. in configure shown) Magnetic Feet Attachment (not shown) Prevents movement before/during/after press processing Maintains location for accurate readings RAIL SUPPORT SYSTEM

MAGNET HOLD DOWN SUPPORT

Static Analysis Determine if Rail system can support weight of sensors Results Maximum Stress : 123 psi on guide rail (compressive yield stress = 36ksi) Maximum Strain: microns/in STRUCTURE ANALYSIS

DISPLAY ENCLOSURE

AIR PURGE SYSTEM

TEST AND ASSEMBLY PLANS

OSHA REQUIREMENTS  ILR Time of Flight Sensor manufactured by Mirco- Epsilon  Class II Laser: described as a low-power visible laser that emits above Class I levels but at a radiant power not above 1 mW.  Human aversion reaction to bright light will protect a person  Accident data on laser usage have shown that Class II lasers are normally not considered hazardous from a radiation standpoint unless illogically used.  Direct exposure on the eye by a beam of laser light should always be avoided with any laser, no matter how low the power.  Sensor will be enclosed, so no protection will be needed.  More information:

SUMMARY OF HAZARDS  UV and Near-Infrared (NIR) wavelength ranges do not apply to Class II Lasers.  VIS (Visible) wavelength ranges do apply to Class II Lasers.  NO fire or diffuse ocular hazards.  Direct ocular hazards will occur only after 0.25 seconds of being exposed.

BILL OF MATERIAL (BOM)  Divided in 3 sections: Electrical, Mechanical and Supplementary Parts.  Consists of Part Description, Part Number, Manufacturer, Vendor, Unit Price, Quantity, Price, Lead Time, and Link.  Most vendors authorized by RIT.  Biggest Expense: TOF Sensor by Micro-Epsilon at $1,840 each ($11,040 total).  Initial Budget of $15,000, flexible according to needs.  Total expenses with a 5% Contingency on the Total Price: $19,300

RISK ASSESSMENT

MAJOR RISKS  Lead Times  Sensors not being adequate for customer needs.  Components not interfacing.  Miscommunication with customer.  Failures due to temperature or interference.  Exposure to Water.  Tolerances are not met.  The equipment is not deployable at location.

MILESTONES -Senior Design Review (Week 5-MSD I) -Detailed Design Review (Week 10-MSD I) -Present BOM to Wyman Gordon (Week 10-MSD I) -Testing TOF Sensor (Week 11-MSD I) -Purchase Requisitions (Week 1-Week 3 MSD II) à Once Budget is approved. -Building, Testing and Incorporation of System (Week 4 to Week 8-MSD II) -Imagine RIT Presentation (Saturday May 5th, 2012) -Project Review Presentation, Poster Session., and Technical Paper (Week 10-MSD II) -Visit Wyman Gordon for Installation of System ( Week 10- MSD II) -Final Project Management Review + Uploading of all documentation (Week 11-MSD II).