AIDA FEE64 production report June 2011 LYCCA tests and MBS Production of FEE64 Preparation for October test. 13th June 20111.

Slides:

Advertisements

Similar presentations

For(int i = 1; i

Advertisements

AIDA Update presented by Ian Lazarus on behalf of the AIDA collaboration (Edinburgh – Liverpool – STFC DL & RAL) Tom Davinson School of Physics & Astronomy.

Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.

Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI1 Si-FMD status Forward Detector meeting, CERN, 11 March 2003 Børge Svane Nielsen Niels Bohr.

Workshop on Silicon Detector Systems, April at GSI Darmstadt 1 STAR silicon tracking detectors SVT and SSD.

Dec 11, 2001E. Hazen -- ATLAS Muon Electronics1 ATLAS MDT Electronics On-Chamber CSM Adapter Proposed Features: –Mounts on CSM Motherboard just like the.

Mechanical Status of ECAL Marc Anduze – 30/10/06.

Instrument Engineering ARCS Review Engineering Design Ralph Niemann Don Ghilardi Robb Williams.

P07302 Summary Motor Controller Module. Team Members.

ACORDE FOR TPC TEST Status report. Top Modules Bottom Modules.

SPD general meeting Pixel bus and Pilot MCM Integration CERN October 8, 2002.

3/5/2007(c) 2007 UEI Inc.1 Design Review United Electronic Industries DNR-12 -3U 12 DNA Rack With CPU/NIC Enclosure.

Engineer Training Mechanical Overview. Engineer Training Confidential 2 XL1500 is both Roll-to-Roll and Roll-to-Sheet Printer MachineXL1500-2mXL1500-3mXL1500-5m.

New AS-i Profinet Gateway AC1401 and AC1402. Date: October 2010© VNC sr/rk Main features of the Gateway  WEB server for remote configuration and diagnosis.

1PPS Timing and Reference Distribution Subsystem Wes Grammer NRAO March 15-17, 2012EOVSA Preliminary Design Review1.

Mounting guide of G40 Camera VIDO Electronic Vertriebs GmbH.

Pixel Upgrade Plans ROD/BOC PRR July 17, 2013 T. Flick University of Wuppertal.

VELO workshop, Amsterdam, april ‘00M.Ferro-Luzzi Difficulties with current mechanical design recent FEA results: to obtain sufficient stiffness of center.

ALICE Si-FMD,T0,V0 26/ Jens Jørgen Gaardhøje, NBI, Si-FMD oUpdate on Status oConceptual design of FEE and BEE-DAQ chain oTimetable.

Building a PC. Motherboard Selection Ensure the selected motherboard is appropriate for the processor model and frequency you are planning to use AMD.

AIDA FEE64 development report August 2010 Progress after Texas CAD work Manufacturing 25th August

FEE + ROC cooling S. Popescu CERN, U. Frankenfeld, H.R. Schmidt GSI.

Applied Systems News FWEC*A Rudolf BARET HEISSIG.

Treston Hardin. Motherboard A motherboard holds all of the important components to power the computer.

Update on the HBD Craig Woody BNL DC Meeting June 8, 2005.

11th March 2008AIDA FEE Report1 AIDA Front end electronics Report February 2008.

AIDA 1 Mezzanine board Contacts for underside connectors Thermal contact pads.

RP detectors CTS Sensors now in production, full delivery between February and June 07 Production GUI and DB being finalised Test Procedure being defined.

Status report on the development of a readout system based on the SALTRO-16 chip Leif Jönsson Lund University LCTPC Collaboration Meeting

1 J.M. Heuser – CBM Silicon Tracking System Roadmap for the development of STS module demonstrators Concept Common interfaces/dimensions Some technical.

-Proprietary and Confidential-

Design and Detailed Plan for In Vacuum Diamond Sensor for PHIL and ATF2 S. Liu, P. Bambade, F. Bogard, P. Cornebise, I. Khvastnov, H. Monard, C. Sylvia.

Possible types of module Si/W CALORIMETER CONCEPT Si/W CALORIMETER CONCEPT G.Bashindzhagyan Moscow State University June 2002 Internal structure (not in.

Summary of RIKEN visit. Chamber Top plate Bottom plate Middle cylinder.

FE electronic box Construction of end piece OT module Electronic components Mechanics Cooling.

TPC electronics Status, Plans, Needs Marcus Larwill April

Georgina Harris 11 th October nd SKADS Workshop – Observatoire de Paris 2-PAD Infrastructure Georgina Harris SKADS System Design and Team Leader.

APAR LRU Brick Mechanical Design EOL APAR Team (Jim Ranson – EOL Design and Fabrication Services presenting) EOL APAR Advisory Panel March 2015.

Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/23/20102electro-mechanical.

DON LYNCH NOVEMBER 6, AGENDA November 4, BABAR Magnet Update Global Design Concept – Update Outer HCal Structural Analysis (2 nd pass) sPHENIX.

AIDA 1 20 Heatsink units, locating pins and washers now on site. Status of Electronics Module.

SPHENIX MECHANICAL D. Lynch September 11, AGENDA Global Design Concept – Updated Global Assembly Concept – Updated Inner HCal Installation concept.

Status report on the development of a TPC readout system based on the SALTRO-16 chip and some thoughts about the next step Leif Jönsson AIDA Meeting Vienna.

T2 Status Report IP5 Installation Future plans. IP5 installation The mechanical structure has shown problems on installation and should be changed slightly.

AIDA 1 Mezzanine board Resistors and capacitors near the ASiCs have now been relocated to the underside of the PCB. Cooling pads have been extended.

2 Wire Door Entry System (DES of MH BT offer)

D. Attié, P. Colas, K. Fujii,T. Matsuda, M. Riallot, A. Sugiyama, W. Wang Thanks to M. Dixit, Yun-Ha Shin, S. Turnbull,Yulan Li Construction and tests.

TPC FEE status and more TUM Physics Department E18 I.Konorov.

FP420 Hybrid Mechanical Design Ray Thompson / Manchester Manchester Xmas O7 Ray Thompson Julian Freestone, Andy Elvin.

Baby MIND Module Cabling Options 27 th January 2016 F. Cadoux, Y. Favre, L. Nicola, E. Noah.

SPHENIX Mechanical Don Lynch & Rich Ruggiero April 10, 2014.

Chiho Wang ATLAS TRT Duke University Dubna, May Barrel integration status May 24, 2005.

Rosier Ph. – IPNO – Detector Dpt. – 30/10/2012GASPARD Padova meeting 1/13 Mechanical engineering for GASPARD Unité mixte de recherche CNRS-IN2P3 Université.

n-XYTER Hybrid Developments

Status of GASPARD mechanics

Gaspard-Hyde-Trace workshop 2015

Mechanics for front-end Electronics Of T2K-II TPCs – A Few Conceptual Ideas D. Calvet, Irfu, CEA Saclay, Gif sur Yvette Cedex, FRANCE.

Status of the AGATA installation at GANIL

HB RM prototype component status

FEE Electronics progress

MicroMegas Mechanical Meeting --- Cern April 2014

Radiation-safe area for electronics, or laser or

New Calorimeter Trigger Receiver Card (U. Wisconsin)

بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه

FEE Electronics progress

Color Touch Screen Display

Cut out for cable 160 ISO-F Flange Electronics module and cooling

Status of Electronics Module

I have… I have… Who has 3:40? Who has 12:20? I have… I have…

Presentation transcript:

AIDA FEE64 production report June 2011 LYCCA tests and MBS Production of FEE64 Preparation for October test. 13th June 20111

LYCCA test and MBS A single FEE64 card with mezzanine was mounted on the central aluminium support and along with top cooling plate was plugged via the LYCCA adaptors into a LYCCA silicon detector in the LYCCA chamber at GSI. The cooling was provided by a fan and aluminium cooling blocks. The MBS interface was used, successfully, to integrate data with the MBS system. 13th June 20112

Production of FEE64 Electronics testing is proceeding. Cooling pads for the AIDA modules are being manufactured. A modified set of pads has been ordered. Mechanical parts for the modules are in stock. 13th June 20113

Preparation for the October test 6 th June, meeting to discuss installation of a system inT4 that will be shipped to GSI for the October experiment. Designing the MACB to integrate the 12 FEE64 cards ( 6 modules ) into a system. Problem with HDMI connection. 13th June 20114